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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7230332 | Chip package with embedded component A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection s... | 06/12/2007 |
| 7132753 | Stacked die assembly having semiconductor die overhanging support A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are at... | 11/07/2006 |
| 7109062 | Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof A semiconductor integrated device, provided with a semiconductor chip on which a semiconductor integrated circuit is formed and a support substrate laminated on at least one surface of the semiconductor chip, wherein the semiconductor chip and the support substrate ... | 09/19/2006 |
| 6700073 | Semiconductor device A silicone resin for sealing a semiconductor chip. A cured silicone resin, which is obtained by curing the silicone resin at a given temperature, has a percent elongation, after fracture, measured at a room temperature, not less than 4% of a penetration n... | 03/02/2004 |
| 6677219 | Method of forming a ball grid array package A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface ex... | 01/13/2004 |
| 6661099 | Semiconductor device, semiconductor package for use therein, and manufacturing method thereof A semiconductor package is comprised of a substrate for mounting and fixing a semiconductor element thereon and a connecting pattern. The substrate is provided with a through hall formed therein. The semiconductor element is fixed with its surface where t... | 12/09/2003 |
| 6642078 | Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, s... | 11/04/2003 |
| 6630730 | Semiconductor device assemblies including interposers with dams protruding therefrom A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the interposer or other substrate. The interposer may be posit... | 10/07/2003 |
| 6624523 | Structure and package of a heat spreader substrate A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spre... | 09/23/2003 |
| 6602803 | Direct attachment semiconductor chip to organic substrate A method for attaching an integrated circuit chip to an organic substrate comprising the steps of providing an integrated circuit chip having an active and a passive surface, said active surface including a protective polymer layer; activating said polyme... | 08/05/2003 |
| 6601293 | Method of making an electromagnetic interference shield device A method of packaging a device is disclosed. In one embodiment, a substrate including a common voltage plane and a mounting region is provided, with the device mounted to the mounting region. An electrically conductive dam structure is disposed on the sur... | 08/05/2003 |
| 6602730 | Method for gravitation-assisted control of spread of viscous material applied to a substrate A method of forming high definition elements, such as conductive traces on electronic devices or substrates, from or including viscous material. The method includes inverting the electronic components or substrates after the viscous material is applied an... | 08/05/2003 |
| 6597063 | Package for semiconductor power device and method for assembling the same A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating sub... | 07/22/2003 |
| 6589814 | Lead frame chip scale package A method for producing chip scale IC packages includes the step of mounting a lead frame panel on a temporary support fixture in order to provide support and protection during the manufacturing process. An embodiment of the temporary support fixture inclu... | 07/08/2003 |
| 6586105 | Packaging structure and method for automotive components The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixot... | 07/01/2003 |
| 6576995 | Housing for semiconductor chips A housing for semiconductor chips includes a plastic base substrate having a region for accommodating a chip and substrate sides having a patterned metallization layer. One of the sides contacts a chip and another contacts an external electrical connectio... | 06/10/2003 |
| 6573592 | Semiconductor die packages with standard ball grid array footprint and method for assembling the same Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of electrical connection pads is located within the recess. A semicon... | 06/03/2003 |
| 6563202 | Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are conne... | 05/13/2003 |
| 6563212 | Semiconductor device A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with ... | 05/13/2003 |
| 6538322 | Semiconductor device in a recess of a semiconductor plate A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the... | 03/25/2003 |
| 6534711 | Encapsulation package and method of packaging an electronic circuit module A package (104) for encapsulating electronic components (102, 122, 550, 660) has at least two chambers (112, 212). Electronic components and modules within the chambers are interconnected by a leadframe (130) extending between the two chambers. One chambe... | 03/18/2003 |
| 6535388 | Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality... | 03/18/2003 |
| 6531335 | Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the interposer or other substrate. The interposer may be posit... | 03/11/2003 |
| 6521988 | Device for packaging electronic components The invention relates to a device and a method for packaging electronic components (11) having semiconductor chips (5) by means of a mounting frame (1), which is additionally provided with a plastic grid (6) that is disposed on a plastic intermediate subs... | 02/18/2003 |
| 6519846 | Chip size package and method of fabricating the same A chip size package is disclosed herein, as well as a method for fabricating the same. A recess is formed in a surface of semiconductor chip. Bonding pads are formed on a bottom center of the recess and insulating pads 30 are formed on both lateral sides ... | 02/18/2003 |
| 6514847 | Method for making a semiconductor device In a semiconductor device, a plurality of wiring films are formed on a front surface of a base comprising an insulating resin and having electrode-forming holes, the surfaces of the wiring films and the surface of the base being positioned on the same pla... | 02/04/2003 |
| 6501168 | Substrate for an integrated circuit package An enhanced ball grid array substrate package and method for manufacturing the same, where the substrate package includes a metal core having a first surface and a second surface opposite the first surface. The metal core further includes at least one cav... | 12/31/2002 |
| 6492713 | Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes inverting the electrical components after the viscous material is applied and main... | 12/10/2002 |
| 6492203 | Semiconductor device and method of fabrication thereof A semiconductor device fabrication process comprising an encapsulation step of carrying out encapsulation by vacuum pressure differential printing by the use of a liquid resin encapsulant containing a solvent in an amount of from 5% by weight to 50% by we... | 12/10/2002 |
| 6492199 | Method of manufacturing a semiconductor package with improved cross talk and grounding A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film ci... | 12/10/2002 |
| 6489681 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes inverting the electrical components after the viscous material is applied and main... | 12/03/2002 |
| 6483185 | Power module substrate, method of producing the same, and semiconductor device including the substrate A power module substrate includes a ceramic substrate having a circuit pattern formed thereon, and a metal frame with which the ceramic substrate can be joined to a water-cooling type heat sink. The metal frame has a thickness equal to that of the ceramic... | 11/19/2002 |
| 6476470 | Integrated circuit packaging A method of making semiconductor package and the package comprising the steps of providing a base having a plurality of cavities therein, forming a plurality of sets of spaced apart first apertures extending entirely through the base, each of the sets of ... | 11/05/2002 |
| 6472251 | Method for integrated circuit packaging A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in s... | 10/29/2002 |
| 6472732 | BGA package and method for fabricating the same A ball grid array (BGA) package includes a substrate (20) having first and second surfaces. and through holes (30) passing through it. The package further includes a first semiconductor chip (28) which is mounted on the first surface of the substrate (20)... | 10/29/2002 |
| 6472598 | Electromagnetic interference shield device with conductive encapsulant and dam A package for a device includes a substrate having a common voltage plane and a mounting region. The device is mounted to the mounting region. An electrically conductive dam structure is disposed on the upper surface of the substrate circumscribing the pe... | 10/29/2002 |
| 6461896 | Process for mounting electronic device and semiconductor device An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Rece... | 10/08/2002 |
| 6459563 | Method and apparatus for polygonal heat slug An electronic package which has a polygonal shaped heat slug. The heat slug extends from a top surface of a package which has a plurality of vias. The package also has a number of capacitors that are mounted to the top surface. Some of the capacitors are ... | 10/01/2002 |
| 6455929 | Embedded type package of power semiconductor device An embedded type package of power semiconductor device comprises a semiconductor device and a cup. One side of the semiconductor device is connected to a leader and another side of the semiconductor device is connected to the cup. The cup has guiding beve... | 09/24/2002 |
| 6448659 | Stacked die design with supporting O-ring A circuit assembly is formed with a lower die and an upper die, offset and stacked on the lower die. A resilient, e.g., elastomeric, O-ring is disposed about the periphery and adjacent side surfaces of the lower die to support the overhanging parts of the... | 09/10/2002 |
