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| Number | Title | Issue Date |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7361976 | Data carrier with a module with a reinforcement strip In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41 | 04/22/2008 |
| 7227240 | Semiconductor device with wire bond inductor and method A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L... | 06/05/2007 |
| 6686651 | Multi-layer leadframe structure A leadframe and a package including the leadframe are disclosed. At least one lead includes a nonconductive layer on the inner end segment of the lead set back from its inner end. An electrically conductive layer is on a surface of the nonconductive layer... | 02/03/2004 |
| 6620648 | Multi-chip module with extension A multi-chip module may include a pair of chips which are arranged one over the other on each side of a laminate layer. A central passage through the laminate layer provides a passage to wire bond a chip on a first side of the laminate layer to contacts o... | 09/16/2003 |
| 6093957 | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The lead frame structure for the semiconductor package includes a... | 07/25/2000 |
| 6002165 | Multilayered lead frame for semiconductor packages A multi layered semiconductor lead frame, and a semiconductor package fabricated using the lead frame are provided. The lead frame includes a lead plate having multiple die mounting sites configured for molding multiple semiconductor packages. The lead pl... | 12/14/1999 |
| 5977617 | Semiconductor device having multilayer film carrier A semiconductor device includes multilayer film carriers, a plurality of connection layers having innerleads protruded from the film carriers, and a semiconductor chip having electrode pads connected to the innerleads.... | 11/02/1999 |
| 5854094 | Process for manufacturing metal plane support for multi-layer lead frames A process for manufacturing a metal plane support for making multi-layer lead frames adapted to be used for semiconductor devices. The lead frame support is made of a single thin metal strip having a plurality of lead frames continuously arranged in the l... | 12/29/1998 |
| 5777265 | Multilayer molded plastic package design A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of die... | 07/07/1998 |
| 5726490 | Semiconductor device A leadframe assembly is used in which a ground metal plane (1) having a ground external lead (2), an annular insulating tape (4), a power supply metal plane (5) having a power supply external lead (6), an annular insulating tape (4') and a leadframe (7) h... | 03/10/1998 |
| 5559369 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 09/24/1996 |
| 5410180 | Metal plane support for multi-layer lead frames and a process for manufacturing such frames A metal plane support structure of a semiconductor device multi-layer lead frame having one or more metal planes, of different types, arranged in stacked and aligned relationship with and adhered to a corresponding lead frame. Metal planes of a common typ... | 04/25/1995 |
| 5399809 | Multi-layer lead frame for a semiconductor device A multi-layer lead frame for a semiconductor device includes a signal layer made of a metal strip having a signal pattern including a plurality of lead lines. A power supply or ground layer is adhered and laminated to the signal layer by means of an adhes... | 03/21/1995 |
| 5309021 | Semiconductor device having particular power distribution interconnection arrangement A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a pow... | 05/03/1994 |
| 5309024 | Multilayer package The present invention provides a multilayer ceramic package, which comprises a conductive layer, formed like a square layer, applying a power voltage VDD or a ground voltage VSS to a semiconductor device, and having a square hole in ... | 05/03/1994 |
| 5304844 | Semiconductor device and method of producing the same A semiconductor device is provided having a semiconductor pellet that is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film ... | 04/19/1994 |
| 5281556 | Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane A process for manufacturing a multi-layer semiconductor lead frame comprising the step of adhering a lead frame strip to a metal power supply plane strip and a metal ground plane strip.... | 01/25/1994 |
| 5250844 | Multiple power/ground planes for tab A TAB lead frame having concentric power/ground planes provides for even distribution of power and ground potentials about the periphery of an integrated circuit. An electrically conductive plane is divided into multiple concentric power/ground planes, ea... | 10/05/1993 |
| 5250839 | Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates A multi-layer leadframe according to this invention is formed by laminating on a leadframe body an insulating layer and an electrically conductive layer in this order. The electrically conductive plate includes a planar portion and a given number of termi... | 10/05/1993 |
| 5243496 | Molded case integrated circuit with a dynamic impedance reducing device A device for reducing dynamic impedances in a molded case integrated circuit comprises a chip (15) and several annular metal planes (21, 22) separated from each other by an insulating film (27, 28), each plane comprising, on its external border, legs (23,... | 09/07/1993 |
| 5237205 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 08/17/1993 |
| 5235209 | Multi-layer lead frame for a semiconductor device with contact geometry A multi-layer lead frame for a semiconductor device comprises a lead frame body made of a metal strip having a first opening and a plurality of inner leads having respective innertips which define the opening. A metal plane independent from the lead frame... | 08/10/1993 |
| 5231756 | Process for manufacturing a multi-layer lead frame A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a m... | 08/03/1993 |
| 5227662 | Composite lead frame and semiconductor device using the same A composite lead frame comprising a lead frame (10), leads (28) supported on a plastic film (22 ') having a device hole (24), and a metal (14, 32) for mounting a semiconductor chip (34) is disclosed. The lead frame (10) has a plurality of inner lead porti... | 07/13/1993 |
| 5212405 | Composite lead frame A composite lead frame in which an island formed with a greater diameter than that of a semiconductor device to be mounted is attached to a lead frame main body having leads being integrally protruded inward, the top ends of the leads are bonded with corr... | 05/18/1993 |
| 5208188 | Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process A method is described for making a multilayer lead frame assembly for an integrated circuit die package comprising a planar metal lead frame; at least one layer of insulating tape, provided with a b-stage adhesive on each surface thereof; and a planar met... | 05/04/1993 |
| 5196725 | High pin count and multi-layer wiring lead frame A high pin count and multi-layer lead frame according to the present invention which has a short pitch, high density lead pattern and at the same time, enhanced transmission characteristics for high-frequency signals includes at least one pair of conducti... | 03/23/1993 |
| 5105257 | Packaged semiconductor device and semiconductor device packaging element A packaged semiconductor device includes trapezoidal power leads and an earth lead in a resin package. The power and earth leads have a large area, radiate heat, and reduce inductance, improving the electrical characteristics of the packaged semiconductor... | 04/14/1992 |
| 5068708 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 11/26/1991 |
| 5032895 | Semiconductor device and method of producing the same A semiconductor device comprising the fact that a semiconductor pellet is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film... | 07/16/1991 |
| 5025114 | Multi-layer lead frames for integrated circuit packages A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved ... | 06/18/1991 |
| 4994936 | Molded integrated circuit package incorporating decoupling capacitor A decoupling capacitor is attached directly to an IC lead frame and thereafter encapsulated within a molded package along with an IC chip resulting in a decoupling scheme which is internal to the molded IC package. The capacitor preferably comprises a thi... | 02/19/1991 |
| 4975761 | High performance plastic encapsulated package for integrated circuit die A high performance plastic-encapsulated integrated circuit package is disclosed having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes below the signal lines which includes an electrically con... | 12/04/1990 |
| 4891687 | Multi-layer molded plastic IC package A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive coated insulation tape. A second insulating tape layer is us... | 01/02/1990 |
| 4835120 | Method of making a multilayer molded plastic IC package A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive coated insulation tape. A second insulating tape layer is us... | 05/30/1989 |
