Bizarre Patents
Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7443038 | Flip-chip image sensor packages The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an ... | 10/28/2008 |
| 7422929 | Wafer-level packaging of optoelectronic devices In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket... | 09/09/2008 |
| 7420257 | Backside-illuminated photodetector The present invention provides a back illuminated photodetector having a sufficiently small package as well as being capable of suppressing the scattering of to-be-detected light. A back illuminated photodiode 1 comprises an N-type semiconductor substrate ... | 09/02/2008 |
| 7372122 | Image sensor chip package and method of fabricating the same The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with cond... | 05/13/2008 |
| 7358599 | Optical semiconductor device having a lead frame and electronic equipment using same An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an ... | 04/15/2008 |
| 7352070 | Polymer encapsulated electrical devices Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an... | 04/01/2008 |
| 7327005 | Optical semiconductor package with incorporated lens and shielding An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semi... | 02/05/2008 |
| 7317235 | Wafer level package structure of optical-electronic device and method for making the same A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and div... | 01/08/2008 |
| 7271460 | Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus A solid-state image sensing device is provided which saves the effort of removing adhesives from a cover glass and is capable of reading an image without being affected by adhesive residuals. In a solid-state image sensing device, defacement of a cover glass upon th... | 09/18/2007 |
| 7193331 | Semiconductor device and manufacturing process thereof One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin enco... | 03/20/2007 |
| 7172958 | High-frequency wiring structure and method for producing the same A high-frequency wiring structure includes a microstrip line having a ground conductor, a dielectric disposed on the ground conductor, and a transmission conductor that is at least partially disposed in the dielectric. The transmission conductor is defined by a flat... | 02/06/2007 |
| 7084474 | Photosensitive semiconductor package and method for fabricating the same A photosensitive semiconductor package and a method for fabricating the same are proposed. The package includes a carrier having a first surface, an opposite second surface, and an opening penetrating the carrier; a photosensitive chip having an active surface and a... | 08/01/2006 |
| 6703598 | Semiconductor photo-detecting apparatus A semiconductor photodetecting apparatus 1 comprises a base 2 and a CCD chip 4. The CCD chip 4 is secured to the base 2 when a resin 8 is supplied and cured. The base 2 is formed with a gas supply path 15 and a gas exhaust path 16. Each of the gas supply ... | 03/09/2004 |
| 6696738 | Miniaturized image sensor An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a second board and a third board connecting the first and second... | 02/24/2004 |
| 6693348 | Semiconductor device with power supplying unit between a semiconductor chip and a supporting substrate A semiconductor device in which a breakage of contacting point by thermal expansion is prevented, an image scanning unit utilizing the same and an image forming apparatus utilizing the same, is disclosed. The semiconductor device includes an assembly 100 ... | 02/17/2004 |
| 6680525 | Stacked structure of an image sensor An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a ... | 01/20/2004 |
| 6674143 | Hermetically sealing package for optical semiconductor and optical semiconductor module A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical... | 01/06/2004 |
| 6657245 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 12/02/2003 |
| 6653157 | Manufacturing method for device including function block, and light transmitting device Device 100 of the present invention comprises function block 12. Function block 12 is formed in such a way that the function block 12 is fitted into concavity 11 which is disposed on base body 10, and function block 12 comprises optical element 14. Lens s... | 11/25/2003 |
| 6654187 | Camera lens carrier for circuit board mounting A lens carrier for operative engagement of a camera lens with an image sensor such as a Charge Coupled Device or CMOS device. The lens mounts in a lens barrel on the lens carrier and may be laterally translated along the lens barrel to focus the image pro... | 11/25/2003 |
| 6646316 | Package structure of an image sensor and packaging A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit... | 11/11/2003 |
| 6635860 | Radiation detector A solvent-resistant and carrier-selective high-resistance film is formed between a radiation sensitive type amorphous semiconductor thick film, and a voltage application electrode in such a manner as to cover the entire surface of the amorphous semiconduc... | 10/21/2003 |
| 6635941 | Structure of semiconductor device with improved reliability A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the second substrate is a semiconductor wafer formed with a ligh... | 10/21/2003 |
| 6630661 | Sensor module with integrated discrete components mounted on a window An optical module includes a window having an interior, e.g., first, surface. The interior surface includes a central region and a peripheral region. A first electronic component is coupled to the peripheral region. The optical module further includes a s... | 10/07/2003 |
| 6627814 | Hermetically sealed micro-device package with window A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall de... | 09/30/2003 |
| 6620646 | Chip size image sensor wirebond package fabrication method To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface o... | 09/16/2003 |
| 6617630 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 09/09/2003 |
| 6610563 | Surface mounting optoelectronic component and method for producing same A method for producing a surface mounting optoelectronic component having comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body wi... | 08/26/2003 |
| 6573503 | Plastic light selective element for imaging applications An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element inclu... | 06/03/2003 |
| 6570188 | Optoelectronic component for data transmission An optoelectronic component for data transmission with infrared radiation is described. This component integrates in a single housing an infrared transmitter, an infrared receiver and an integrated circuit for signal conditioning. owing to a particular de... | 05/27/2003 |
| 6525359 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 02/25/2003 |
| 6521989 | Methods and apparatus for hermetically sealing electronic packages An electronic package and/or package lid includes at least one connection slot for receiving a line, such as an optical fiber. The package and/or package lid also includes at least one sealant slot proximate the connection slot. Optical fibers are connect... | 02/18/2003 |
| 6501156 | Lead frame which includes a die pad, a support lead, and inner leads A lead frame includes a die pad including a die pad main portion having a large thickness and a die pad peripheral portion having an intermediate thickness smaller than that of the die pad main portion, provided on at least one side of the die pad main po... | 12/31/2002 |
| 6489675 | Optical semiconductor component with an optically transparent protective layer The optical semiconductor component has a semiconductor body having a first surface with an active region and a second surface with a passive region. An optically transparent layer adjoins at least the optically active region. Conduction paths extend from... | 12/03/2002 |
| 6483101 | Molded image sensor package having lens holder An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from t... | 11/19/2002 |
| 6476417 | Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays A semiconductor device for picking up an image includes a lens-mounting unit provided with a lens for picking up an image; a semiconductor chip having a light-receiving element formed on a circuit-forming surface thereof, the light-receiving element conve... | 11/05/2002 |
| 6465790 | Micro gamma camera with semiconducting detectors A micro gamma camera having several gamma radiation detection devices adjacent to each other. The detection devices are laid out above an information processing device that processes information output by the detection devices. Each of the detection devic... | 10/15/2002 |
| 6465827 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 10/15/2002 |
| 6462330 | Cover with integrated lens for integrated chip optical sensor An integrated lens and aperture plate for an optical sensor equipped integrated chip in which the lens and aperture plate are molded as one piece with the lens at the appropriate location so that the lens aligns with the location of the optical sensor whe... | 10/08/2002 |
| 6441416 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 08/27/2002 |
