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| Number | Title | Issue Date |
| 7382013 | Dielectric thin film, dielectric thin film device, and method of production thereof To provide a dielectric thin with a high dielectric constant, a low leakage current, and stable physical properties and electrical properties and to provide a thin film capacitor or other thin film dielectric device with a high capacitance and high reliability and a... | 06/03/2008 |
| 7378310 | Method for manufacturing a memory device having a nanocrystal charge storage region A method for manufacturing a memory device having a metal nanocrystal charge storage structure. A substrate is provided and a first layer of dielectric material is grown on the substrate. A layer of metal oxide having a first heat of formation is formed on the first... | 05/27/2008 |
| 7375403 | Semiconductor device and method of manufacturing the same A semiconductor device according to the present invention comprises a semiconductor substrate, a gate insulating film which is composed of a material whose main component is a tetravalent metal oxide, a mixture of a tetravalent metal oxide and SiO2, or a ... | 05/20/2008 |
| 7372114 | Semiconductor device, and method of fabricating the same A silicon oxynitride film is manufactured using SiH4, N2O and H2 by plasma CVD, and it is applied to the gate insulating film (1004 in FIG. 1A) of a TFT. The characteristics of the silicon oxynitride film are controlled... | 05/13/2008 |
| 7061094 | Multilayer printed circuit board including first and second signal traces and a first ground trace A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as... | 06/13/2006 |
| 6605862 | Trench semiconductor devices A semiconductor device, such as a MOSFET or PN diode rectifier, has a p-n junction (24) between a first device region (23) and an underlying voltage-sustaining zone (20). Trenched field-shaping regions (40) extend through the voltage-sustaining zone (20) ... | 08/12/2003 |
| 6558983 | Semiconductor apparatus and method for manufacturing the same A semiconductor apparatus is provided which includes a lateral high-voltage semiconductor device which comprises a silicon substrate, a pair of main electrodes formed on the silicon substrate, and a silicon oxide film formed on the silicon substrate, such... | 05/06/2003 |
| 6528373 | Layered dielectric on silicon carbide semiconductor structures A dielectric structure is disclosed for silicon carbide-based semiconductor devices. In gated devices, the structure includes a layer of silicon carbide, a layer of silicon dioxide on the silicon carbide layer, a layer of another insulating material on th... | 03/04/2003 |
| 6495864 | High-voltage semiconductor component, method for the production and use thereof The invention concerns a semiconductor component with at east one lateral region which is provided to accommodate a lateral electric field strength, whereby the semiconductor body within the body and/or in regions proximal to the surface of the semiconduc... | 12/17/2002 |
| 6489213 | Method for manufacturing semiconductor device containing a silicon-rich layer A semiconductor device having a controlled resistance value within a predetermined range. The semiconductor device includes a substrate and an oxide layer provided above the substrate. There is also included a first dielectric layer that is silicon-rich a... | 12/03/2002 |
| 6475861 | Semiconductor device and fabrication method thereof A semiconductor device and fabrication method thereof restrains an amplified current between input voltage Vin and ground voltage Vss, and first and second n-wells are biased into internal voltage sources, whereby the current-voltage characteristic of the... | 11/05/2002 |
| 6465844 | Power semiconductor device and method of manufacturing the same A power semiconductor device has a plurality of U-shaped buried layers buried in a drift layer and made of either an insulating material or a semiconductor having a wider bandgap than that of the semiconductor of the drift layer. The ratio of the product ... | 10/15/2002 |
| 6452230 | High voltage mosgated device with trenches to reduce on-resistance Parallel, spaced SIPOS (semi-insulating polysilicon) filled trenches extend vertically through the epi layer of a MOSgated device and act to deplete carriers from the vertical conduction volume of the epi between trenches during voltage blocking condition... | 09/17/2002 |
| 6437416 | Semiconductor structure having a planar junction termination with high breakdown voltage and low parasitic capacitance The breakdown voltage of a semiconductor device, such as a transistor fabricated in a device region in and abutting the surface of a semiconductor body with a field oxide surrounding the device region, is improved by etching the field oxide abutting the d... | 08/20/2002 |
| 6436779 | Semiconductor device having a plurality of resistive paths A semiconductor device has first and second opposed major surfaces (10a and 10b). A semiconductor first region (11) is provided between second (12 or 120) and third (14) regions such that the second region (12 or 120) forms a rectifying junction (13 or 13... | 08/20/2002 |
| 6437371 | Layered dielectric on silicon carbide semiconductor structures A dielectric structure is disclosed for silicon carbide-based semiconductor devices. In gated devices, the structure includes a layer of silicon carbide, a layer of silicon dioxide on the silicon carbide layer, a layer of another insulating material on th... | 08/20/2002 |
| 6316794 | Lateral high voltage semiconductor device with protective silicon nitride film in voltage withstanding region A semiconductor apparatus is provided which includes a lateral high-voltage semiconductor device which comprises a silicon substrate, a pair of main electrodes formed on the silicon substrate, and a silicon oxide film formed on the silicon substrate, such... | 11/13/2001 |
| 6313482 | Silicon carbide power devices having trench-based silicon carbide charge coupling regions therein Silicon carbide power devices having trench-based charge coupling regions include a silicon carbide substrate having a silicon carbide drift region of first conductivity type (e.g., N-type) and a trench therein at a first face thereof. A uniformly doped s... | 11/06/2001 |
| 6307232 | Semiconductor device having lateral high breakdown voltage element A diode having a p+ semiconductor region, an n- drift region and an n+ semiconductor region is formed in an SOI layer. An SiC layer is formed in the bottom surface of a semiconductor layer. Further, a capacitive coupled mu... | 10/23/2001 |
| 6303954 | Semiconductor device with a high-voltage component in semiconductor on insulator A semiconductor device comprises a semiconductor layer on an insulator film that is contiguous to a semiconductor substrate. A component, such as a high-voltage diode, forming region is provided in the semiconductor layer and electrically insulated from o... | 10/16/2001 |
| 6297532 | Semiconductor device and method of manufacturing the same The present invention aims to provide a semiconductor device in which a satisfactory breakdown voltage can be obtained without increasing its chip size, and a method of manufacturing the same. A first electrode layer and a second electrode layer are forme... | 10/02/2001 |
| 6246076 | Layered dielectric on silicon carbide semiconductor structures A dielectric structure is disclosed for silicon carbide-based semiconductor devices. In gated devices, the structure includes a layer of silicon carbide, a layer of silicon dioxide on the silicon carbide layer, a layer of another insulating material on th... | 06/12/2001 |
| 6222231 | Semiconductor device of high breakdown voltage using semiconductive film and its manufacturing method Continuously after forming a semiconductive film, a conducting film is formed on the semiconductive film. This conducting film serves as a block film for blocking diffusion of oxygen when a heated wafer is transferred from a furnace to the atmosphere. As ... | 04/24/2001 |
| 6201279 | Semiconductor component having a small forward voltage and high blocking ability The semiconductor component has a small forward voltage and a high blocking ability. At least one drift path suitable for taking up voltage is formed in a semiconductor body between two electrodes that are arranged at a distance from one another. At least... | 03/13/2001 |
| 6198126 | Semiconductor device and power converter using same A high voltage semiconductor device is provided with a p layer which forms a main pn-junction, a plurality of p layers which surround the p layer in a ring form, a ring-like n+ layer which further surrounds those p layers, forward field plates extending i... | 03/06/2001 |
| 6150701 | Insulative guard ring for a semiconductor device A semiconductor device and fabrication method thereof restrains an amplified current between input voltage Vin and ground voltage Vss, and first and second n-wells are biased into internal voltage sources, whereby the current-voltage characteristic of the... | 11/21/2000 |
| 5981349 | Method of forming semiconducting planar junction termination with high breakdown voltage and low parasitic capacitance The breakdown voltage of a semiconductor device, such as a transistor fabricated in a device region in and abutting the surface of a semiconductor body with a field oxide surrounding the device region, is improved by etching the field oxide abutting the d... | 11/09/1999 |
| 5861657 | Graded concentration epitaxial substrate for semiconductor device having resurf diffusion The epitaxial substrate of a semiconductor chip device has a resurf diffusion in at least one of its isolated wells in the device chip surface. The wells are separated by junction diffusions. The thickness of the epitaxial layer is reduced by placing an i... | 01/19/1999 |
| 5859458 | Semiconductor device containing a silicon-rich layer A semiconductor device having a controlled resistance value within a predetermined range. The semiconductor device includes a substrate and an oxide layer provided above the substrate. There is also included a first dielectric layer that is silicon-rich a... | 01/12/1999 |
| 5801431 | MOS gated semiconductor device with source metal covering the active gate An MOS gated semiconductor device includes a metal source contact electrode which extends across the top of a overlaying oxide layer that is formed atop the gate electrode. The source metal thus extends over the channel region to provide a physical metal ... | 09/01/1998 |
| 5793110 | MOS transistor with good hot carrier resistance and low interface state density After a MOS transistor having a gate electrode layer is formed on the surface of a semiconductor substrate, a first interlayer insulating film and a moisture blocking film are sequentially formed. After necessary contact holes are formed in the films, a f... | 08/11/1998 |
| 5777373 | Semiconductor structure with field-limiting rings and method for making An improved edge termination scheme for semiconductor structures includes field-limiting rings (13, 14 and 15) having a fine-to-coarse incrementing scheme (18, 19 and 20) which is spatially additive assuring constancy against lateral junction variation. T... | 07/07/1998 |
| 5763915 | DMOS transistors having trenched gate oxide Improved power MOSFET structure, and fabrication process are disclosed in this invention to achieve cost savings by simplified device structure and fabrication processes, and also by reducing the required die size. Specifically, in a novel MOSFET device, ... | 06/09/1998 |
| 5731628 | Semiconductor device having element with high breakdown voltage A semiconductor device which contains an electrode or an interconnection subjected to a high voltage prevents current leakage due to polarization of a mold resin. In this semiconductor device, a glass coat film 13a covering a semiconductor element has an ... | 03/24/1998 |
| 5691553 | Semiconductor device and power converter using same A high voltage semiconductor device is provided with a p layer which forms a main pn- junction, a plurality of p layers which surround the p layer in a ring form, a ring-like n+ layer which further surrounds those p layers, forward field plates extending ... | 11/25/1997 |
| 5665634 | Method of increasing maximum terminal voltage of a semiconductor device In a semiconductor island structure with passive side isolation, a method and structure for reducing corner breakdown where a device conductor crosses the edge of the island. The decrease in the field strength at the island edge between the conductor and ... | 09/09/1997 |
| 5640040 | High breakdown voltage semiconductor device A high breakdown voltage semiconductor device comprising a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivi... | 06/17/1997 |
| 5592014 | High breakdown voltage semiconductor device A high breakdown voltage semiconductor apparatus comprises a substrate having an insulating layer formed thereon, a high resistance semiconductor layer of a first conductivity type formed on said insulating layer, a base region of the first conductivity t... | 01/07/1997 |
| 5561319 | Integrated circuit structure including CMOS devices protected by patterned nitride passivation and method for the fabrication thereof A CMOS integrated circuit structure is disclosed having a patterned nitride passivation layer, wherein the nitride is patterned such that it does not overlie the thin gate oxide portions of one or more of the MOS devices. When protection against the effec... | 10/01/1996 |
| 5552625 | Semiconductor device having a semi-insulating layer A semiconductor device has a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type contacted by respective first and second electrodes. A semi-insulating layer extends between the first and... | 09/03/1996 |