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| Number | Title | Issue Date |
| 7332822 | Flip chip system with organic/inorganic hybrid underfill composition A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixtur... | 02/19/2008 |
| 7199479 | Chip package structure and process for fabricating the same A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps are formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to... | 04/03/2007 |
| 7122908 | Electronic device package An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In one embodiment, the package utili... | 10/17/2006 |
| 6613978 | Radiation shielding of three dimensional multi-chip modules A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention de... | 09/02/2003 |
| 6583432 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 06/24/2003 |
| 6455864 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 09/24/2002 |
| 6261508 | Method for making a shielding composition The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 07/17/2001 |
| 6262362 | Radiation shielding of three dimensional multi-chip modules The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding tech... | 07/17/2001 |
| 5880403 | Radiation shielding of three dimensional multi-chip modules The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding tech... | 03/09/1999 |
| 5801936 | Semiconductor module for a power conversion device An inverter device includes plural modules, each module being formed by a series circuit having a parallel circuit of a first switching device and a first diode, and a parallel circuit of a second switching device and a second diode, allowing a reduced si... | 09/01/1998 |
| 5635754 | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from p... | 06/03/1997 |
| 5466969 | Intelligent power device module In a semiconductor device module of this invention, on a metal base is formed a metal layer, on which an insulating substrate is formed. On the insulating substrate is formed conducting film patterns, to which a power device and a control device for contr... | 11/14/1995 |
| 5384683 | Intelligent power device module In a semiconductor device module of this invention, on a metal base is formed a metal layer, on which an insulating substrate is formed. On the insulating substrate is formed conducting film patterns, to which a power device and a control device for contr... | 01/24/1995 |
| 5218234 | Semiconductor device with controlled spread polymeric underfill A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A windo... | 06/08/1993 |
