Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7382041 | Organic-inorganic composite insulating material for electronic element, method of producing same and field-effect transistor comprising same A method of producing an organic-inorganic composite insulating material for electronic element comprises subjecting a mixture of an organic polymer or its solution and a metal alkoxide or its solution as a starting material to sol-gel reaction of the metal alkoxide... | 06/03/2008 |
| 7365414 | Component packaging apparatus, systems, and methods Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved s... | 04/29/2008 |
| 7332822 | Flip chip system with organic/inorganic hybrid underfill composition A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixtur... | 02/19/2008 |
| 7319276 | Substrate for pre-soldering material and fabrication method thereof A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such... | 01/15/2008 |
| 7312536 | Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight ... | 12/25/2007 |
| 7288435 | Method for producing a cover, method for producing a packaged device In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devi... | 10/30/2007 |
| 7238552 | Method and apparatus for depositing tungsten after surface treatment to improve film characteristics A method and system to form a refractory metal layer over a substrate includes introduction of a reductant, such as PH3 or B2H6, followed by introduction of a tungsten containing compound, such as WF6, to form a tungsten l... | 07/03/2007 |
| 7230337 | Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same The present invention reduces the effective dielectric constant of the interlayer insulating film while inhibiting the decrease of the reliability of the semiconductor device, which otherwise is caused by a moisture absorption. A copper interconnect comprising a Cu ... | 06/12/2007 |
| 7226812 | Wafer support and release in wafer processing Methods and apparatuses for wafer support and release using sacrificial materials in wafer processing. In one embodiment, a solution of a sacrificial polymer is spray-coated on the wafer bump side to form a thin layer of the sacrificial polymer after solvent vaporiz... | 06/05/2007 |
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ... | 05/01/2007 |
| 7170188 | Package stress management Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in w... | 01/30/2007 |
| 7119449 | Enhancement of underfill physical properties by the addition of thermotropic cellulose An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on... | 10/10/2006 |
| 6700073 | Semiconductor device A silicone resin for sealing a semiconductor chip. A cured silicone resin, which is obtained by curing the silicone resin at a given temperature, has a percent elongation, after fracture, measured at a room temperature, not less than 4% of a penetration n... | 03/02/2004 |
| 6696317 | Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin In a flip-chip type semiconductor device, a plurality of pad electrodes are formed on a semiconductor substrate. An insulating stress-absorbing resin layer made of thermosetting resin is adhered to the substrate as a composite layer in conjunction with a ... | 02/24/2004 |
| 6683250 | Protected electronic assembly A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electron... | 01/27/2004 |
| 6674158 | Semiconductor die package having a UV cured polymeric die coating A permanent protective semiconductor die coating made from a polymer that is fully curable through exposure to ultra violet light. A mixture of polymer resin and a photoactive compound is applied to the die and then cured through exposure to ultraviolet l... | 01/06/2004 |
| 6674016 | Electronic component An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circui... | 01/06/2004 |
| 6670430 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the ... | 12/30/2003 |
| 6664344 | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition c... | 12/16/2003 |
| 6664318 | Encapsulant compositions with thermal shock resistance A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backb... | 12/16/2003 |
| 6660811 | Epoxy resin composition and curing product thereof An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring su... | 12/09/2003 |
| 6657031 | Reworkable thermosetting resin compositions This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), land grid arrays ("LGAs"), and the like, each of which... | 12/02/2003 |
| 6657245 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 12/02/2003 |
| 6646064 | Reacting epoxy resin with p-containing dihydric phenol or naphthol A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a b... | 11/11/2003 |
| 6641928 | Adhesives and electric devices An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin... | 11/04/2003 |
| 6638631 | Thermal stable low elastic modulus material and device using the same The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of -50° C. to... | 10/28/2003 |
| 6638352 | Thermal stable low elastic modulus material and device using the same The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of -50° C. to... | 10/28/2003 |
| 6632881 | Encapsulant of epoxy resin and liquid aromatic amine curing agent An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprisi... | 10/14/2003 |
| 6632893 | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling ... | 10/14/2003 |
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copo... | 10/07/2003 |
| 6627683 | Reworkable thermosetting resin compositions and compounds useful therein Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided ... | 09/30/2003 |
| 6624216 | No-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the compo... | 09/23/2003 |
| 6624504 | Semiconductor device and method for manufacturing the same A semiconductor apparatus includes a semiconductor device having circuit electrodes aligned centrally of the semiconductor apparatus. A first electrically insulating layer is formed on said semiconductor device with said circuit electrodes being exposed f... | 09/23/2003 |
| 6621173 | Semiconductor device having an adhesive and a sealant A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal... | 09/16/2003 |
| 6620512 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or o... | 09/16/2003 |
| 6617630 | Resin-encapsulated semiconductor apparatus and process for its fabrication The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed... | 09/09/2003 |
| 6617698 | Reworkable and thermally conductive adhesive and use thereof Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used t... | 09/09/2003 |
| 6617701 | Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A)... | 09/09/2003 |
| 6617046 | Thermosetting resin composition and semiconductor device using the same A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconduct... | 09/09/2003 |
| 6617400 | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, a... | 09/09/2003 |
