Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 7443024 | Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an... | 10/28/2008 |
| 7425469 | Method for encapsulating an electronic component using a foil layer The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer w... | 09/16/2008 |
| 7419855 | Apparatus and method for miniature semiconductor packages A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent th... | 09/02/2008 |
| 7396741 | Method for connecting substrate and composite element A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensit... | 07/08/2008 |
| 7388281 | Encapsulated electronic component and production method The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of t... | 06/17/2008 |
| 7375435 | Chip package structure A chip package structure comprising a substrate, a chip, a plurality of bumps, some buffer material and some encapsulation is provided. The substrate has a first surface and a corresponding second surface. The chip has an active surface and a back surface. The bumps... | 05/20/2008 |
| 7319275 | Adhesion by plasma conditioning of semiconductor chip A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method c... | 01/15/2008 |
| 7297575 | System semiconductor device and method of manufacturing the same A system semiconductor device includes a system LSI cell portion and a global wiring layer. The system LSI cell portion has a plurality of functional blocks for realizing specific functions on a semiconductor chip. The global wiring layer has a wiring layer on a sem... | 11/20/2007 |
| 7205635 | Hermetic wafer scale integrated circuit structure A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor d... | 04/17/2007 |
| 7202563 | Semiconductor device package having a semiconductor element with resin A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed ... | 04/10/2007 |
| 7186629 | Protecting thin semiconductor wafers during back-grinding in high-volume production A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wa... | 03/06/2007 |
| 7148560 | IC chip package structure and underfill process A novel integrated circuit (IC) chip package structure and underfill process which reduces stress applied to corners of a flip chip in an IC package structure during the application of an adhesive material between the flip chip and a carrier substrate is disclosed. ... | 12/12/2006 |
| 6700184 | Lead frame and semiconductor device having the same There is provided a semiconductor device and a lead frame that form a stable external ring structure wherein bonding strength and mechanical strength between the external ring and sealing resin is improved. A semiconductor device (1) is formed which compr... | 03/02/2004 |
| 6504239 | Semiconductor device having dummy pattern that relieves stress A semiconductor device includes a base substrate which has four sides, a first major surface and a second major surface opposite to the first major surface, and a semiconductor chip which is mounted on the first major surface and has an electrode formed t... | 01/07/2003 |
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by ... | 12/03/2002 |
| 6479402 | Method to improve adhesion of molding compound by providing an oxygen rich film over the top surface of a passivation layer A new method is provided for treating the surface of a layer of passivation where this layer of passivation comprises silicon dioxide or silicon nitride. An oxygen rich layer is created over the surface of the layer of passivation. Under the first embodim... | 11/12/2002 |
| 6445060 | Coated semiconductor die/leadframe assembly and method for coating the assembly A novel method for coating a semiconductor die/leadframe assembly prior to ocncapsulation. The method of the invention comprises coating the exposed surfaces of the die and the inner lead fingers in a die/leadframe assembly with an adhesion promoting mate... | 09/03/2002 |
| 6424047 | Plastic ball grid array package for passing JEDEC Level 1 Moisture Sensitivity Test A plastic ball grid array package is designed to pass the JEDEC Level 1 Moisture Sensitivity Test (the "popcorn test"). The plastic ball grid array design minimizes contact between a mold compound/encapsulate/glob top and metal surfaces. The present plast... | 07/23/2002 |
| 6396135 | Substrate for use in semiconductor packaging A number of techniques and substrate arrangements are described that working individually and in common have been found to significantly improve the environmental resistance of the resulting package. In one aspect, conductive pads (referred to herein as l... | 05/28/2002 |
| 6369452 | Cap attach surface modification for improved adhesion An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a meta... | 04/09/2002 |
| 6342307 | Embedded cluster metal-polymeric micro interface and process for producing the same A micro interface between a polymeric layer and a metal layer includes isolated clusters of metal partially embedded in the polymeric layer. The exposed portion of the clusters is smaller than embedded portions, so that a cross section, taken parallel to ... | 01/29/2002 |
| 6316292 | Adhesion enhanced semiconductor die for mold compound packaging A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by ... | 11/13/2001 |
| 6315936 | Encapsulation method using non-homogeneous molding compound pellets Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The present invention contemplates the use of molding compounds having two or more discrete phases in a t... | 11/13/2001 |
| 6214152 | Lead frame moisture barrier for molded plastic electronic packages Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those... | 04/10/2001 |
| 6194249 | Method of assembly stress protection The invention offers a solution to several problems associated wit IC packages that use a top layer of molded plastic. This has been achieved by inter-posing a dummy layer of dielectric material between the upper surface of the integrated circuit wafer an... | 02/27/2001 |
| 6127099 | Method of producing a semiconductor device A method of producing a semiconductor substrate, particularly one having a buffer coat layer and sealed in a mold resin, is disclosed. The method patterns a polyimide film, etches an insulating film or passivation film using the resulting polyimide patter... | 10/03/2000 |
| 6107690 | Coated semiconductor die/leadframe assembly and method for coating the assembly A novel method for coating a semiconductor die/leadframe assembly prior to encapsulation. The method of the invention comprises coating the exposed surfaces of the die and the inner lead fingers in a die/leadframe assembly with an adhesion promoting mater... | 08/22/2000 |
| 6091157 | Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The present invention contemplates the use of molding compounds having two or more discrete phases in a t... | 07/18/2000 |
| 6090696 | Method to improve the adhesion of a molding compound to a semiconductor chip comprised with copper damascene structures A process used to create a non-smooth, top surface topography, for a semiconductor substrate, needed to improve the adhesion between a protective molding compound, and the underlying top surface of the semiconductor substrate, has been developed. The proc... | 07/18/2000 |
| 6087715 | Semiconductor device, and manufacturing method of the same To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11... | 07/11/2000 |
| 6040395 | Electrical components and method for the fabrication thereof This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of: (i) a mixture of components (a) and (b), (ii) a reaction mix... | 03/21/2000 |
| 5958515 | Electrical components and method for the fabrication thereof This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of: (i) a mixture of components (a) and (b), (ii) a reaction mix... | 09/28/1999 |
| 5937279 | Semiconductor device, and manufacturing method of the same To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11... | 08/10/1999 |
| 5817544 | Enhanced wire-bondable leadframe A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires.... | 10/06/1998 |
| 5785791 | Method of manufacturing semiconductor component A polymeric organic coating (24) used to package a semiconductor component (10) increases voltage isolation, decreases thermal resistance, and increases scratch and abrasion resistance for the semiconductor component (10). The coating (24) is applied to a... | 07/28/1998 |
| 5777385 | Ceramic ball grid array (CBGA) package structure having a heat spreader for integrated-circuit chips An improved package structure for integrated-circuit chips is disclosed. In accordance with a preferred embodiment of the present invention, the integrated-circuit packaged structure comprises a wiring substrate, an integrated-circuit chip, and a heat spr... | 07/07/1998 |
| 5759874 | Method for producing semiconductor element and adhesive sheet for adhering wafer A method for producing a semiconductor element, comprising treating a lead frame or a semiconductor wafer or a semiconductor chip, or a lead frame and a semiconductor chip in combination, with at least one package crack-preventing compound selected from c... | 06/02/1998 |
| 5760480 | Low RC interconnection A low RC delay interconnection pattern is formed with a low resistivity metal, such as copper, and a low dielectric constant material, such as organic polymers. An intermediate bonding layer is formed between the low resistivity metal and low dielectric c... | 06/02/1998 |
| 5742098 | Semiconductor component with plastic sheath and method for producing the same A semiconductor component includes a semiconductor body. At least one contact metallizing covers at least one portion of a surface of the semiconductor body, defining at least one free portion of the surface not covered by the at least one contact metalli... | 04/21/1998 |
| 5622896 | Method of manufacturing a thin silicon-oxide layer A method of providing an ultra-thin ( | 04/22/1997 |
