Bizarre Patents
A fork with timer for providing a cue to a user after an elapsed period of time for indicating that another bite of food using the fork may be taken.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7432603 | Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Tab... | 10/07/2008 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.... | 07/08/2008 |
| 7382059 | Semiconductor package structure and method of manufacture In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating ma... | 06/03/2008 |
| 7352070 | Polymer encapsulated electrical devices Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an... | 04/01/2008 |
| 7332822 | Flip chip system with organic/inorganic hybrid underfill composition A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixtur... | 02/19/2008 |
| 7319276 | Substrate for pre-soldering material and fabrication method thereof A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such... | 01/15/2008 |
| 7312536 | Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight ... | 12/25/2007 |
| 7190082 | Low stress flip-chip package for low-K silicon technology An underfill includes a base material and a filler material added to the base material wherein the filler material constitutes a selected percentage by weight of the underfill to provide an optimum balance between interfacial die stress and solder bump strain for ne... | 03/13/2007 |
| 7071577 | Semiconductor device and resin binder for assembling semiconductor device In a semiconductor device of a structure comprising a thin semiconductor element bonded to a reinforcing plate via a bonding layer of a predetermined thickness, resin binder used for forming the bonding layer contains fillers including a first filler, which has a di... | 07/04/2006 |
| 6703128 | Thermally-capacitive phase change encapsulant for electronic devices An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phas... | 03/09/2004 |
| 6700073 | Semiconductor device A silicone resin for sealing a semiconductor chip. A cured silicone resin, which is obtained by curing the silicone resin at a given temperature, has a percent elongation, after fracture, measured at a room temperature, not less than 4% of a penetration n... | 03/02/2004 |
| 6674172 | Flip-chip package with underfill having low density filler A method and structure for solderably coupling a semiconductor chip to a substrate, with an underfill between the chip and the substrate. In forming the structure, underfill material is dispensed upon a conductive pad on the substrate. The underfill mater... | 01/06/2004 |
| 6674178 | Semiconductor device having dispersed filler between electrodes In a semiconductor device, a semiconductor pellet having bump electrodes and a interconnection board having pad electrodes are brought into mutual opposition with a resin containing a filler therebetween, so that the bump electrode and the pad electrodes ... | 01/06/2004 |
| 6624504 | Semiconductor device and method for manufacturing the same A semiconductor apparatus includes a semiconductor device having circuit electrodes aligned centrally of the semiconductor apparatus. A first electrically insulating layer is formed on said semiconductor device with said circuit electrodes being exposed f... | 09/23/2003 |
| 6611065 | Connection material The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating fill... | 08/26/2003 |
| 6599775 | Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die ... | 07/29/2003 |
| 6583432 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 06/24/2003 |
| 6569532 | Epoxy resin compositions and premolded semiconductor packages In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2 /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 μ... | 05/27/2003 |
| 6538210 | Circuit component built-in module, radio device having the same, and method for producing the same A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a fir... | 03/25/2003 |
| 6486006 | Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet ... | 11/26/2002 |
| 6482521 | Structure with blended polymer conformal coating of controlled electrical resistivity A conformally coated structure includes a component of an electronic assembly, such as a microelectronic device, a part of a package, or an electrically conductive trace, and a conformal coating applied to a surface of the structure. The conformal coating... | 11/19/2002 |
| 6469086 | Plastic molding compound, composite body, and filler for a plastic molding compound An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by... | 10/22/2002 |
| 6455864 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 09/24/2002 |
| 6399677 | Epoxy resin compositions and premolded semiconductor packages In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2 /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 μ... | 06/04/2002 |
| 6395807 | Fine spherical silica and liquid sealing resin composition containing same The fine spherical silica having a particle size distribution in which maximum particle diameter is 24 μm, average particle diameter is 1.7 to 7 μm, and the proportion X1 of particles having a particle diameter of 3 μm or less in the total p... | 05/28/2002 |
| 6383660 | Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same An epoxy resin composition for encapsulating a semiconductor device comprising as essential components (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; and (D) a hollow inorganic filler having an average particle size of 4 to 100 μm an... | 05/07/2002 |
| 6376915 | Semiconductor device and semiconductor chip A semiconductor device having a semiconductor chip bonded to the surface of a solid body (another semiconductor chip or wiring board). A hollow enclosed space surrounding a connection member is formed between the solid body surface and the surface of the ... | 04/23/2002 |
| 6376101 | Epoxy resin composition and semiconductor devices The present invention provides an epoxy resin composition having excellent moldability, flame retardancy and soldering resistance and low in water absorption. More specifically, it provides an epoxy resin composition for semiconductor encapsulation compri... | 04/23/2002 |
| 6365269 | Plastic compositions for sheathing a metal or semiconductor body The adhesion of plastic to metal surfaces is improved by adding a specific filler in the sheathing material. The filler is formed of spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages wherein the... | 04/02/2002 |
| 6326237 | Reworkable thermoplastic hyper-branched encapsulant The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate;... | 12/04/2001 |
| 6319740 | Multilayer protective coating for integrated circuits and multichip modules and method of applying same Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque coating composition is applied so as to form an opaque coatin... | 11/20/2001 |
| 6300686 | Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet ... | 10/09/2001 |
| 6287985 | Process for applying a molten droplet coating for integrated circuits Disclosed is a method of forming an opaque coating on an integrated circuit or multichip module. A coating composition is prepared and then heated to a temperature sufficient to transform the coating composition to a molten state. Next, the molten coating... | 09/11/2001 |
| 6265768 | Chip scale package A chip scale package mainly comprises a semiconductor chip disposed on an upper surface of a substrate and sealed by a package body. The package body comprises a resin base material divided into a first region and a second region. The resin base material ... | 07/24/2001 |
| 6261508 | Method for making a shielding composition The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 07/17/2001 |
| 6261680 | Electronic assembly with charge-dissipating transparent conformal coating A coated electronic assembly comprises an electronic assembly, and a single-layer conformal coating overlying at least a portion of the electronic assembly. The conformal coating has a volume electrical resistivity of from about 108 to about 10... | 07/17/2001 |
| 6221509 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic... | 04/24/2001 |
| 6207296 | Inorganic filler, epoxy resin composition, and semiconductor device By removing a fraction of fine particles having a particle size of less than 2 μm from starting inorganic filler particles having a mean particle size of 10-50 mm and adding thereto particles having a mean particle size of 0.1-2 μm and a specific surfac... | 03/27/2001 |
| 6201309 | Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same A reusable packaging material for semiconductor devices. The semiconductor device package is formed from a thermoplastic resin. The resin has good fluidity and good adhesion. The new package is recyclable because the thermoplastic resin hardening process ... | 03/13/2001 |
| 6194491 | Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinone An epoxy resin composition comprises (A) a biphenyl epoxy resin, (B) a phenolic resin curing agent having a naphthalene structure, (C) a curing accelerator comprising an addition product of a triphenylphosphine and benzoquinone, and (D) an inorganic fille... | 02/27/2001 |
