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| Number | Title | Issue Date |
| 7435625 | Semiconductor device with reduced package cross-talk and loss Structure and method are provided for plastic encapsulated semiconductor devices having reduced package cross-talk and loss. Semiconductor die are first coated with a buffer region having a lower dielectric constant ε and/or lower loss tangent δ than the plastic e... | 10/14/2008 |
| 7417330 | Semiconductor device packaged into chip size and manufacturing method thereof A semiconductor device includes a semiconductor substrate having an integrated circuit and at least one connection pad, and at least one external connection electrode electrically connected with the connection pad. A first sealing material is provided on the semicon... | 08/26/2008 |
| 7387948 | Structure and method of forming a semiconductor material wafer A structure and method of forming a semiconductor material wafer comprising forming an ingot of semiconductor material. A first dielectric layer is formed on the surface of the ingot, and the surface of the first dielectric layer is larger than the surface of the in... | 06/17/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7294529 | Method for embedding a component in a base This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it... | 11/13/2007 |
| 7274110 | Semiconductor component having a CSP housing The invention relates to a semiconductor component for mounting on a printed circuit board. The semiconductor component includes a housing that at least partially surrounds at least one flat semiconductor chip. Electrical contacts are assigned to the semiconductor c... | 09/25/2007 |
| 7273770 | Compliant passivated edge seal for low-k interconnect structures A structure for a chip or chip package is disclosed, with final passivation and terminal metallurgy which are mechanically decoupled but electrically coupled to the multilayer on-chip interconnects. This decoupling allows the chip to survive packaging stresses in th... | 09/25/2007 |
| 7227252 | Semiconductor component having stacked, encapsulated dice and method of fabrication A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ... | 06/05/2007 |
| 7170188 | Package stress management Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in w... | 01/30/2007 |
| 7161252 | Module component A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected o... | 01/09/2007 |
| 7098544 | Edge seal for integrated circuit chips A structure for a chip or chip package is disclosed, with final passivation and terminal metallurgy which are mechanically decoupled but electrically coupled to the multilayer on-chip interconnects. This decoupling allows the chip to survive packaging stresses in th... | 08/29/2006 |
| 6703261 | Semiconductor device and manufacturing the same A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink ... | 03/09/2004 |
| 6700210 | Electronic assemblies containing bow resistant semiconductor packages A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member encapsulating the molded inner member. The inner member ri... | 03/02/2004 |
| 6696748 | Stress balanced semiconductor packages, method of fabrication and modified mold segment Stress balanced semiconductor device packages, a method of forming, and a method of modifying a mold segment for use in the method. A semiconductor die is attached to one side of a substrate having discrete conductive elements such as a ball grid array (B... | 02/24/2004 |
| 6683250 | Protected electronic assembly A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electron... | 01/27/2004 |
| 6677672 | Structure and method of forming a multiple leadframe semiconductor device A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coup... | 01/13/2004 |
| 6664643 | Semiconductor device and method for manufacturing the same In a stacked package in which semiconductor chips are stacked in layers, in order to mount the semiconductor chips without damaging the semiconductor chips even when an upper semiconductor chip has a greater size, a first chip 12 is mounted on an interpos... | 12/16/2003 |
| 6651320 | Method for mounting semiconductor element to circuit board The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a ... | 11/25/2003 |
| 6649446 | Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof A method of manufacturing a hermetic package. In one embodiment, the method includes: (1) forming a plurality of contact-sensitive electronic devices on a device substrate, each of the plurality of devices having an active surface, (2) providing a mountin... | 11/18/2003 |
| 6642137 | Method for manufacturing a package structure of integrated circuits A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of... | 11/04/2003 |
| 6628043 | Electronic component and method of production thereof An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electricall... | 09/30/2003 |
| 6628526 | Electronic device manufacturing method, electronic device and resin filling method The present invention provides an electronic device manufacturing method and an electronic device which make it possible to reduce the waste of materials and the number of manufacturing steps required. Electronic devices are manufactured via a process inc... | 09/30/2003 |
| 6607941 | Process and structure improvements to shellcase style packaging technology A variety of improved shell case style packages as well as shell case style wafer level packaging processes are described. Generally, in shell case style packaging, traces are patterned on the top surface of a wafer. In some embodiments, the conductors fo... | 08/19/2003 |
| 6605779 | Electronic control unit The present invention protects a thin wire connection from oscillation of a resin protecting an electronic circuit module from vibration, impact, and corrosion. An electronic control unit including an electronic circuit module in which a bare chip is moun... | 08/12/2003 |
| 6597063 | Package for semiconductor power device and method for assembling the same A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating sub... | 07/22/2003 |
| 6596566 | Conformal-coated pick and place compatible devices Conformal-coated devices packaged to be compatible with automated handling equipment. In one arrangement, open-sided, injection-molded shells are mounted around conformal-coated devices to provide dimensionally stable packaging that is compatible with dev... | 07/22/2003 |
| 6583432 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 06/24/2003 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an ... | 05/27/2003 |
| 6559529 | Press-fit diode for universal mounting A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allo... | 05/06/2003 |
| 6534874 | Semiconductor device and method of producing the same Through holes are provided in the inner electrodes of a second semiconductor chip, electrodes capable of being plated by electroless plating are formed on the inner walls of the through holes while being insulated from other electrodes, the second semicon... | 03/18/2003 |
| 6531770 | Electronic part unit attached to a circuit board and including a cover member covering the electronic part An electronic part unit comprises an electronic part body which has a semiconductor chip and a plurality of external connection electrodes electrically connected to the semiconductor chip and in which the semiconductor chip is encapsulated such that the e... | 03/11/2003 |
| 6518204 | Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one ... | 02/11/2003 |
| 6495927 | Resin-molded unit including an electronic circuit component A resin-molded unit (1) includes a semiconductor bear chip (2) arranged inside and sealed in an epoxy resin mold (3). The resin-molded unit is entirely covered with a magnetic loss film (5) as a high-frequency current suppressor. It is preferable that the... | 12/17/2002 |
| 6492194 | Method for the packaging of electronic components A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the exter... | 12/10/2002 |
| 6492724 | Structure for reinforcing a semiconductor device to prevent cracking A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over ... | 12/10/2002 |
| 6482680 | Flip-chip on lead frame There is disclosed a flip-chip-type method of assembling semiconductor devices. The proposed invention offer one step encapsulation process to promote adhesion of die to the lead finger and prevent the potential of shorts from developing between the adjac... | 11/19/2002 |
| 6458609 | Semiconductor device and method for manufacturing thereof A semiconductor device includes first and second semiconductor chips. The first semiconductor chip is formed with a plurality of first electrodes on a surface thereof, while the second semiconductor chip is formed with a plurality of second electrodes on ... | 10/01/2002 |
| 6455864 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 09/24/2002 |
| 6452253 | Method and apparatus for magnetic shielding of an integrated circuit Disclosed are a method and apparatus which provide a magnetic shield for integrated circuits containing electromagnetic circuit elements. The shield is formed of a magnetically permeable material, which may be a non-conductive magnetic oxide, and either p... | 09/17/2002 |
| 6443298 | Surface package type semiconductor package and method of producing semiconductor memory In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture be... | 09/03/2002 |
