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| Number | Title | Issue Date |
| 7425758 | Metal core foldover package structures Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a re... | 09/16/2008 |
| 7352054 | Semiconductor device having conducting portion of upper and lower conductive layers A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a semiconductor substrate and a plurality of external connecting electrod... | 04/01/2008 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7224062 | Chip package with embedded panel-shaped component A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip i... | 05/29/2007 |
| 7192870 | Semiconductor device and fabrication process therefor A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the... | 03/20/2007 |
| 7180181 | Mesh shaped dam mounted on a substrate A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each ... | 02/20/2007 |
| 6703704 | Stress reducing stiffener ring An electronic structure and associated method of formation. A laminate is solderably coupled to an electronic carrier. A stiffener is adhesively attached to a portion of a surface of the laminate by a stiffener adhesive that is in physically adhesive cont... | 03/09/2004 |
| 6703260 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes A leadframe including offsets extending from a major plane thereof. The offsets extend from the major plane at a non-perpendicular angle thereto. Preferably, the angle of extension, relative to the major plane, is about 45 degrees or less. The offsets may... | 03/09/2004 |
| 6700193 | Semiconductor package with elevated tub The semiconductor device includes tub 5 that is smaller than semiconductor chip 8, and which supports semiconductor chip 8; molded section 12 that is formed by resin-molding around semiconductor chip 8; suspension leads 4, including supporting port... | 03/02/2004 |
| 6686015 | Transferable resilient element for packaging of a semiconductor chip and method therefor A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the ... | 02/03/2004 |
| 6683369 | Semiconductor chip having a supporting member, tape substrate, semiconductor package having the semiconductor chip and the tape substrate A semiconductor chip includes a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area, a pad formed in the first area and a bump ele... | 01/27/2004 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on o... | 01/20/2004 |
| 6680435 | Electronic device and method of fabricating the same An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of ... | 01/20/2004 |
| 6667557 | Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections A method for providing a package for a semiconductor chip that minimizes stresses and strains that arise from differential thermal expansion on chip-to-substrate or chip-to-card interconnections. A collar element of one or more elements is provided. Adhes... | 12/23/2003 |
| 6664643 | Semiconductor device and method for manufacturing the same In a stacked package in which semiconductor chips are stacked in layers, in order to mount the semiconductor chips without damaging the semiconductor chips even when an upper semiconductor chip has a greater size, a first chip 12 is mounted on an interpos... | 12/16/2003 |
| 6665186 | Liquid metal thermal interface for an electronic module A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a ... | 12/16/2003 |
| 6661103 | Apparatus for packaging flip chip bare die on printed circuit boards An apparatus and a method for providing a fully protective package for a flip chip with a protective shield plate and an underfill encapsulant material. The apparatus comprises a semiconductor chip electrically connected by flip chip attachment to a subst... | 12/09/2003 |
| 6657246 | MRAM with an effective noise countermeasure In a magnetic random access memory having a memory device portion (33,34,35) using magnetic material, a high-frequency current suppressor (26) is arranged in the vicinity of the magnetic material to suppress a high-frequency current which flows in the mem... | 12/02/2003 |
| 6650006 | Semiconductor package with stacked chips A semiconductor package with stacked chips is proposed, in which a first chip mounted on and electrically connected to a chip carrier is attached with a rigid interposer thereto, while the rigid interposer has a second chip disposed thereon in a manner th... | 11/18/2003 |
| 6627981 | Resin-packaged semiconductor device A plurality of leads are arrayed around an island (1) to which a semiconductor chip (3) is bonded. A plurality of first wires (4) interconnects each electrode terminal of the semiconductor chip (3) and each of the plurality of leads (2), while a second wi... | 09/30/2003 |
| 6624058 | Semiconductor device and method for producing the same There is provided a semiconductor device in which substantially no deformation of a bonded wire occurs, and a method for producing the semiconductor device. A wiring pattern of a wiring substrate and an electrode of an IC chip are connected by a wire. A c... | 09/23/2003 |
| 6586832 | Semiconductor device and fabrication process thereof A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a sur... | 07/01/2003 |
| 6570259 | Apparatus to reduce thermal fatigue stress on flip chip solder connections The present invention provides a package for a semiconductor chip that minimizes stresses and strains that arise from differential thermal expansion on chip-to-substrate or chip-to-card interconnections. A collar element of one or more elements is provide... | 05/27/2003 |
| 6563212 | Semiconductor device A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with ... | 05/13/2003 |
| 6555900 | Package, semiconductor device and method for fabricating the semiconductor device A package according to the present invention includes: a support for mounting a semiconductor component on the upper surface thereof; a positioning control plate, which is secured to the support and includes an opening or a notch; and a lead provided on t... | 04/29/2003 |
| 6552267 | Microelectronic assembly with stiffening member A flip chip-ball grid array package and a stiffening ring having first and second faces, and grooves formed in at least a one of the first and second faces of the stiffening ring. Providing grooves in at least one of the faces of the stiffening ring impar... | 04/22/2003 |
| 6551862 | Semiconductor device and method of manufacturing the same A semiconductor device is disclosed, comprising a tape substrate which supports a semiconductor chip, an insulating adhesive layer disposed between the semiconductor chip and the tape substrate, an insulating sheet member laminated to the insulating adhes... | 04/22/2003 |
| 6534711 | Encapsulation package and method of packaging an electronic circuit module A package (104) for encapsulating electronic components (102, 122, 550, 660) has at least two chambers (112, 212). Electronic components and modules within the chambers are interconnected by a leadframe (130) extending between the two chambers. One chambe... | 03/18/2003 |
| 6531763 | Interposers having encapsulant fill control features Interposers having an encapsulant fill control feature are disclosed. In one embodiment, an interposer includes a substrate having a first surface proximate the semiconductor component, and a fill control feature projecting from the first surface toward a... | 03/11/2003 |
| 6518090 | Semiconductor device and manufacturing method thereof A semiconductor device includes a circuit board on which a semiconductor chip is mounted via an adhesive resin layer and through which a moisture drain hole is formed. A pit part having a width wider than a diameter of the moisture drain hole is formed in... | 02/11/2003 |
| 6512176 | Semiconductor device In a ball grid array type semiconductor device mounted on a printed wiring board, the external terminals can be prevented from being broken down even when the ambient temperature on the device is repeatedly changed. A flexible adhesive member for gluing t... | 01/28/2003 |
| 6500697 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes A leadframe including offsets extending from a major plane thereof The offsets extend from the major plane at a non-perpendicular angle thereto. Preferably, the angle of extension, relative to the major plane, is about 45 degrees or less. The offsets may ... | 12/31/2002 |
| 6492715 | Integrated semiconductor package The present invention provides an integrated semiconductor module comprising a chip, interposer, and substrate. The module is adapted to be mounted on a traditional circuit card carrying multiple other components. The chip of the present invention can be ... | 12/10/2002 |
| 6489557 | Implementing micro BGA™ assembly techniques for small die The present invention introduces a method of implementing micro BGA. More specifically, the present invention discloses a method of packaging an integrated circuit into an integrated circuit assembly. The method of the present invention first mounts polyi... | 12/03/2002 |
| 6486003 | Expandable interposer for a microelectronic package and method therefor A method of fabricating a microelectronic package comprising an expandable structure includes the steps of providing first and second microelectronic elements having electrically conductive parts, providing the expandable structure between the microelectr... | 11/26/2002 |
| 6483128 | Connecting device for power semiconductor modules with compensation for mechanical stresses A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the slee... | 11/19/2002 |
| 6462414 | Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an pri... | 10/08/2002 |
| 6462405 | Semiconductor package A semiconductor package is proposed, in which a lid is attached to a semiconductor chip and appropriately spaced apart from a heat sink having a top surface thereof exposed to the outside an encapsulant, so as to prevent external moisture from condensing ... | 10/08/2002 |
| 6460245 | Method of fabricating semiconductor chip assemblies A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first s... | 10/08/2002 |
| 6440779 | Semiconductor package based on window pad type of leadframe and method of fabricating the same A new semiconductor packaging technology is proposed for the fabrication of a semiconductor package based on window pad type of leadframe. The proposed semiconductor packaging technology is characterized by the mounting of a window shim having a solid rin... | 08/27/2002 |
