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| Number | Title | Issue Date |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7262498 | Assembly with a ring and bonding pads formed of a same material on a substrate An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material. ... | 08/28/2007 |
| 6703700 | Semiconductor packaging structure A semiconductor packaging structure mainly has a lead frame with a die pad and a plurality of leads, a wall portion formed by molding compound positioned around a periphery of the lead frame, a chip mounted on the die pad and electrically connected with t... | 03/09/2004 |
| 6703559 | Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough Feedthrough apparatus has a metal housing with an opening therein and a base having a surface at the opening. A ceramic feedthrough extends through the opening in the housing and forms an interface therewith, and is brazed to the housing at the interface.... | 03/09/2004 |
| 6660562 | Method and apparatus for a lead-frame air-cavity package Embodiments provide a method, article of manufacture, and apparatus for providing a component package for components such as integrated circuits. In one embodiment, a carrier includes a plurality of sidewalls formed thereon to form a component package ass... | 12/09/2003 |
| 6597060 | Semiconductor device package A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to... | 07/22/2003 |
| 6518659 | Stackable package having a cavity and a lid for an electronic device Package embodiments for housing an electronic device are disclosed, along with methods of making and interconnecting the packages. The package body may be formed of an injection molded plastic encapsulant. The package body includes a cavity in which the e... | 02/11/2003 |
| 6483182 | Integrated-circuit case A case for an integrated-circuit mounted on a substrate provides electrical conducting contacts between the integrated circuit and contact elements on an external circuit, e.g., a printed circuit, connected to the case. The case includes contact pins and ... | 11/19/2002 |
| 6476478 | Cavity semiconductor package with exposed leads and die pad A semiconductor chip package and a method of making the package are disclosed. The method includes forming a lead frame having a die pad and leads. At least one of the leads has a tab projecting upward and laterally from a body of the lead. In one embodim... | 11/05/2002 |
| 6472251 | Method for integrated circuit packaging A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in s... | 10/29/2002 |
| 6462413 | LDMOS transistor heatsink package assembly and manufacturing method A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bo... | 10/08/2002 |
| 6372551 | Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability An integrated circuit (Integrated Circuit) packaging method is proposed, which can be used to pack an Integrated Circuit chip of an optically-sensitive type, such as an image-sensor Integrated Circuit chip, and which can help prevent resin flash on lead f... | 04/16/2002 |
| 6058020 | Component housing for surface mounting of a semiconductor component A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar... | 05/02/2000 |
| 5999415 | BGA package using PCB and tape in a die-down configuration A die-down HBGA package includes an integrated-circuit die mounted to a substantially flat lower surface of a die-carrier/heat spreader. A flexible insulated tape layer with a central opening for the die has its upper surface adhesively fixed to the lower... | 12/07/1999 |
| 5883424 | Lead frame for hollow plastic package A lead frame for a hollow plastic package is constructed with a source lead, a pellet mounting portion provided at the central portion of the source lead and mounting a pellet, a lead gate and a drain gate symmetrically provided across the pellet mounting... | 03/16/1999 |
| 5675122 | Sealable electronics packages Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between element... | 10/07/1997 |
| 5574959 | Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient A metal casing for a semiconductor device is manufactured by a powder metallurgy injection molding process which uses infiltration. The metal casing includes a base member and an enclosure member arranged on the base member. The base member and the enclos... | 11/12/1996 |
| 5559373 | Hermetically sealed surface mount diode package A hermetically sealed surface mount diode package composed of: a support member of electrically conductive material; a diode element having two mutually opposed surfaces constituting, respectively, cathode and anode contact surfaces, the element resting o... | 09/24/1996 |
| 5433260 | Sealable electronics packages and methods of producing and sealing such packages Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed bet... | 07/18/1995 |
| 5428188 | Low-cost package for electronic components A low cost package uses non-ceramic materials to environmentally seal an air chamber for an electronic component. The package includes a base formed by a plurality of essentially flat terminals molded in a polyphenylene sulfide resin so as to provide a pl... | 06/27/1995 |
| 5374786 | Ceramic wall hybrid package with washer and solid metal through wall leads A package for electrical circuitry and method of making same wherein the package is provided with apertured ceramic side walls. Ceramic layers, which have been previously co-fired together and have an aperture therethrough for receiving a copper-based lea... | 12/20/1994 |
| 5367193 | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die A substrate, a heat slug with an access cavity, a lid, and a heat sink having a stem are used to package a high applied power VLSI die. The substrate comprises a stepped housing cavity at its center, and a number of electrical contacts disposed at its und... | 11/22/1994 |
| 5317107 | Shielded stripline configuration semiconductor device and method for making the same Electrical parasitic parameters can lead to reflections and switching noise in a circuit causing signal distortions. A stripline configuration semiconductor device (10) can be manufactured to reduce the overall parasitic parameters, especially inductance,... | 05/31/1994 |
| 5315155 | Electronic package with stress relief channel There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the... | 05/24/1994 |
| 5216279 | Power semiconductor device suitable for automation of production The feature of the construction of this invention lies in a direct bond copper (DBC) pate. That is, a first Cu plate on which a semiconductor pellet is formed is fixed on the ceramic plate to continuously extend from the front surface of the ceramic plate... | 06/01/1993 |
| 5200640 | Hermetic package having covers and a base providing for direct electrical connection The invention relates to the hermetic packaging of typically one or two dice for high power density applications. The package, which is intended for surface mounting to a heating sinking substrate, is particularly compact. Compactness in surface mount app... | 04/06/1993 |
| 5159750 | Method of connecting an IC component with another electrical component A package for containing an integrated circuit component is provided which includes one or more layers with exposed edges surrounding a central opening. The integrated circuit component is positioned in the central opening. Bond wires connect the bond pad... | 11/03/1992 |
| 5107074 | Multi-lead hermetic power package with high packing density An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs prot... | 04/21/1992 |
| 5014159 | Semiconductor package A semiconductor package for mounting a chip is disclosed. The package includes a first metal or metal alloy component having a first thin refractory oxide layer on a first surface. The chip is bonded to the first component. A skirt extends from the first ... | 05/07/1991 |
| 5008734 | Stadium-stepped package for an integrated circuit with air dielectric A package for containing an integrated circuit component is provided which includes one or more layers with exposed edges surrounding a central opening. The integrated circuit component is positioned in the central opening. Bond wires connect the bond pad... | 04/16/1991 |
| 4972043 | Multi-lead hermetic power package with high packing density An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs prot... | 11/20/1990 |
| 4881116 | Package for integrated circuit A package for an integrated circuit having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit. The package includes a dielectric plate which is provided on one end face with a groundi... | 11/14/1989 |
| 4866571 | Semiconductor package A semiconductor package for mounting a chip is disclosed. The package includes a first metal or metal alloy component having a first thin refractory oxide layer on a first surface. The chip is bonded to the first component. A skirt extends from the first ... | 09/12/1989 |
| 4845545 | Low profile semiconductor package A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.... | 07/04/1989 |
| 4766479 | Low resistance electrical interconnection for synchronous rectifiers A technique is disclosed for making the high current-carrying electrical interconnections to the power FET devices in a synchronous rectifier circuit with extremely low lead resistance. All such interconnections are made with solder and pliable copper str... | 08/23/1988 |
| 4750031 | Hermetically sealable package for hybrid solid-state electronic devices and the like A small component package employing a ring frame 11 of a mouldable polyamide-imide thermoplastic directly moulded onto a heat conducting base plate 10 with integral moulded anchoring pins of the thermoplastic material engaging corresponding bores 21 and 2... | 06/07/1988 |
| 4713634 | Semiconductor device mounted in a housing having an increased cutoff frequency A semiconductor device including a metallic container for containing a radio frequency semiconductor circuit on a bottom surface thereof; a cap for covering the container; and input and output terminals connected to the circuit and penetrating through a s... | 12/15/1987 |
| 4711023 | Process for making single-in-line integrated electronic component Method for making an insulating package premolded on a metallic frame with electrical contacts containing in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the packag... | 12/08/1987 |
| 4684763 | Hermetically sealable package for electronic component A hermetically sealable package for electronic component comprising a metallic base member and a metallic lid member, in which the metallic base member has lead wires penetrating therethrough under insulation. The base member or lid member is provided on ... | 08/04/1987 |
| 4672151 | Package for a microwave semiconductor device A package for a microwave semiconductor device or circuit is provided having an electrical terminal suitable to cascade connection. The package includes a metallic container for the semiconductor device or circuit and a single electrical terminal having a... | 06/09/1987 |
