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| Number | Title | Issue Date |
| 7439575 | Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories A pre-metal dielectric structure of a SONOS memory structure includes a UV light-absorbing film, which prevents the ONO structure from being electronically charged in response to UV irradiation. In one embodiment, the pre-metal dielectric structure includes a first ... | 10/21/2008 |
| 7439621 | Radio frequency signal processing device The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source electrodes, a gate electrode and a drain electrode. And multiple through holes... | 10/21/2008 |
| 7436055 | Packaging method of a plurality of chips stacked on each other and package structure thereof A package structure with a plurality of chips stacked on each other includes a substrate, a first chip and second chip. The substrate has a dielectric layer, a metal layer having a conducting trace area and a shielding area formed on the dielectric layer, and a sold... | 10/14/2008 |
| 7411279 | Component interconnect with substrate shielding An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive la... | 08/12/2008 |
| 7408259 | Sheet to form a protective film for chips A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder ... | 08/05/2008 |
| 7397140 | Chip module A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. ... | 07/08/2008 |
| 7390742 | Method for producing a rewiring printed circuit board The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and th... | 06/24/2008 |
| 7385283 | Three dimensional integrated circuit and method of making the same A three dimensional integrated circuit structure includes at least first and second devices, each device comprising a substrate and a device layer formed over the substrate, the first and second devices being bonded together in a stack, wherein the bond between the ... | 06/10/2008 |
| 7382046 | Semiconductor device protection cover, and semiconductor device unit including the cover A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the... | 06/03/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7339796 | Electrical circuit having a multilayer printed circuit board An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit board are in the form of contact areas which are connected to a respectiv... | 03/04/2008 |
| 7327015 | Semiconductor device package A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall... | 02/05/2008 |
| 7304369 | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit s... | 12/04/2007 |
| 7301224 | Surface acoustic wave device and manufacturing method of the same A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap ... | 11/27/2007 |
| 7279792 | Semiconductor device and method of manufacturing same According to this invention, a semiconductor device has an upper surface on which an external connection electrode is formed and a lower surface which opposes the upper surface and is in a mirror surface state. A roughened region roughened by laser marking is formed... | 10/09/2007 |
| 7259041 | Method for the hermetic encapsulation of a component For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first cont... | 08/21/2007 |
| 7245003 | Stacked package electronic device An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched bet... | 07/17/2007 |
| 7239222 | High frequency circuit module A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed b... | 07/03/2007 |
| 7227240 | Semiconductor device with wire bond inductor and method A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L... | 06/05/2007 |
| 7224056 | Back-face and edge interconnects for lidded package A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facin... | 05/29/2007 |
| 7224062 | Chip package with embedded panel-shaped component A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip i... | 05/29/2007 |
| 7170147 | Dissipative isolation frames for active microelectronic devices, and methods of making such dissipative isolation frames Microelectronic apparatus having protection against high frequency crosstalk radiation, comprising: a planar insulating substrate; an active semiconductor electronic device located over a first region of the insulating substrate; and a doped semiconductor located in... | 01/30/2007 |
| 7157794 | Semiconductor device that suppresses variations in high frequency characteristics of circuit elements A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first area formed with a high-frequency circuit element and a second area located around the first area and formed with a low-frequency circuit element. The... | 01/02/2007 |
| 7157290 | Magnetically shielded circuit board A magnetically shielded circuit board having a conductive solenoid to repel high speed charged particles away from an integrated circuit chip. The conductive solenoid is embedded in the circuit board, or located around the circuit board, or located within an integra... | 01/02/2007 |
| 7151011 | Integrated circuit die having an interference shield A package for housing a device (e.g., an integrated circuit chip or die) includes a Faraday cage. The Faraday cage is at least partially formed in the integrated circuit die. The die includes conductive vias and solder balls surrounding a circuit. The package can be... | 12/19/2006 |
| 7148084 | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating the... | 12/12/2006 |
| 7129571 | Semiconductor chip package having decoupling capacitor and manufacturing method thereof A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on th... | 10/31/2006 |
| 7112883 | Semiconductor device with temperature control mechanism A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conduc... | 09/26/2006 |
| 7075179 | System for implementing a configurable integrated circuit The present invention provides a system for implementing a configurable integrated circuit (IC). Aspects of the invention include an IC die; a plurality of input/outputs (I/Os) coupled to the IC die; and a plurality power planes coupled to the IC die for providing p... | 07/11/2006 |
| 6696369 | Method of creating shielded structures to protect semiconductor devices An apparatus on a wafer, including; a first metal layer of a wall, a second metal layer of the wall, a third metal layer of the wall including; one or more base frames, a fourth metal layer of the wall including; one or more vertical frame pairs each on t... | 02/24/2004 |
| 6695985 | Electromagnetic wave suppressor sheet An electromagnetic wave suppressor sheet formed into a sheet-like shape out of a material made of synthetic resin in which powder of conjugated magnetic particles surface-treated with an insulating inorganic material has been dispersed.... | 02/24/2004 |
| 6693334 | Semiconductor integrated circuit device A shield portion 5 has such a multi-layer wiring construction comprised of three wiring layers as to correspond to a macro cell and also via contacts formed with a predetermined spacing therebetween and is supplied with a predetermined potential (for exam... | 02/17/2004 |
| 6687108 | Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways The present invention relates to a universal multi-functional common conductive shield structure plus two electrically opposing differential energy pathways which in part uses a electrode shielding architecture with stacked conductive hierarchy progressio... | 02/03/2004 |
| 6683512 | High frequency module having a laminate board with a plurality of dielectric layers A high frequency module according to the present invention comprises a laminate board having a plurality of dielectric layers (11 to 18) stacked one on another, a branch filter circuit (DIP10) for separating a plurality of transceiver systems from each ot... | 01/27/2004 |
| 6683795 | Shield cap and semiconductor package including shield cap A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semicond... | 01/27/2004 |
| 6681487 | Method of manufacturing a composite overmolded heat pipe The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or... | 01/27/2004 |
| 6667874 | Structure for eliminating electromagnetic interference caused by central processing unit A structure for eliminating electromagnetic interference caused by CPU includes a fixing seat, onto which two conductive members having a plurality of elastic contacts are mounted. Each of the conductive members is formed at two ends with two contact wing... | 12/23/2003 |
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring A ball grid array semiconductor package is proposed, wherein at least a chip is mounted on a substrate, and signal pads on the chip are electrically connected to signal fingers on the substrate by bonding wires. A power plate and a ground plate are each a... | 12/23/2003 |
| 6666703 | Connector for integrated circuits, and assembly for use on integrated circuits A connector has an inner case connected to a circuit board by reflow soldering, an outer case slidable back and forth on the inner case, and a cover covering the surface of a CPU disposed on the outer case. The cover has a plated metal shield on its surfa... | 12/23/2003 |
| 6664613 | Magnetic shielding for integrated circuits A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic... | 12/16/2003 |
