Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 7439612 | Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector In certain embodiments, a leadframe structure for forming one or more integrated circuit packages includes a number of adjacent substantially parallel lead bars adapted to receive a die associated with an integrated circuit at one or more of the lead bars such that ... | 10/21/2008 |
| 7394147 | Semiconductor package A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the su... | 07/01/2008 |
| 7391112 | Capping copper bumps A structure including a substrate, a copper bump formed over the substrate, and a barrier layer comprising an alloy of at least one of iron and nickel, formed over the copper bump, and methods to make such a structure. ... | 06/24/2008 |
| 7375417 | NANO IC packaging A package for an integrated circuit includes a chip having a plurality of nodes adapted to receive signals from or to output signals to an external circuit; and a frame having a plurality of contact points each coupled to one node of the chip and to a pad, wherein e... | 05/20/2008 |
| 7371675 | Method and apparatus for bonding a wire A method and apparatus for bonding a wire and a wire bond device formed by the same are disclosed. The method includes providing a carrier with at least a first pad, providing a semiconductor chip having at least the second pad, the at least second pad being smaller... | 05/13/2008 |
| 7368806 | Flip chip package with anti-floating structure A flip chip package with an anti-floating structure includes a leadframe, a flip chip, and a plurality of solders. The leadframe includes a plurality of leads and a fastening part. At least one locking hole is formed on an upper surface of the fastening part. The fl... | 05/06/2008 |
| 7274093 | Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulatio... | 09/25/2007 |
| 7247942 | Techniques for joining an opto-electronic module to a semiconductor package The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using... | 07/24/2007 |
| 7190060 | Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first semiconductor chip and a first lead that is bent outside the first i... | 03/13/2007 |
| 7141869 | Electronic package for image sensor, and the packaging method thereof A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defin... | 11/28/2006 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one l... | 11/21/2006 |
| 7081666 | Lead frame structure with aperture or groove for flip chip in a leaded molded package A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach... | 07/25/2006 |
| 6635961 | Electronic component of a high frequency current suppression type and bonding wire for the same In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bond... | 10/21/2003 |
| 6632732 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may include multiple superimposed, contiguous, mutually adhered layers of a conductive ma... | 10/14/2003 |
| 6600218 | Semiconductor device A semiconductor device comprises a semiconductor chip. The semiconductor chip has an internal active region, an external active region, and a plurality of electrodes for electrically connecting the internal active region and the external active region to ... | 07/29/2003 |
| 6566739 | Dual chip package The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes ... | 05/20/2003 |
| 6534337 | Lead frame type plastic ball grid array package with pre-assembled ball type contacts A method of making a ball grid array package wherein there is provided a partially fabricated package including a semiconductor die, leads and balls secured to predetermined ones of the leads. The leads and balls are concurrently coated with palladium. Th... | 03/18/2003 |
| 6525916 | Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device An electronic device having first and second external pins; first and second pads connected to the first external pin by respective bonding wires; and third and fourth pads connected to the second external pin respective bonding wires, and to a first comm... | 02/25/2003 |
| 6500746 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may have multiple superimposed, contiguous, mutually adhered layers of conductive materia... | 12/31/2002 |
| 6482680 | Flip-chip on lead frame There is disclosed a flip-chip-type method of assembling semiconductor devices. The proposed invention offer one step encapsulation process to promote adhesion of die to the lead finger and prevent the potential of shorts from developing between the adjac... | 11/19/2002 |
| 6468891 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may include multiple superimposed, contiguous, mutually adhered layers of a conductive ma... | 10/22/2002 |
| 6437453 | Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device A wire bonding method comprising: disposing a plurality of leads (20) aligned in an imaginary plane (P) around the periphery of a semiconductor chip (10) having a plurality of electrodes (12) aligned on an imaginary straight line (L1); bonding wires (30) ... | 08/20/2002 |
| 6433417 | Electronic component having improved soldering performance and adhesion properties of the lead wires Electrodes of the electronic component chip is electrically connected with the end parts of the leads and the electronic component chip and the end parts of the leads are covered by the package with the leads which are extended out from the package are be... | 08/13/2002 |
| 6423580 | Method for manufacturing a dual chip package The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes ... | 07/23/2002 |
| 6396127 | Semiconductor package A semiconductor package includes a bottom leadframe having a bottom plate portion and at least one first terminal extending from the bottom plate portion; at least one second terminal being co-planar with the first terminal; a semiconductor power MOSFET d... | 05/28/2002 |
| 6372625 | Semiconductor device having bonding wire spaced from semiconductor chip A semiconductor device has a semiconductor chip fixedly mounted on an island and a bonding wire connecting a bonding pad on the semiconductor chip to a lead terminal whose end is positioned near the island. The semiconductor chip and the bonding wire are ... | 04/16/2002 |
| 6342275 | Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing head Gas discharge is caused in a predetermined discharging gas at atmospheric pressure or a pressure close to atmospheric pressure, and an organic material which is liquid at room temperature and which is previously contained in the discharging gas or applied... | 01/29/2002 |
| 6294824 | Bonding support for leads-over-chip process A method of forming a semiconductor memory device comprises the steps of providing a semiconductor die, forming a temporary protective material over a surface of the die, and attaching the die to a first lead frame portion. Next, a protective material is ... | 09/25/2001 |
| 6080264 | Combination of semiconductor interconnect An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one se... | 06/27/2000 |
| 6075281 | Modified lead finger for wire bonding A lead frame equipped with modified lead fingers which have inclined tip portions for achieving an improved wire bond is provided. The inclined tip portions on the lead fingers can be formed in a stamping process with an angle on a top surface of the incl... | 06/13/2000 |
| 6033937 | Si O2 wire bond insulation in semiconductor assemblies A semiconductor integrated circuit package is provided with insulated bonding wires. The semiconductor die is mounted to a base of either a leadframe or a grid-array package. A plurality of bonding wires are bonded between bonding pads on the semiconducto... | 03/07/2000 |
| 5959247 | Low cost protective coating and method for a die-on-board electronic assembly An electronic circuit assembly includes a printed circuit board having a plurality of conductors formed thereon. An integrated circuit die is mounted directly on and bonded to the circuit board. A plurality of microleads extend between the integrated circ... | 09/28/1999 |
| 5955778 | Lead frame with notched lead ends A lead frames has a forked top portion which has a recessed portion adjusted for receipt of a wire so that the wire is so caught by the forked top portion as to prevent the wire from being largely carried. Even if the density of the wires is high, the wir... | 09/21/1999 |
| 5952710 | Semiconductor device and method of manufacturing same Of ends of a plurality of inner leads disposed around a semiconductor chip shaped substantially in the form of a rectangle, the ends of the inner leads, which correspond to the corners of the rectangle, are provided so as to approach in the direction of t... | 09/14/1999 |
| 5950100 | Method of manufacturing semiconductor device and apparatus for the same In an apparatus for manufacturing a semiconductor device, insulator is sprayed to a bonding wire continuously fed from a capillary immediately after a first bonding to coat the bonding wire with the insulator. The spray is stopped immediately before the c... | 09/07/1999 |
| 5923092 | Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame A semiconductor IC device requiring dense arrangements of I/O connections in which a plurality of electrode pads are arranged in a rectangular form for a quad surface mounting type package, corner electrode pads are arranged to be shifted toward inside of... | 07/13/1999 |
| 5917242 | Combination of semiconductor interconnect An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one se... | 06/29/1999 |
| 5824568 | Process of making an integrated circuit chip composite A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also,... | 10/20/1998 |
| 5808354 | Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface A semiconductor chip package includes a semiconductor chip, a lead frame including a plurality of inner leads each having a wire bonding point on a top surface, bonding wires for electrically interconnecting the semiconductor chip to each of the plurality... | 09/15/1998 |
| 5770479 | Bonding support for leads-over-chip process A method of forming a semiconductor memory device comprises the steps of providing a semiconductor die, forming a temporary protective material over a surface of the die, and attaching the die to a first lead frame portion. Next, a protective material is ... | 06/23/1998 |
