Bizarre Patents
Process For Propelling Foodstuffs or the Like into a Crowd
A method of launching foodstuffs into a crowd for promotional and entertainment purposes.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7439601 | Linear integrated circuit temperature sensor apparatus with adjustable gain and offset Embodiments of the invention include a temperature sensor apparatus, method and system for providing an output voltage response that is linear to the temperature of the integrated circuit to which the temperature sensor belongs and/or the integrated circuit die on w... | 10/21/2008 |
| 7417293 | Image sensor packaging structure An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from th... | 08/26/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7382047 | Heat dissipation device A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fi... | 06/03/2008 |
| 7352062 | Integrated circuit package design A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package su... | 04/01/2008 |
| 7235876 | Semiconductor device having metallic plate with groove A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a s... | 06/26/2007 |
| 7233065 | Semiconductor device having capacitors for reducing power source noise A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconducto... | 06/19/2007 |
| 7180178 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor In a semiconductor heat-dissipating substrate made of a Cu—W alloy whose pores have been infiltrated with copper, being a porous tungsten body whose pore diameter at a specific cumulative surface area of 95% is 0.3 μm or more, and whose pore diameter at a specifi... | 02/20/2007 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. I... | 10/03/2006 |
| 7112883 | Semiconductor device with temperature control mechanism A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conduc... | 09/26/2006 |
| 7098533 | Printed circuit board with a heat dissipation element and package comprising the printed circuit board A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip and reduces a printed circuit board height. The PCB includes a heat sin... | 08/29/2006 |
| 7098079 | Electronic assembly with high capacity thermal interface and methods of manufacture To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through ... | 08/29/2006 |
| 7091603 | Semiconductor device In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the principal front surface side of the semiconductor chips, wherein subst... | 08/15/2006 |
| 7011717 | Method for heat treatment of silicon wafers and silicon wafer According to the present invention, there are provided a method for heat treatment of silicon wafers wherein a silicon wafer is subjected to a heat treatment at a temperature of from 1000° C. to the melting point of silicon in an inert gas atmosphere, and temperatu... | 03/14/2006 |
| 6693348 | Semiconductor device with power supplying unit between a semiconductor chip and a supporting substrate A semiconductor device in which a breakage of contacting point by thermal expansion is prevented, an image scanning unit utilizing the same and an image forming apparatus utilizing the same, is disclosed. The semiconductor device includes an assembly 100 ... | 02/17/2004 |
| 6683386 | Low profile optically-sensitive semiconductor package A low-profile optically-sensitive semiconductor device is disclosed which includes a substrate with an opening. A cover plate is bonded to a first surface of the substrate in such a manner that a optically-sensitive semiconductor chip is adhered thereto v... | 01/27/2004 |
| 6677555 | Optical device module using integral heat transfer module An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so ... | 01/13/2004 |
| 6645783 | Method of producing an optoelectronic component The optoelectronic component has a radiation-receiving or radiation-emitting semiconductor chip mounted on a base part. The chip is contacted with at least two electrode terminals made of an electrically conductive connection material. The electrode termi... | 11/11/2003 |
| 6345917 | Hermetically sealed optical-semiconductor container and optical-semiconductor module A hermetically sealed optical-semiconductor container in which an optical-semiconductor element is accommodated, comprising a frame 1 made of a metal, an insulating material or a composite material of a metal and an insulating material, a first bottom pla... | 02/12/2002 |
| 6220765 | Hermetically sealed optical-semiconductor container and optical-semiconductor module A hermetically sealed optical-semiconductor container in which an optical-semiconductor element is accommodated, comprising a frame 1 made of a metal, an insulating material or a composite material of a metal and an insulating material, a first bottom pla... | 04/24/2001 |
| 6160310 | Thin film flexible interconnect for infrared detectors An improved interconnect structure for electrically connecting an infrared detector to external circuitry wherein thin film metal conductors are deposited on a thin, insulating tape. One end of the structure terminates at the detector at about 77° Kelvin... | 12/12/2000 |
| 6057550 | Infrared objective An infrared radiation detector device has a cooled detector element (3) within a first optical device (internal cold shield (1i)). The first optical device includes a first diaphragm (6i) in front of said detector element. The infrar... | 05/02/2000 |
| 6009712 | Temperature controller of optical module package A temperature controller of an optical module package comprises an optical element and first thermistor fixedly held over a first Peltier element housed in an optical module package with a base interposed therebetween; a second thermistor housed in the op... | 01/04/2000 |
| 5914488 | Infrared detector An infrared transmission window 4 is placed on the front of a light reception part 2 formed on a substrate 1 with a cavity 3 between and is bonded to the substrate 1 in airtight relation on a bond face in the range surrounding the light reception part 2, ... | 06/22/1999 |
| 5834778 | Method for assembling a detection unit for electromagnetic and in particular infrared waves with a thermally conducting substrate and an electromagnetic and in particular an infrared detector with which to implement this method An electromagnetic detection unit for detecting infrared radiation having an electronic detection circuit with a readout joined thereto by indium microspheres, and further having a thermally conducting support, affixed to a cold source, having a good ther... | 11/10/1998 |
| 5763885 | Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays A thermal shunt apparatus directs heat flux transmitted through electrical signal leads from a focal plane array (FPA) to a relatively isothermal top surface of a TE cooler. The FPA mounts with a first thermally conductive attachment to a thermal spreader... | 06/09/1998 |
| 5656848 | High thermal resistance backfill material for hybrid UFPA's A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film... | 08/12/1997 |
| 5619039 | Device for the detection of electromagnetic waves and, in particular, of infrared radiation A device is provided for the detection of infrared radiation which operates at low temperature. The device contains a detection unit and a cryostat equipped with a cold finger to exchange heat with a cold source. Included is a cold plane having at least o... | 04/08/1997 |
| 5518674 | Method of forming thin film flexible interconnect for infrared detectors A method of forming an interconnect including the steps of providing a processing substrate, adhering a first electrically insulating layer to the substrate, forming an electrically conductive pattern on the first electrically insulating layer, forming a ... | 05/21/1996 |
| 5508740 | Solid-state imaging device having temperature sensor The solid state image sensor comprises a chip in a package. A image sensor is formed in the chip. The package has a package main body, a light receiving glass plate fixed to the package main body, and a buffer member arranged between the package main body... | 04/16/1996 |
| 5485005 | Cooled x-ray sensitive photoconductor An improved X-ray and gamma ray sensitive Vidicon tube having a photoconductor deposited substrate cooled by means of an internal thermoelectric coolers and a heat sink. The cooled photoconductor has a higher resistivity and lower conductivity and hence t... | 01/16/1996 |
| 5466943 | Evacuated testing device having calibrated infrared source An evacuated testing device (100) including a housing (106) providing a test chamber (101) therein, a first mechanism (102) for retaining an object (116) under test in relation to an aperture (112), a second mechanism (104) positioned within the test cham... | 11/14/1995 |
| 5432374 | Integrated IR and mm-wave detector An integrated radiation detector (10) includes a substrate (12) having a first region (14) comprised of Group III-V semiconductor material, such as GaAs, formed over a first surface, and a second region (26) comprised of Group II-VI semiconductor material... | 07/11/1995 |
| 5404016 | Dewar detector assembly An infrared dewar-detector assembly for use as a common module which is interchangeable between various military infrared detection systems. The detector is cooled to cryogenic temperature for improved sensitivity. The dewar of the common module incorpora... | 04/04/1995 |
| 5382797 | Fast cooldown cryostat for large infrared focal plane arrays A dual Joule-Thompson cryostat assembly (10) is provided which includes first and second concentrically aligned cryostats (100) and (102), respectively, which are disposed in the coldwell of a detector assembly (12). Each of the cryostats is connected to ... | 01/17/1995 |
| 5376587 | Method for making cooling structures for directly cooling an active layer of a semiconductor chip Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulat... | 12/27/1994 |
| 5376794 | Sensor assembly with cooled sensor In a sensor assembly, a cooled sensor is arranged in the vacuum chamber of a Dewar vessel. The Dewar vessel has an inner housing element and an outer housing element. Both housing elements are made of metal and are pot-shaped. The outer housing element ex... | 12/27/1994 |
| 5349234 | Package and method for assembly of infra-red imaging devices Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal expansion between the chip and its package as they are cycle... | 09/20/1994 |
| 5296710 | Infrared radiation detector An infrared radiation detector so adapted as to prevent the image signals from deteriorating due to the short length of leads extending within the cryogenic container with the infrared radiation sensing element accommodated within and to correspond to the... | 03/22/1994 |
| 5291019 | Thin film flexible interconnect for infrared detectors An improved interconnect structure for electrically connecting an infrared detector to external circuitry wherein thin film metal conductors are deposited on a thin, insulating tape. One end of the structure terminates at the detector at about 77° Kelvin... | 03/01/1994 |
