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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7423331 | Molded stiffener for thin substrates A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise ... | 09/09/2008 |
| 7274096 | Light transmissive cover, device provided with same and methods for manufacturing them A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film o... | 09/25/2007 |
| 6692993 | Windowed non-ceramic package having embedded frame An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being at... | 02/17/2004 |
| 6693364 | Optical integrated circuit element package and process for making the same An optical integrated circuit element package comprises a substrate, an upper chip, a lower chip, an optical-transparent underfill, and a sealing compound. The substrate has a plurality of solder balls disposed on a surface of the substrate, a plurality o... | 02/17/2004 |
| 6683386 | Low profile optically-sensitive semiconductor package A low-profile optically-sensitive semiconductor device is disclosed which includes a substrate with an opening. A cover plate is bonded to a first surface of the substrate in such a manner that a optically-sensitive semiconductor chip is adhered thereto v... | 01/27/2004 |
| 6649834 | Injection molded image sensor and a method for manufacturing the same An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a... | 11/18/2003 |
| 6646289 | Integrated circuit device An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechan... | 11/11/2003 |
| 6645783 | Method of producing an optoelectronic component The optoelectronic component has a radiation-receiving or radiation-emitting semiconductor chip mounted on a base part. The chip is contacted with at least two electrode terminals made of an electrically conductive connection material. The electrode termi... | 11/11/2003 |
| 6627482 | Mass production technique for surface mount optical device with a focusing cup Surface mount diodes are mass produced by first cutting a metal plate to form a plurality of vertical slits within metal plate. Parallel lines are cut midway between the slits to form wings for the slits. The wings are folded to form the bottoms for surfa... | 09/30/2003 |
| 6627872 | Semiconductor optical sensing apparatus with reliable focusing means and casing structure A semiconductor optical sensing apparatus is formed of a casing made of an electrically insulative material and having at least one opening at a bottom portion; a wiring device extending from an inside to an outside of the casing; a semiconductor optical ... | 09/30/2003 |
| 6624505 | Packaged integrated circuits and methods of producing thereof This invention discloses a packaged integrated circuit including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package enclosing the integrated circuit substrate and defining first and second ... | 09/23/2003 |
| 6621616 | Devices incorporating electrochromic elements and optical sensors The device of the present invention includes an electrochromic element having a transmittance that varies in response to an electrical signal, a base substrate disposed in spaced relation to the electrochromic element, a seal disposed between the base sub... | 09/16/2003 |
| 6605828 | Optoelectronic component with a space kept free from underfiller An optoelectronic component that includes a substrate having a first optoelectronic component, a second optoelectronic component arranged next to the first optoelectronic component and a contact point. A support of the substrate includes a second contact ... | 08/12/2003 |
| 6596986 | Reflective sensor A reflection sensor (1) for detecting presence of a detection object is provided. The reflection sensor comprises a light emitting element (31), a light receiving element (32) cooperative with the light emitting element, a first resin body (21) enclosing ... | 07/22/2003 |
| 6597020 | Process for packaging a chip with sensors and semiconductor package containing such a chip A method is provided for packaging an integrated circuit chip that has a front face with sensors located in a central region and electrical connection areas located in a region that lies between at least one edge of the chip and the central region. Accord... | 07/22/2003 |
| 6590152 | Electromagnetic shield cap and infrared data communication module An electromagnetic shield cap (3) includes a projection (34) which is pressed against an electronic component (1) with an elastic force when the cap is mounted to the electronic component (1). Since the projection (34) is pressed against the electronic co... | 07/08/2003 |
| 6586726 | Optical electronic assembly having a flexure for maintaining alignment between optical elements A package for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate having a positioning floor, a platform and an optional ring frame of precisely determined height. Optical components picked ... | 07/01/2003 |
| 6541284 | Integrated IC chip package for electronic image sensor die An IC chip package for an image sensitive, integrated circuit semiconductor die incorporates all the components typically found in an imaging module of an electronic camera. The IC chip package consists of a plastic substrate base for holding an image sen... | 04/01/2003 |
| 6509560 | Chip size image sensor in wirebond package with step-up ring for electrical contact An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. A step up ring is mounted above... | 01/21/2003 |
| 6488417 | Opto-electronic assembly having an integrated imaging system An opto-electronic assembly includes an opto-electronic transducer, an optical path and an imaging system in the form of a translucent hollow body having internal optical boundary surfaces forming beam-forming boundary surfaces, in order to achieve effect... | 12/03/2002 |
| 6465858 | Semiconductor device package for optical communication device A semiconductor device package having a heat radiating base that has a depression. A circuit substrate is disposed on the heat radiating base to cover at least the depression. At least two semiconductor devices are mounted on both sides of the circuit sub... | 10/15/2002 |
| 6459130 | Optoelectronic semiconductor component A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in wh... | 10/01/2002 |
| 6417552 | Solid-state imaging device The invention relates to a solid-state imaging device (1) which is encapsulated in a ceramic package covered by a transparent window (6) comprising a phosphorus-containing glass. The window is provided with a coating (8), for example of chromium, at the c... | 07/09/2002 |
| 6417946 | Data transmitter/receiver A transceiver, especially an infrared transceiver, has a flat surface section and at least one or two lens forming housing sections integrally formed with the flat housing section. The lens housing sections are positioned so that one flat surface of the f... | 07/09/2002 |
| 6407438 | Semiconductor opto-electronic device packaging A rear light entry photodetector array chip is secured face-down with solder on to the front face of a ceramic submount provided with electrically conductive vias. A frame-shaped mass of solder seals the chip to the submount to provide a hermetic enclosur... | 06/18/2002 |
| 6354595 | Method for tight sealing of a radiation detector and detector obtained by this method A process for leaktight sealing of a solid-state X-radiation detector. The detector includes an amorphous silicon detecting slab and a layer of scintillating substance. The slab has peripheral connection zones formed by the flexing of an anisotropic condu... | 03/12/2002 |
| 6342670 | Photoelectric module device A photoelectric module device comprising a multiple layer printed circuit board and at least one photoelectric module device is provided. The multiple layer printed circuit board has at least an upper circuit board substrate, a lower circuit board substra... | 01/29/2002 |
| 6335528 | Method for producing a radiation detector by assembling elementary blocks and resulting detector A process for producing a radiation detector. A plurality of unitary elementary slabs are assembled on a positioning support. The slabs are adhesively bonded onto the common support. The bonding is carried out in two successive steps: a first step for sea... | 01/01/2002 |
| 6320178 | Optoelectronic component arrangement An optoelectronic component arrangement is indicated, which includes a radiation-sensitive detector element having a semiconductor base substrate with one or more doped partial regions and at least one partial layer which is arranged directly in front of ... | 11/20/2001 |
| 6285064 | Chip scale packaging technique for optical image sensing integrated circuits A chip scale packaging for optical image sensor integrated circuits is disclosed. Micro lenses are placed on top of a wafer having the image sensors formed thereon. An adhesive matrix is placed atop of the wafer. The adhesive matrix has openings that alig... | 09/04/2001 |
| 6281572 | Integrated circuit header assembly An integrated circuit (IC) header subassembly includes a spacer mounted to the header. The IC die assembly, consisting of an IC die or IC die carrier assembly, is mounted to spacer which is mounted to the header. The coefficient of thermal expansion of th... | 08/28/2001 |
| 6268231 | Low cost CCD packaging A packaging solution for CCD devices and other opto-electronic applications that offers a lower cost, automated assembly process. A package made of a moldable plastic material with low moisture permeability, and high dimensional stability by employing mat... | 07/31/2001 |
| 6257772 | Photodiode module A PD module including a planar substrate, a first V-groove formed in the longitudinal direction on the substrate, a path-changing groove formed in the lateral direction vertically to the first V-groove on the substrate for ensuring a space at an extension... | 07/10/2001 |
| 6252252 | Optical semiconductor device and optical semiconductor module equipped with the same A mold 25 for molding semiconductor chips 23 and 24 serving as a light emitting element and a light receiving element, respectively, is made of a material capable of transmitting light. A groove 27 is formed on the region where light is emitted from and i... | 06/26/2001 |
| 6207950 | Optical electronic assembly having a flexure for maintaining alignment between optical elements A package for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate having a positioning floor, a platform and an optional ring frame of precisely determined height. Optical components picked ... | 03/27/2001 |
| 6184560 | Photosemiconductor device mounted structure A photosemiconductor device mounted structure includes a plurality of tapered projections, a photosemiconductor device, second Au electrodes, and AuSn solder. The tapered projections are formed on a surface of an Si substrate. The photosemiconductor devic... | 02/06/2001 |
| 6169330 | Method and apparatus for packaging high temperature solid state electronic devices A semiconductor-chip is bonded to a chip-carrier substrate by way of a gold-to-gold bonding interface. A vacuum chuck is provided to physically hold the semiconductor-chip in physical contact with, the chip-carrier substrate as static force, ultrasonic po... | 01/02/2001 |
| 6169280 | Light selective element for imaging applications An image sensing device including a package having opposing side portions, an imaging sensor having a top side portion, and a light selective element coupled to the opposing side portions and overlying the top side portion of the imaging sensor.... | 01/02/2001 |
| 6163026 | Chemically stabilized light selective element for imaging applications An imaging system having an imaging sensor providing sensor signals in response to incident light and control signals, control circuitry configured to generate control signals for controlling said imaging sensor, signal processing circuitry for generating... | 12/19/2000 |
| 6163028 | Imaging support for removably mounting an imaging device An imaging support for supporting a plurality of imaging device tiles at respective tile mounting locations to define a tiled imaging surface is provided. Each of the imaging device tiles has a semiconductor detector with a plurality of pixel cells couple... | 12/19/2000 |
