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| Number | Title | Issue Date |
| 7443013 | Flexible substrate for package of die The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a p... | 10/28/2008 |
| 7432584 | Leadframe for use in a semiconductor package A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard H2 half cell. A semiconductor package comprises the leadframe and a semiconductor chip having... | 10/07/2008 |
| 7425756 | Semiconductor device and electronic device This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconducto... | 09/16/2008 |
| 7420265 | Integrated circuit package system with integrated circuit support An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.... | 09/02/2008 |
| 7414307 | Electronic device and pressure sensor An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of... | 08/19/2008 |
| 7408244 | Semiconductor package and stack arrangement thereof A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor pac... | 08/05/2008 |
| 7405467 | Power module package structure A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips... | 07/29/2008 |
| 7402462 | Folded frame carrier for MOSFET BGA A folded frame carrier has a die attach pad (DAP) 30 and one or more folded edges 32, 33, 34, 35. Each folded edge has one or more studs 36 and each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or coppe... | 07/22/2008 |
| 7400002 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/15/2008 |
| 7391101 | Semiconductor pressure sensor A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a... | 06/24/2008 |
| 7378722 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film ... | 05/27/2008 |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7372142 | Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid... | 05/13/2008 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7368807 | Low cost method to produce high volume lead frames A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequent... | 05/06/2008 |
| 7365423 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 04/29/2008 |
| 7354804 | Method for fabricating lead frame and method of fabricating semiconductor device using the same A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower su... | 04/08/2008 |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantial... | 03/18/2008 |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7339259 | Semiconductor device A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and ... | 03/04/2008 |
| 7338841 | Leadframe with encapsulant guide and method for the fabrication thereof A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant guides are formed angled on a plurality of the leads to push the leads... | 03/04/2008 |
| 7332375 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad... | 02/19/2008 |
| 7332804 | Semiconductor device and method of manufacturing the same A semiconductor device and manufacturing the semiconductor device are described. There is provided a method of manufacturing a semiconductor device including, disposing a lead frame inside an outer lead so as to couple between a coupling portion and a coupling accep... | 02/19/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7323366 | Manufacturing method of a semiconductor device A method of making a semiconductor device including a semiconductor chip having a plurality of pads, and a lead frame having a plurality of leads. Each of the plurality of leads has a mounting surface for mounting the semiconductor device, a wire connection surface ... | 01/29/2008 |
| 7314820 | Carrier-free semiconductor package and fabrication method thereof A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically co... | 01/01/2008 |
| 7298026 | Large die package and method for the fabrication thereof A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the lead-fram... | 11/20/2007 |
| 7288831 | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip ... | 10/30/2007 |
| 7282786 | Semiconductor package and process for making the same A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip... | 10/16/2007 |
| 7279780 | Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on th... | 10/09/2007 |
| 7274088 | Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof A flip-ship semiconductor package with a lead frame as a chip carrier is provided, wherein a plurality of leads of the lead frame are each formed with at least a dam member thereon. When a chip is mounted on the lead frame by means of solder bumps, each of the solde... | 09/25/2007 |
| 7262440 | Light emitting diode package and fabrication method thereof The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a packag... | 08/28/2007 |
| 7253514 | Self-supporting connecting element for a semiconductor chip A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for c... | 08/07/2007 |
| 7250685 | Etched leadframe flipchip package system The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having sold... | 07/31/2007 |
| 7242077 | Leadframe with die pad A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the side... | 07/10/2007 |
| 7238549 | Surface-mounting semiconductor device and method of making the same A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface 113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a... | 07/03/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7235877 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 06/26/2007 |
| 7227240 | Semiconductor device with wire bond inductor and method A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L... | 06/05/2007 |
| 7227198 | Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di... | 06/05/2007 |
