Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 7372142 | Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid... | 05/13/2008 |
| 7341889 | Lead frame for semiconductor package and method of fabricating semiconductor package Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attac... | 03/11/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7323364 | Stacked module systems and method A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the comb... | 01/29/2008 |
| 7304371 | Lead frame having a lead with a non-uniform width A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width t... | 12/04/2007 |
| 7279778 | Semiconductor package having a high-speed signal input/output terminal A semiconductor package including a flexible tape having a mounting portion and an extended portion, a plurality of arrayed connection electrodes provided on the mounting portion of the flexible tape, and a semiconductor chip mounted on the mounting portion of the f... | 10/09/2007 |
| 7242078 | Surface mount multichip devices A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame... | 07/10/2007 |
| 7224053 | Semiconductor device responsive to different levels of input and output signals and signal processing system using the same A semiconductor device which integrates a plurality of semiconductor chips into a single package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of first bonding pads outputting first signals hav... | 05/29/2007 |
| 7091595 | Semiconductor device with semiconductor chip and rewiring layer and method for producing the same The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall t... | 08/15/2006 |
| 6692991 | Resin-encapsulated semiconductor device and method for manufacturing the same The resin-encapsulated semiconductor device of the present invention includes: a die pad provided by thinning a lower portion of a lead frame; a semiconductor chip mounted on the die pad; a plurality of leads provided by thinning an upper portion of the l... | 02/17/2004 |
| 6633080 | Semiconductor device A transistor (200) is provided with a semiconductor chip (1) inside a resin package (20). An outer lead (41, 42, 43, 44) is arranged on a first side surface (23) of the resin package (20) to serve as an external drain electrode. A lead frame (5) includes ... | 10/14/2003 |
| 6630726 | Power semiconductor package with strap A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multip... | 10/07/2003 |
| 6613829 | Conductive hardening resin for a semiconductor device and semiconductor device using the same Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor chip and a wiring material including lead terminals via a ... | 09/02/2003 |
| 6608373 | Support structure for power element A support structure of a power element includes a conductive mounting platform, a lead frame and a conductive lead. The conductive mounting platform includes an envelope engaging member, an interior conductive surface and an exterior conductive surface. T... | 08/19/2003 |
| 6569712 | Structure of a ball-grid array package substrate and processes for producing thereof An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting with solder balls and a heat sink layer is bonded to the ... | 05/27/2003 |
| 6566739 | Dual chip package The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes ... | 05/20/2003 |
| 6521982 | Packaging high power integrated circuit devices The invention provides a method and apparatus for electrically connecting the die of a high power semiconductor device to a substrate with a conductive strap such that the connection is resistant to the shear stresses resulting with changes in temperature... | 02/18/2003 |
| 6498389 | Ultra-thin semiconductor package device using a support tape An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of... | 12/24/2002 |
| 6475834 | Method of manufacturing a semiconductor component and semiconductor component thereof A method of manufacturing a semiconductor component includes coupling a clip bond (230) from a semiconductor chip (120) to a lead frame (110) and dividing the clip bond into at least first and second portions separated from each other.... | 11/05/2002 |
| 6459147 | Attaching semiconductor dies to substrates with conductive straps This invention provides a method apparatus for electrically connecting a semiconductor die, such as a power MOSFET, to a substrate on which the die is mounted, e.g., a lead frame, with a conductive strap, such that the connection is resistant to the shear... | 10/01/2002 |
| 6455778 | Micro-flex technology in semiconductor packages Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire ... | 09/24/2002 |
| 6452802 | Symmetrical package for semiconductor die A semiconductor package contains a plurality of sheet metal leads that are attached to one or more terminals on a top side of a semiconductor die. A heat sink is attached to a terminal on a bottom side of the die. Each of the leads extends across the die ... | 09/17/2002 |
| 6444490 | Micro-flex technology in semiconductor packages Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire ... | 09/03/2002 |
| 6423580 | Method for manufacturing a dual chip package The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes ... | 07/23/2002 |
| 6403402 | Semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 06/11/2002 |
| 6390853 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam are herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuse... | 05/21/2002 |
| 6369441 | Method of producing a semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 04/09/2002 |
| 6351025 | Semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 02/26/2002 |
| 6339252 | Electronic device package and leadframe The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. In one embodiment, the package includes an integrated circuit device on a metal die pad... | 01/15/2002 |
| 6326243 | Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin A semiconductor chip having a plurality of electrodes on its surface is fixed onto a die pad. The leads are spaced away from the die pad and connected to the electrodes of the semiconductor chip by means of a TAB tape. The die pad is substantially equal i... | 12/04/2001 |
| 6323541 | Structure for manufacturing a semiconductor die with copper plated tapes A structure of manufacture of a semiconductor die on a lead-on-chip (LOC) packaging using a flexible copper plated tape and a standard lead frame is disclosed. A semiconductor die with bonding pads in the center is interconnected to a flexible copper plat... | 11/27/2001 |
| 6319755 | Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe A method of making an integrated circuit package is disclosed. A conductive first adhesive is applied onto a leadframe pad of a leadframe. A conductive second adhesive is applied on an input portion of the leadframe, such as a leadframe member that is int... | 11/20/2001 |
| 6320248 | Lead frame and method of fabricating semiconductor device including the lead frame There is provided a lead frame including first and second rows of inner leads each of which is electrically connected to an associated electrode of a semiconductor chip and which are situated at opposite sides about the semiconductor chip, first and secon... | 11/20/2001 |
| 6307256 | Semiconductor package with a stacked chip on a leadframe The present invention provides a leadframe package formed by flip chip on leadframe technique. The chips are face to face attached on both sides of the leadframe surface. Another embodiment according to the present invention is that the chips are back to ... | 10/23/2001 |
| 6300673 | Edge connectable metal package There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected t... | 10/09/2001 |
| 6300687 | Micro-flex technology in semiconductor packages Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire ... | 10/09/2001 |
| 6258629 | Electronic device package and leadframe and method for making the package The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. The package includes an integrated circuit device on a metal die pad. A metal ring is b... | 07/10/2001 |
| 6256200 | Symmetrical package for semiconductor die A semiconductor package contains a plurality of sheet metal leads that are attached to one or more terminals on a top side of a semiconductor die. A heat sink is attached to a terminal on a bottom side of the die. Each of the leads extends across the die ... | 07/03/2001 |
| 6211053 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 04/03/2001 |
| 6140153 | Lead frame, the manufacturing method, semiconductor device and the manufacturing method To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 10/31/2000 |
