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| Number | Title | Issue Date |
| 7435993 | High temperature, high voltage SiC void-less electronic package An electronic package designed to package silicon carbide discrete components for silicon carbide chips. The electronic package allows thousands of power cycles and/or temperature cycles between −55° C. to 300° C. The present invention can also tolerate continuo... | 10/14/2008 |
| 7425469 | Method for encapsulating an electronic component using a foil layer The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer w... | 09/16/2008 |
| 7411284 | Accessible electronic storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 08/12/2008 |
| 7407832 | Method for manufacturing semiconductor package A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mi... | 08/05/2008 |
| 7405470 | Adaptable electronic storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 07/29/2008 |
| 7378301 | Method for molding a small form factor digital memory card A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash ... | 05/27/2008 |
| 7352070 | Polymer encapsulated electrical devices Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an... | 04/01/2008 |
| 7327032 | Semiconductor package accomplishing fan-out structure through wire bonding Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can ... | 02/05/2008 |
| 7276398 | System and method for hermetically sealing a package A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic s... | 10/02/2007 |
| 7268438 | Semiconductor element including a wet prevention film A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 09/11/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7250687 | Systems for degating packaged semiconductor devices with tape substrates A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a ... | 07/31/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7239023 | Package assembly for electronic device A buffer layer is formed on a substrate and then electronic devices are packed on the buffer layer in the present invention, and problems of lower hermeticity and complex process in the conventional arts can be avoided. Therefore, the present invention provides a pa... | 07/03/2007 |
| 7199458 | Stacked offset semiconductor package and method for fabricating In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first sem... | 04/03/2007 |
| 7170183 | Wafer level stacked package Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically con... | 01/30/2007 |
| 7161252 | Module component A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected o... | 01/09/2007 |
| 7132752 | Semiconductor chip and semiconductor device including lamination of semiconductor chips To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a mai... | 11/07/2006 |
| 7119449 | Enhancement of underfill physical properties by the addition of thermotropic cellulose An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on... | 10/10/2006 |
| 7098544 | Edge seal for integrated circuit chips A structure for a chip or chip package is disclosed, with final passivation and terminal metallurgy which are mechanically decoupled but electrically coupled to the multilayer on-chip interconnects. This decoupling allows the chip to survive packaging stresses in th... | 08/29/2006 |
| 6700178 | Package of a chip with beveled edges A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered ont... | 03/02/2004 |
| 6700209 | Partial underfill for flip-chip electronic packages An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of th... | 03/02/2004 |
| 6686663 | Semiconductor device and a method of manufacturing the same Two memory chips mounted over a base substrate have the same external size and a flash memory of the same memory capacity formed thereon. These memory chips are mounted over the base substrate with one of them being overlapped with the upper portion of th... | 02/03/2004 |
| 6673708 | Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder... | 01/06/2004 |
| 6665190 | Modular PC card which receives add-in PC card modules A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Car... | 12/16/2003 |
| 6651320 | Method for mounting semiconductor element to circuit board The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a ... | 11/25/2003 |
| 6653725 | Chip package and method of manufacturing the same A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first substrate arranged on the first surface o... | 11/25/2003 |
| 6650006 | Semiconductor package with stacked chips A semiconductor package with stacked chips is proposed, in which a first chip mounted on and electrically connected to a chip carrier is attached with a rigid interposer thereto, while the rigid interposer has a second chip disposed thereon in a manner th... | 11/18/2003 |
| 6645792 | Lead frame and method for fabricating resin-encapsulated semiconductor device The lead frame of the present invention is a lead frame used in resin encapsulation of a semiconductor chip using an encapsulation mold that includes a die cavity to be filled with an encapsulation resin, the lead frame including: a first region exposed t... | 11/11/2003 |
| 6646338 | Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument A semiconductor device which does not require solder resist to be applied to the surface. Leads 54 are formed on one surface of a polyimide film 10, external connection terminals 11 are formed on the leads 54 to project from the other surface of the polyi... | 11/11/2003 |
| 6642611 | Storage apparatus, card type storage apparatus, and electronic apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 dispose... | 11/04/2003 |
| 6639324 | Flip chip package module and method of forming the same A flip-chip package module consists of a semiconductor chip, a heat sink plate, a dielectric layer and a metal interconnect layer. The semiconductor chip has a positive side with a plurality of die pads located thereon and a back side for mounting onto th... | 10/28/2003 |
| 6628043 | Electronic component and method of production thereof An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electricall... | 09/30/2003 |
| 6625037 | Printed circuit board and method manufacturing the same A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal... | 09/23/2003 |
| 6624005 | Semiconductor memory cards and method of making same Alternative methods for making memory cards for computers and such eliminate a need for a separate external housing and a separate chip encapsulation step and enable more memory to be packaged in a same-sized card. One of said methods includes providing a... | 09/23/2003 |
| 6620648 | Multi-chip module with extension A multi-chip module may include a pair of chips which are arranged one over the other on each side of a laminate layer. A central passage through the laminate layer provides a passage to wire bond a chip on a first side of the laminate layer to contacts o... | 09/16/2003 |
| 6621156 | Semiconductor device having stacked multi chip module structure A semiconductor device in which a plurality of semiconductor chips are stacked. The semiconductor device includes a lower semiconductor chip bonded onto a surface of a wiring substrate; an upper semiconductor chip; and one or more spacers which are bonded... | 09/16/2003 |
| 6621172 | Semiconductor device and method of fabricating the same, circuit board, and electronic equipment A first semiconductor chip is mounted on a substrate on which an interconnect pattern is formed, and a surface of the first semiconductor chip having electrodes faces the substrate. A second semiconductor chip is mounted on the first semiconductor chip. E... | 09/16/2003 |
| 6621169 | Stacked semiconductor device and method of producing the same In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit... | 09/16/2003 |
| 6617525 | Molded stiffener for flexible circuit molding A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A molded stiffener is formed on a flexible tape at the same time ... | 09/09/2003 |
