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| Number | Title | Issue Date |
| 7427809 | Repairable three-dimensional semiconductor subsystem A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector compr... | 09/23/2008 |
| 7425760 | Multi-chip module structure with power delivery using flexible cables One embodiment of the present invention provides an integrated circuit module. This module includes a semiconductor die with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The module uses a flexible cabl... | 09/16/2008 |
| 7414313 | Polymeric conductor donor and transfer method The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component of a device. The present invention also relates to methods pertinent ... | 08/19/2008 |
| 7378294 | Wafer-level sealed microdevice having trench isolation and methods for making the same A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60 | 05/27/2008 |
| 7378734 | Stacked contact bump A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights... | 05/27/2008 |
| 7378742 | Compliant interconnects for semiconductors and micromachines A compliant interconnect is described that is useful for coupling semiconductor dies to other components. In one embodiment, the interconnect includes a base to couple to a first component and an arch extending from and integral with the base to couple to a second c... | 05/27/2008 |
| 7335988 | Use of palladium in IC manufacturing with conductive polymer bump An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point, are provided. The pr... | 02/26/2008 |
| 7335979 | Device and method for tilted land grid array interconnects on a coreless substrate package An article of manufacture and system, as well as fabrication methods therefore, may include a plurality of lands disposed on a surface of a substrate wherein the lands are oriented at an angle to the surface of the substrate and further wherein the substrate is form... | 02/26/2008 |
| 7325302 | Method of forming an interconnection element A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than t... | 02/05/2008 |
| 7312522 | Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device A mounting member of a semiconductor device according to the present invention includes a wiring substrate to input and/or output actuating signals to a semiconductor device, a power supplying conductor plate to supply actuating power to the semiconductor device, an... | 12/25/2007 |
| 7288842 | Power semiconductor module with auxiliary connection Introduced is a power semiconductor module preferably a disk cell with a power semiconductor element arranged in the interior of the housing. In a preferred embodiment, the disk cell has two load and at least one auxiliary connection and the auxiliary connection ext... | 10/30/2007 |
| 7279788 | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, i... | 10/09/2007 |
| 7253514 | Self-supporting connecting element for a semiconductor chip A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for c... | 08/07/2007 |
| 7230328 | Semiconductor package and laminated semiconductor package A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by t... | 06/12/2007 |
| 7205673 | Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing A bond pad structure which includes an aluminum bond pad which include one or more dopants that effectively control the growth of IMC to a nominal level in spite of high tensile stresses in the wafer. For example, aluminum can be doped with 1–2 atomic % of Mg. Alt... | 04/17/2007 |
| 7196412 | Multi-chip press-connected type semiconductor device A multi-chip press-connected type semiconductor device comprises: a plurality of active element chips to control an electric current flowing in one direction; a plurality of diode chips that transmit the current in a direction opposite to the current transmitting di... | 03/27/2007 |
| 7192806 | Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, i... | 03/20/2007 |
| 7154171 | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor A semiconductor stacking structure has a semiconductor device. A flexible substrate is coupled to a bottom surface of the semiconductor device. The flexible substrate is folded over on at least two sides to form flap portions. The flap portions are coupled to an upp... | 12/26/2006 |
| 7151313 | Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment Methods are provided to form wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment, with which highly reliable electrical wirings having minute wiring patterns can be formed. In wiring forming method for a tile-sh... | 12/19/2006 |
| 7148082 | Method of making a semiconductor chip assembly with a press-fit ground plane A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an o... | 12/12/2006 |
| 7138299 | Method of electrically connecting a microelectronic component A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elonga... | 11/21/2006 |
| 7119362 | Method of manufacturing semiconductor apparatus In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by... | 10/10/2006 |
| 6685817 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 02/03/2004 |
| 6686658 | Semiconductor device, including an arrangement to provide a uniform press contact and converter using same In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies inside is arranged between a main electrode of the semiconductor device and a main electrode plate, or between an intermediate electrode plate arran... | 02/03/2004 |
| 6677673 | Clamping assembly for high-voltage solid state devices A clamping assembly for use in conjunction with high voltage solid state devices. The clamping assembly includes a clamp frame having upper and lower clamping plates substantially composed of aluminum and joined together by four dielectric rods composed o... | 01/13/2004 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an... | 12/30/2003 |
| 6670698 | Integrated circuit package mounting A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated co... | 12/30/2003 |
| 6655023 | Method and apparatus for burning-in semiconductor devices in wafer form Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect... | 12/02/2003 |
| 6656754 | Method of forming a semiconductor chip carrier A chip carrier for temporarily connecting a semiconductor chip to a testing device. The chip carrier includes a substrate having a first set of contact points for electrically engaging the testing device and a second set of contact points to be connected ... | 12/02/2003 |
| 6649441 | Method for fabricating a microcontact spring on a substrate The invention relates to a method for fabricating a microcontact spring on a substrate (1) with at least one contact pad (2) and a first insulator layer (13) with a window above the contact pad (2). In order to enable the cost-effective contact-connection or w... | 11/18/2003 |
| 6644982 | Method and apparatus for the transport and tracking of an electronic component An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an ope... | 11/11/2003 |
| 6640432 | Method of fabricating shaped springs A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a s... | 11/04/2003 |
| 6642625 | Sockets for "springed" semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an in... | 11/04/2003 |
| 6627483 | Method for mounting an electronic component A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elon... | 09/30/2003 |
| 6624448 | Semiconductor device with multiple supporting points A semiconductor device having a supporting member that reduces a resonance phenomenon. A pair of reinforcing members is fixed on a gate drive substrate with spacers interposed there between and upright portions of the pair of reinforcing members are faste... | 09/23/2003 |
| 6624648 | Probe card assembly A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of t... | 09/23/2003 |
| 6615485 | Probe card assembly and kit, and methods of making same A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereo... | 09/09/2003 |
| 6608384 | Semiconductor device and method of forming the same A semiconductor device includes a bonding-structure for electrically and mechanically bonding a solder ball to the electrode pad. The bonding-structure includes flexible arms that are connected to a common supporting layer that allows a relative displacem... | 08/19/2003 |
| 6605870 | Pressure-contact type semiconductor device A pressure-contact type semiconductor device comprises a plurality of semiconductor elements (IGBTs) which are in pressure contact with one another, and in which first main electrodes are electrically connected to a first common main power source plate (p... | 08/12/2003 |
| 6580613 | Solder-free PCB assembly An electronic component assembly is disclosed. The electronic component assembly may comprise a printed circuit board, a frame secured to the printed circuit board and one or more electronic components mounted in the frame and arranged in electrical conta... | 06/17/2003 |
