Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 7442562 | Method for manufacturing optical module The invention relates to an optical module manufacturing method for bonding a can portion having an optical semiconductor element and a barrel portion of the optical module together, comprising the steps of: a bonding step for bonding a joint surface of the can port... | 10/28/2008 |
| 7435615 | Method for fabricating CMOS image sensor A method for fabricating a CMOS image sensor improves the characteristics of device by preventing a pad from being contaminated without damaging a micro-lens. The method includes steps of forming a device protection layer on a semiconductor substrate including at le... | 10/14/2008 |
| 7427789 | Solid state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof A method of manufacturing a solid-state image pickup device comprises a process for forming a plurality of photoelectric conversion elements PD within a semiconductor substrate 4, a process for forming an interconnection portion, having an interconnection lay... | 09/23/2008 |
| 7422929 | Wafer-level packaging of optoelectronic devices In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket... | 09/09/2008 |
| 7417293 | Image sensor packaging structure An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from th... | 08/26/2008 |
| 7393709 | Microlens manufacturing method The present invention provides a method for manufacturing a microlens in a semiconductor substrate having a first surface and a second surface, comprising the steps of preparing the semiconductor substrate, forming a first resist layer approximately cylindrical in f... | 07/01/2008 |
| 7388270 | Method of fabricating CMOS image sensor A method of fabricating a CMOS image sensor is provided, in which a trapezoidal microlens pattern profile is formed to facilitate reflowing the microlens pattern and by which a curvature of the microlens may be enhanced to raise its light-condensing efficiency. The ... | 06/17/2008 |
| 7372079 | Surface light emitter, display apparatus and light control member To improve the front brightness of the light emitted from a surface light emitter having a surface light emitting device. In the surface light emitter to which a light control sheet having depressions is provided, the surface of the light control sheet having the de... | 05/13/2008 |
| 7364930 | Method for producing micromechanical and micro-optic components consisting of glass-type materials What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of t... | 04/29/2008 |
| 7358599 | Optical semiconductor device having a lead frame and electronic equipment using same An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an ... | 04/15/2008 |
| 7329553 | Method of fabricating one-way transparent optical system A method of fabricating a one-way transparent optical system by which external light is effectively intercepted and internal light passes nearly without loss is provided. The method includes: forming a photoresist on an upper surface of a transparent substrate; heat... | 02/12/2008 |
| 7306959 | Methods of fabricating integrated optoelectronic devices This disclosure concerns methods for fabrication of integrated high speed optoelectronic devices. In one example of such a method, a device region that includes a top surface and a bottom surface is formed on a top surface of a substrate. The device region may take ... | 12/11/2007 |
| 7301214 | Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged... | 11/27/2007 |
| 7294524 | Method for fabricating image sensor without LTO-based passivation layer A method for fabricating an image sensor including a first region, which is a light receiving region, and a second region, which is a pad region, includes forming a metal line in the second region over a substrate structure comprising a photodiode, forming a passiva... | 11/13/2007 |
| 7291904 | Downsized package for electric wave device A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrical... | 11/06/2007 |
| 7264980 | Method of mounting light emitting element The present invention provides a method of mounting a light emitting element, in which a light emission point can be positioned at high accuracy with respect to the mounting member. A semiconductor laser element is placed on a matching stage. Next, a position and an... | 09/04/2007 |
| 7233027 | Arrangement comprising at least two different electronic semiconductor circuits The invention relates to an arrangement comprising at least two different electronic semiconductor circuits (HS) in which each of the semiconductor circuits (HS) is a component made of semiconductor material and which has an electrically active surface and electroni... | 06/19/2007 |
| 7208333 | Process for fabricating MEMS membrane with integral mirror/lens An optical membrane device and method for making such a device are described. This membrane is notable in that it comprises an optically curved surface. In some embodiments, this curved optical surface is optically concave and coated, for example, with a highly refl... | 04/24/2007 |
| 7205623 | Image sensor and method of manufacturing same An image sensor includes a photodiode formed in substrate, an insulating interlayer structure formed on the substrate, a metal structure formed in the insulating interlayer structure, a dummy pattern formed on the insulating interlayer structure, and a light-shieldi... | 04/17/2007 |
| 7189584 | Fabrication alignment technique for light guide screen Provided is a fabrication alignment technique for a light guide screen. A plurality of light guide layers are provided. Each light guide layer includes a plurality of aligned light guides, each light guide having an input end, a midsection and an output end. The lig... | 03/13/2007 |
| 7161221 | Light receiving element and method of manufacturing the same A light receiving element for converting a received light signal into an electric signal and its manufacturing method are disclosed. The light receiving element includes a semiconductor substrate of a first conduction type; a semiconductor layer of a second conducti... | 01/09/2007 |
| 7091585 | Process for manufacturing semiconductor device A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on t... | 08/15/2006 |
| 7084474 | Photosensitive semiconductor package and method for fabricating the same A photosensitive semiconductor package and a method for fabricating the same are proposed. The package includes a carrier having a first surface, an opposite second surface, and an opening penetrating the carrier; a photosensitive chip having an active surface and a... | 08/01/2006 |
| 6683298 | Image sensor packaging with package cavity sealed by the imaging optics A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical co... | 01/27/2004 |
| 6667183 | Fabricating photodetecting integrated circuits with low cross talk An anti-reflective layer is formed on the sidewalls of metal interconnects in an integrated circuit containing photodetector devices. After fabricating the photodetector devices, the metal interconnects are formed. An anti-reflective layer is formed over ... | 12/23/2003 |
| 6654187 | Camera lens carrier for circuit board mounting A lens carrier for operative engagement of a camera lens with an image sensor such as a Charge Coupled Device or CMOS device. The lens mounts in a lens barrel on the lens carrier and may be laterally translated along the lens barrel to focus the image pro... | 11/25/2003 |
| 6653157 | Manufacturing method for device including function block, and light transmitting device Device 100 of the present invention comprises function block 12. Function block 12 is formed in such a way that the function block 12 is fitted into concavity 11 which is disposed on base body 10, and function block 12 comprises optical element 14. Lens s... | 11/25/2003 |
| 6653552 | Photoelectric conversion device and method of manufacturing the same There is provided a photoelectric conversion device comprising a lower electrode, numerous crystalline semiconductor particles of one conductivity type deposited on the lower electrode, an insulator interposed among the crystalline semiconductor particles... | 11/25/2003 |
| 6646808 | Microlens formed of negative photoresist By forming a microlens of negative photoresist, economical microlens fabrication processes may be used which, in some embodiments, may achieve microlenses having good optical clarity and high thermal stability. In one embodiment, a positive photoresist ma... | 11/11/2003 |
| 6635941 | Structure of semiconductor device with improved reliability A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the second substrate is a semiconductor wafer formed with a ligh... | 10/21/2003 |
| 6630722 | Solid state image sensing device having high image quality and fabricating method thereof A color filter is formed by directly coating a color filter material on the entire groundwork device surface so as to bury the material in a recessed region, subjecting the material to pattern transfer exposure and thereafter subjecting the resulting mate... | 10/07/2003 |
| 6627814 | Hermetically sealed micro-device package with window A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall de... | 09/30/2003 |
| 6627305 | Substrates for large area electronic devices A light-weight substrate (10) for thin film, large area electronic devices such as active matrix display devices, image sensing arrays and the like comprises a layer of rigid, cellular material (12) bonded to a comparatively thin glass sheet (11) on whose... | 09/30/2003 |
| 6613600 | Resonant photodetector A resonant photodetector assembly (10) which uses multiple reflections of light within a photodetector (20) to convert input light into an electrical signal. The photodetector (20) includes a combination of generally planar semiconductor layers including ... | 09/02/2003 |
| 6611036 | Microlens for surface mount products A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat s... | 08/26/2003 |
| 6610563 | Surface mounting optoelectronic component and method for producing same A method for producing a surface mounting optoelectronic component having comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body wi... | 08/26/2003 |
| 6583438 | Solid-state imaging device A conventional solid-state imaging device in which a sealing resin is applied onto a microlens has a low condensing efficiency. There are provided a photodiode 14 for receiving light, a microlens 4 made of a resin set on the photodiode 14 and having a ref... | 06/24/2003 |
| 6583482 | Hetero-interface avalance photodetector An avalanche photodetector (APD) is made from composite semiconductor materials. The absorption region of the APD is formed in a n-type InGaAs layer. The multiplication region of the APD is formed in a p-type silicon layer. The two layers are bonded toget... | 06/24/2003 |
| 6573503 | Plastic light selective element for imaging applications An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element inclu... | 06/03/2003 |
| 6540946 | Microlens for surface mount products A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat s... | 04/01/2003 |
