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| Number | Title | Issue Date |
| 7439548 | Surface mountable chip A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surfac... | 10/21/2008 |
| 7436002 | Surface-mountable radiation-emitting component A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip. ... | 10/14/2008 |
| 7427524 | Optoelectronic device packaging assemblies and methods of making the same Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. T... | 09/23/2008 |
| 7427804 | Optoelectronic semiconductor device and light signal input/output device A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/output through-hole being not for... | 09/23/2008 |
| 7411225 | Light source apparatus A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well... | 08/12/2008 |
| 7394109 | LED lighting device An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative con... | 07/01/2008 |
| 7335922 | Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced... | 02/26/2008 |
| 7335522 | Package structure for light emitting diode and method thereof A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer... | 02/26/2008 |
| 7335926 | Package structure for light emitting diode and method thereof A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer... | 02/26/2008 |
| 7317199 | Circuit device To provide a circuit device suitable for incorporating a semiconductor element emitting or receiving short-wavelength light. The circuit device includes a casing, a semiconductor element, and a cover portion. The casing has an opening on the top face thereof. The se... | 01/08/2008 |
| 7288796 | Light emitting diode light source A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is util... | 10/30/2007 |
| 7285803 | Light-emitting diode lamp having a terminal portion with a notch portion A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up ... | 10/23/2007 |
| 7276740 | Submount for light emitting device A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the fir... | 10/02/2007 |
| 7276782 | Package structure for semiconductor A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deform... | 10/02/2007 |
| 7253447 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base ... | 08/07/2007 |
| 7247514 | Semiconductor device and method for producing the same A method for producing a semiconductor device of the present invention includes forming a surface electrode on a semiconductor element, forming a solder layer by plating on one principal surface of the surface electrode, mounting the semiconductor element on the sub... | 07/24/2007 |
| 7242028 | Light emitting diode light source A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is util... | 07/10/2007 |
| 7227194 | Semiconductor light emitting device A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shape... | 06/05/2007 |
| 7224047 | Semiconductor device package with reduced leakage A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at... | 05/29/2007 |
| 7220607 | Method of manufacturing a semiconductor device In a lead frame, through holes are formed outside suspending leads and trenches are formed on a back surface along the suspending leads so as to communicate with the through holes. When sealing resin is injected into cavities of a resin molding die, air enters the t... | 05/22/2007 |
| 7208772 | High power light emitting diode package The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial ... | 04/24/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7183587 | Solid metal block mounting substrates for semiconductor light emitting devices A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first an... | 02/27/2007 |
| 7161186 | Sideway-emission light emitting diode A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the receiv... | 01/09/2007 |
| 7151281 | Light-emitting diode structure with electrostatic discharge protection A light-emitting diode (LED) structure with electrostatic discharge (ESD) protection is described. The LED includes a substrate, a patterned semiconductor layer, a first electrode and a second electrode. The patterned semiconductor layer is disposed over the substra... | 12/19/2006 |
| 7125734 | Increased light extraction from a nitride LED In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is remo... | 10/24/2006 |
| 7112457 | Method of manufacturing an opto-coupler A method of manufacturing an opto-coupler includes disposing an insulating layer on a first die and disposing an isolation layer on the insulating layer. The method further includes disposing a securing layer on the isolation layer and disposing a second die on the ... | 09/26/2006 |
| 7105858 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 09/12/2006 |
| 7098486 | Light source assembly having high-performance heat dissipation means A light source assembly includes a vapor chamber, which has an electrical circuit installed in the top surface, an insulation layer covered in between the top surface of the vapor chamber and the electrical circuit, and light emitting diodes installed in the top sur... | 08/29/2006 |
| 7081645 | SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external h... | 07/25/2006 |
| 7078729 | Semiconductor device and method of manufacturing the same A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operat... | 07/18/2006 |
| 6680490 | Light-emitting device After a light-emitting element exhibiting an emission peak wavelength in a wavelength range of not longer than 500 nm is mounted into a cup-like portion of a base member, the cup-like portion is filled with epoxy group-containing silicone rubber. An aroma... | 01/20/2004 |
| 6680568 | Light source A light emitting device effectively utilizes the light emanating from a semiconductor luminous element, and can acquire clear and high-luminance light emission without a color dapple. The light emitting device is configured as follows. A transparent resin... | 01/20/2004 |
| 6670648 | Semiconductor light-emitting device having a reflective case A semiconductor light-emitting device has a semiconductor light-emitting element 3 mounted on an electrode 2 formed on a surface of an insulating substrate 1, and has a reflective case 5 provided on the insulating substrate 1 so as to reflect the light fr... | 12/30/2003 |
| 6666567 | Methods and apparatus for a light source with a raised LED structure A light source incorporates light emitting diodes (LEDs). The LEDs may be raised off the floor of the optical cavity to permit light to be emitted from the base of the LED. Additionally, a reflective protrusion may be placed beneath the raised LED to aid ... | 12/23/2003 |
| 6653661 | Chip-type LED and process of manufacturing the same A chip-type LED including a LED element and a tubular vessel accommodating the LED element therein, wherein the vessel has an upper opening and a lower opening, the LED element is positioned between the upper opening and the lower opening such that the LE... | 11/25/2003 |
| 6645783 | Method of producing an optoelectronic component The optoelectronic component has a radiation-receiving or radiation-emitting semiconductor chip mounted on a base part. The chip is contacted with at least two electrode terminals made of an electrically conductive connection material. The electrode termi... | 11/11/2003 |
| 6641287 | Reflective type light-emitting diode In a light source of a reflective type LED, a light-emitting element is mounted on the bottom surface of a concave reflecting mirror. Accordingly, light emitted horizontally from the light-emitting surface of the light-emitting element is also reflected b... | 11/04/2003 |
| 6642618 | Light-emitting device and production thereof A light-emitting device comprises a substrate, electrical terminals disposed on a top side of the substrate, and a light-emitting semiconductor device disposed above the substrate. The light-emitting semiconductor device has a bottom side oriented to face... | 11/04/2003 |
| 6627922 | Chip-type semiconductor light emitting device On a rectangle-shaped insulation substrate (1) on which a pair of electrodes (2) and (3) are provided, a light emitting element chip (4) having an n-side electrode (41) and a p-side electrode (42) connected to the pair of electrodes respectively is provid... | 09/30/2003 |
