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| Number | Title | Issue Date |
| 7420270 | Tape wiring substrate and chip-on-film package using the same A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having u... | 09/02/2008 |
| 7408253 | Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density The present invention includes a chip-embedded support-frame wrapped-by-flex-circuit package assembly. The package assembly includes a flex circuit having a plurality of patterned connecting-traces. The package assembly further includes a plurality of semiconductor ... | 08/05/2008 |
| 7405475 | Method and system of tape automated bonding A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of t... | 07/29/2008 |
| 7393718 | Unmolded package for a semiconductor device A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type devi... | 07/01/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a... | 05/13/2008 |
| 7368805 | Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal driver chip mounted to a flexible substrate. The wires extending from th... | 05/06/2008 |
| 7353595 | Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands for testing the driver IC mounted on the tape substrate, and a plating... | 04/08/2008 |
| 7342311 | Electronic unit integrated into a flexible polymer body A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, a... | 03/11/2008 |
| 7339262 | Tape circuit substrate and semiconductor apparatus employing the same A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply vol... | 03/04/2008 |
| 7335975 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 02/26/2008 |
| 7335973 | Adhesive of folder package A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible ... | 02/26/2008 |
| 7279778 | Semiconductor package having a high-speed signal input/output terminal A semiconductor package including a flexible tape having a mounting portion and an extended portion, a plurality of arrayed connection electrodes provided on the mounting portion of the flexible tape, and a semiconductor chip mounted on the mounting portion of the f... | 10/09/2007 |
| 7256496 | Semiconductor device having adhesion increasing film to prevent peeling A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is... | 08/14/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7217990 | Tape package having test pad on reverse surface and method for testing the same A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card ... | 05/15/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7186584 | Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the ... | 03/06/2007 |
| 7176072 | Strained silicon devices transfer to glass for display applications A method of fabricating strained silicon devices for transfer to glass for display applications includes preparing a wafer having a silicon substrate thereon; forming a relaxed SiGe layer on the silicon substrate; forming a strained silicon layer on the relaxed SiGe... | 02/13/2007 |
| 7170145 | Method of manufacturing semiconductor device, flexible substrate, and semiconductor device A semiconductor chip 6 is mounted on a flexible substrate 1 wherein internal connecting electrodes 4 to be connected to protruding electrodes 7 on an element surface of the semiconductor chip 6 and wires 3 for connecting the... | 01/30/2007 |
| 7154171 | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor A semiconductor stacking structure has a semiconductor device. A flexible substrate is coupled to a bottom surface of the semiconductor device. The flexible substrate is folded over on at least two sides to form flap portions. The flap portions are coupled to an upp... | 12/26/2006 |
| 7144758 | Manufacturing method of semiconductor device, including differently spaced bump electrode arrays First bump electrodes are arrayed in a straight line along a first side of a semiconductor chip. Second bump electrodes are more narrowly arrayed in a zigzag arrangement along a second side of the chip. By carrying out an injection of a sealing resin from the second... | 12/05/2006 |
| 7145249 | Semiconducting device with folded interposer Some embodiments of the present invention relate to a semiconducting device that includes an interposer having a fold which divides the interposer into a first section and a second section. A first die is attached to a first surface of the interposer at the first an... | 12/05/2006 |
| 7132746 | Electronic assembly with solder-bonded heat sink A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the h... | 11/07/2006 |
| 7115980 | Mounting structure, electro-optical device, and electronic apparatus An electro-optical device includes: a first substrate having an end edge; a second substrate that has an edge crossing the end edge and a plurality of first wiring lines crossing the end edge, the second substrate having flexibility and being connected to the first ... | 10/03/2006 |
| 7109575 | Low-cost flexible film package module and method of manufacturing the same Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film packa... | 09/19/2006 |
| 6703567 | Conductor track layer structure and prestage thereof The invention relates to a conductor track layer structure precursor stage with conductor tracks, which are disposed on an electrically insulating substrate with an inner region and a lateral peripheral region and which are connected via conductor track c... | 03/09/2004 |
| 6699737 | Method of manufacturing a semiconductor device Salient electrodes on a semiconductor chip and leads on a film substrate are to be connected together with a high accuracy. A change in lead pitch which occurs at the time of connecting salient electrodes on a semiconductor chip and inner leads on a film ... | 03/02/2004 |
| 6686015 | Transferable resilient element for packaging of a semiconductor chip and method therefor A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the ... | 02/03/2004 |
| 6683369 | Semiconductor chip having a supporting member, tape substrate, semiconductor package having the semiconductor chip and the tape substrate A semiconductor chip includes a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area, a pad formed in the first area and a bump ele... | 01/27/2004 |
| 6677055 | Tape structure and manufacturing method A tape structure and method of fabricating the tape structure. The method includes plating a metal such as silver, bismuth, gold, magnesium, nickel, or palladium over leads so that recess cavities and whiskers on the leads are greatly reduced.... | 01/13/2004 |
| 6674155 | Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected... | 01/06/2004 |
| 6670215 | Semiconductor device and manufacturing method thereof A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bon... | 12/30/2003 |
| 6670696 | Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof A slit is formed in a polyimide substrate and a copper wiring pattern is formed on the surface of the polyimide substrate. Moreover, solder resist, which has a young's modulus in the range of 5 kgf/mm2 to 70 kgf/mm2 and contains a fi... | 12/30/2003 |
| 6664135 | Method of manufacturing a ball grid array type semiconductor package A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bon... | 12/16/2003 |
| 6664131 | Method of making ball grid array package with deflectable interconnect A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the can... | 12/16/2003 |
| 6660626 | Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base and a conductive trace. The conductive trace includes a pillar and a routing line. An electrolessly plated contact t... | 12/09/2003 |
| 6655022 | Implementing micro BGA assembly techniques for small die A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substra... | 12/02/2003 |
| 6653575 | Electronic package with stacked connections and method for making same An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates ... | 11/25/2003 |
| 6653736 | Multilayer flexible wiring boards A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of... | 11/25/2003 |
