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| Number | Title | Issue Date |
| 7372148 | Semiconductor chip having coolant path, semiconductor package and package cooling system using the same The present invention relates to a semiconductor chip coolant path, a semiconductor package utilizing the semiconductor chip coolant path, and a cooling system for the semiconductor package. For effective dissipation of heat generated during semiconductor chip opera... | 05/13/2008 |
| 7348604 | Light-emitting module The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for opera... | 03/25/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7304380 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 12/04/2007 |
| 7304379 | Semiconductor device with pipe for passing refrigerant liquid A semiconductor device includes 1) a conductive pipe including an inner surface forming an inner space shaping a path of an insulative cooling refrigerant liquid and an outer surface including a plane potion partially formed thereof, 2) a power semiconductor element... | 12/04/2007 |
| 7298044 | Electronic device with heat dissipation module An electronic device. The electronic device includes a circuit board, a heat dissipation module, and a light-emitting diode. The circuit board includes a heating element thereon. The heat dissipation module is disposed on the circuit board and the heating element. T... | 11/20/2007 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
| 7193316 | Integrated circuit coolant microchannel with movable portion According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume o... | 03/20/2007 |
| 6704200 | Loop thermosyphon using microchannel etched semiconductor die as evaporator The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and suc... | 03/09/2004 |
| 6702003 | Three-phase heat transfer structure A three-phase heat transfer structure includes a heat conducting plate, a heat sink mounted on the heat conducting plate near one end, a thermal tube embedded in and extended through two distal ends of the heat conducting plate, and a phase change materia... | 03/09/2004 |
| 6698503 | Heat transferring device having adiabatic unit A heat transferring device having an adiabatic unit is provided. The heat transferring device includes a lower plate including an evaporator which contacts a heating element and allows a liquid refrigerant to absorb heat transferred from the heating eleme... | 03/02/2004 |
| 6695039 | Orientation insensitive thermosiphon assembly for cooling electronic components A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear... | 02/24/2004 |
| 6695040 | Thin planar heat distributor A thin planar heat distributor is introduced to include a foil-like plate having a top surface with a channel pattern and an overlapping part for sealing the top surface. The channel pattern presents a radiation-and-interval arrangement and includes a plu... | 02/24/2004 |
| 6695041 | Double heat exchange module for a portable computer A double heat exchange module for a portable computer, which is applied to cool an integrated circuit within the portable computer. The double heat exchange module includes a thermally conductive structure, a fan, and a heat exchanger. The thermally condu... | 02/24/2004 |
| 6688377 | Loop heat pipe modularized heat exchanger A circuit type modularized heat exchanger system comprises a heat exchange unit and a vapor chamber. The vapor chamber is jointed to the bottom of the heat exchange unit. The vapor chamber has a hollow space with a wick layer and the hollow space communic... | 02/10/2004 |
| 6687122 | Multiple compressor refrigeration heat sink module for cooling electronic components A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions simil... | 02/03/2004 |
| 6687125 | Cooling system for integrated circuit chip In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator ... | 02/03/2004 |
| 6681840 | Heat sink with enhanced heat spreading and compliant interface for better heat transfer Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing t... | 01/27/2004 |
| 6681487 | Method of manufacturing a composite overmolded heat pipe The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or... | 01/27/2004 |
| 6679081 | Pumped liquid cooling system using a phase change refrigerant An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evapo... | 01/20/2004 |
| 6679316 | Passive thermal spreader and method A passive thermal spreader and method of fabrication are disclosed. The passive thermal spreader includes a heat transfer plate formed from laminated plates including an internal sealed thermosyphon defined within the interface of the plates. The preferre... | 01/20/2004 |
| 6679317 | Cooling device boiling and cooling refrigerant, with main wick and auxiliary wick In a cooling device for cooling a heat-generating member, a refrigerant tank includes a heat-receiving wall onto which the heat-generating member is attached in an attachment area, and a radiation wall opposite to the heat-receiving wall. A main wick is p... | 01/20/2004 |
| 6674643 | Thermal connector for transferring heat between removable printed circuit boards A thermal connector to transfer heat from one PCB to another, without interfering with the convenient removal and replacement of the PCBs and without increasing the force required to connect or deconnect the PCBs. The thermal connector comprises a first p... | 01/06/2004 |
| 6667885 | Attachment of a single heat dissipation device to multiple components with vibration isolation A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the inven... | 12/23/2003 |
| 6666260 | Scalable and modular heat sink-heat pipe cooling system Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical ... | 12/23/2003 |
| 6666261 | Liquid circulation cooler A liquid cooler (1) includes a body (10) and a cover (20) attached on the body. The body includes a base (12) with a first cavity (126) accommodating liquid, a central hollow cylinder (16) having a passage (164) in communication with the first cavity, and... | 12/23/2003 |
| 6665187 | Thermally enhanced lid for multichip modules An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the ... | 12/16/2003 |
| 6661660 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that ... | 12/09/2003 |
| 6651735 | Evaporator of CPL cooling apparatus having fine wick structure An evaporator of a capillary pumped loop (CPL) cooling apparatus having a fine wick structure is provided. The evaporator having a flat board shape, of a capillary pumped loop (CPL) cooling apparatus includes a coolant storing part for storing in-flowing ... | 11/25/2003 |
| 6650543 | Heat dissipation device A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The c... | 11/18/2003 |
| 6650544 | Integrated circuit chip cooling structure with vertical mounting through holes An integrated circuit chip cooling structure is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between said top and bottom plate member, the top and bottom plate members each having a plura... | 11/18/2003 |
| 6647625 | Method for fabricating a heat pipe structure in a radiating plate A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only one opening. Then, only one o... | 11/18/2003 |
| 6646341 | Heat sink apparatus utilizing the heat sink shroud to dissipate heat In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. ... | 11/11/2003 |
| 6643133 | Buckling device of a heat dissipating module A buckling device of a heat dissipating module comprises a retaining seat, a connecting element and a pressing element. The retaining seat has a plurality of legs extended from two opposite sides, each leg having a buckling hole. The connecting element ha... | 11/04/2003 |
| 6639799 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that ... | 10/28/2003 |
| 6637501 | Heat dissipation device The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion correspond... | 10/28/2003 |
| 6631755 | Thermal module with temporary heat storage A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase ch... | 10/14/2003 |
| 6625021 | Heat sink with heat pipes and fan A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the a... | 09/23/2003 |
| 6623279 | Separable power delivery connector A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a se... | 09/23/2003 |
| 6625022 | Direct heatpipe attachment to die using center point loading An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.... | 09/23/2003 |
