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Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 5459352 | Integrated circuit package having a liquid metal-aluminum/copper joint An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is charac... | 10/17/1995 |
| 5455738 | High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit A circuit card assembly thermal core includes a composite material that includes particles of diamond and a conductive metal such as aluminum, copper, nickel and beryllium and which may be made by pressure infiltration casting. The diamond particles are 1... | 10/03/1995 |
| 5453293 | Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects Particles including a first material and having a first value of an intrinsic property such as thermal conductivity or coefficient of thermal expansion are coated, by a method such as electroless plating, electrolytic plating, sputtering, or spraying, wit... | 09/26/1995 |
| 5437921 | Electronic components mounting base material A base material for mounting electronic components is provided which has a low density and a coefficient of thermal expansion close to that of aluminum and can be processed with ease. The base material essentially consists of aluminum or an aluminum alloy... | 08/01/1995 |
| 5413751 | Method for making heat-dissipating elements for micro-electronic devices High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum, the proportions of which are a... | 05/09/1995 |
| 5412160 | Circuit board A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity ... | 05/02/1995 |
| 5409864 | Substrate for semiconductor apparatus This invention relates to a substrate for mounting a semiconductor chip in an integrated circuit wherein a sintered compact containing copper at 2 to 30 wt. % and tungsten and/or molybdenum is employed as a substrate which efficiently radiates heat develo... | 04/25/1995 |
| 5402004 | Heat transfer module for ultra high density and silicon on silicon packaging applications A system for dissipating heat from semiconductor chips disposed on a substrate which may individually produce differing amounts of heat, the substrate secured to a device uniformly distributing the heat produced by the chips thereover in the form of a met... | 03/28/1995 |
| 5365108 | Metal matrix composite semiconductor power switch assembly A power semiconductor assembly, particularly a semiconductor switch assembly which has a number of discrete emitter connection pads, comprised of a metal matrix composite housing and a copper or aluminum post with a cross-sectional area sufficiently large... | 11/15/1994 |
| 5350713 | Design and sealing method for semiconductor packages Several methods of forming an integrated circuit package by ultrasonically welding a thermal plastic material which joins two housing portions together in such a fashion as to seal an integrated circuit within the two housing portions is described along w... | 09/27/1994 |
| 5338602 | Article of manufacture An encapsulated electrical or electronic device having a first layer of electrically insulating material which is then covered by another layer filled with a thermally conductive material such as mesophase pitch based carbon fibers or graphite particles. ... | 08/16/1994 |
| 5323294 | Liquid metal heat conducting member and integrated circuit package incorporating same An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat con... | 06/21/1994 |
| 5316080 | Heat transfer device Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat si... | 05/31/1994 |
| 5310520 | Circuit system, a composite material for use therein, and a method of making the material Discrete powder particles of copper 14 and INVAR 12 are mixed together in a container 16 and packed into a powder metal article. This article is hot vacuum degassed and vacuum sealed and then heated to temperature well below the sintering temperature of c... | 05/10/1994 |
| 5309321 | Thermally conductive screen mesh for encapsulated integrated circuit packages An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosett... | 05/03/1994 |
| 5306571 | Metal-matrix-composite An improved PWB thermal plane assembly having a low CTE and high thermal conductivity comprising a first and second outer layer of aluminum, at least one intermediate layer comprising a metal matrix reinforced with graphite fibers and a layer of aluminum ... | 04/26/1994 |
| 5298791 | Thermally conductive electrical assembly A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to wh... | 03/29/1994 |
| 5296310 | High conductivity hydrid material for thermal management A hybrid structural material combines high thermal conductivity and pre-determined mechanical properties compatible with adjacent or attached materials. It has three elements: (1) a non-structural, high thermal conductivity core material which defines the... | 03/22/1994 |
| 5294477 | Functionally gradient circuit board A functionally gradient circuit board is constituted by a mixture of a metal and an insulating ceramic composition, the abundance ratio of the metal component to the component of the insulating ceramic composition being changed in the direction of thickne... | 03/15/1994 |
| 5259436 | Fabrication of metal matrix composites by vacuum die casting Metal matrix composites are manufactured in a vacuum die casting machine. Solid aggregate material, at least 65 volume percent, is placed in a die, the die is evacuated and heated, and molten metal is driven by a piston to infiltrate the solid aggregate m... | 11/09/1993 |
| 5254811 | Hybrid microchip bonding article An article for tape-automated bonding of integrated circuit microchips comprises a carrier sheet (22) carrying conductive tracks (23) with a tubular metal formation (21) passing through the sheet at the end of each track for connection to a microchip (24)... | 10/19/1993 |
| 5236779 | Article of manufacture An encapsulated electrical or electronic device having a first layer of electrically insulating material which is then covered by another layer filled with thermally conductive fibers such as mesophase pitch based carbon fibers. Both layers are of the sam... | 08/17/1993 |
| 5224356 | Method of using thermal energy absorbing and conducting potting materials A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or a... | 07/06/1993 |
| 5224017 | Composite heat transfer device A composite heat transfer device is disclosed, for mounting with an object having a predetermined coefficient of thermal expansion, including a composite heat conductive member having a quantity of first and second materials; the first material having a p... | 06/29/1993 |
| 5224030 | Semiconductor cooling apparatus Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat si... | 06/29/1993 |
| 5218215 | Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path A semiconductor device package is disclosed which facilitates the dissipation of heat generated by the enclosed semiconductor device. The package comprises a housing apparatus having a plurality of portions, a holding apparatus having a semiconductor devi... | 06/08/1993 |
| 5213868 | Thermally conductive interface materials and methods of using the same A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to wh... | 05/25/1993 |
| 5205353 | Heat exchanging member A heat exchanging member, more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component ma... | 04/27/1993 |
| 5198189 | Liquid metal matrix thermal paste A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react wi... | 03/30/1993 |
| 5194316 | Laminar polymeric sheet A sheet laminate of polyimide and amorphous polyamide especially suitable for making anisotropically electrically conductive articles by laser abiation drilling followed by metal plating. Preferred polyimides include those derived from polymerization of 4... | 03/16/1993 |
| 5173256 | Liquid metal matrix thermal paste A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react wi... | 12/22/1992 |
| 5163499 | Method of forming electronic packages The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second mater... | 11/17/1992 |
| 5150274 | Multi-chip-module A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling sys... | 09/22/1992 |
| 5137283 | Thermally conductive gasket device A gasket is formed by encapsulating a thermally conductive low melting temperature material or core in a plastic skin. The low melting temperature material conforms to the shape of the interface completely filling all voids once heated above its melting t... | 08/11/1992 |
| 5133403 | Cooling arrangement for semiconductor devices and method of making the same A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN... | 07/28/1992 |
| 5134463 | Stress relief layer providing high thermal conduction for a semiconductor device A semiconductor chip (27) is soldered on an electrode plate (24) with a thermal relaxation plate (40) therebetween. The thermal relaxation plate has a frame member (41) made of covar or invar and a plate member (42) made of copper. The plate member is ins... | 07/28/1992 |
| 5120495 | High thermal conductivity metal matrix composite A thermally conductive diamond metal composite comprising 5 to 80 volume percent diamond particles having a particle size ranging from about 1 to 50 μm and a metal matrix comprising a thermally conductive metal. Preferably, a fine metal powder having par... | 06/09/1992 |
| 5113315 | Heat-conductive metal ceramic composite material panel system for improved heat dissipation For use as a substrate for a heat generating microelectronic integrated circuit, a ceramic panel is provided having small thickness in comparison to its length and breadth, having on at least the surface opposite the one bearing the microelectronic integr... | 05/12/1992 |
| 5099310 | Substrate for semiconductor apparatus This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the ... | 03/24/1992 |
| 5086333 | Substrate for semiconductor apparatus having a composite material This invention relates to a substrate for mounting a semiconductor chip in an integrated circuit wherein a sintered compact containing copper at 2 to 30 wt. % and tungsten and/or molybdenum is employed as a substrate which efficiently radiates heat develo... | 02/04/1992 |
