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Pet Toilet-Like Water Disk and Food Storage
One pet-friendly inventor patented "a device for watering pets, e.g., a dog or cat." The device, he helpfully noted, "has the general shape of a toilet."
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| Number | Title | Issue Date |
| 7444041 | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity ... | 10/28/2008 |
| 7436007 | Master slice type semiconductor integrated circuit device A plurality of terminals is formed in a basic cell. One terminal has first to fifth patterns. The first and second patterns are arranged to be spaced from each other. The third and fourth patterns are arranged to be spaced from each other, and are arranged so as to ... | 10/14/2008 |
| 7436063 | Packaging substrate and semiconductor device A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the surface opposed to the packaging substrate and comprises a wiring pr... | 10/14/2008 |
| 7423337 | Integrated circuit device package having a support coating for improved reliability during temperature cycling An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after solder bumps have been added but prior to dicing. This support coatin... | 09/09/2008 |
| 7385457 | Flexible capacitive coupler assembly and method of manufacture A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electric... | 06/10/2008 |
| 7335580 | Lamellar-derived microelectronic component array and method of fabrication Sub-lithographic lamella and pillar structures defined by larger lines or lamellae are described. A static random access memory (SRAM) cell structure is created in a three-dimensional format as a vertical stack of wired transistors. These transistors are fabricated ... | 02/26/2008 |
| 7335972 | Heterogeneously integrated microsystem-on-a-chip A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect struct... | 02/26/2008 |
| 7335985 | Method and system for electrically coupling a chip to chip package A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter ... | 02/26/2008 |
| 7323406 | Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures A method for making novel elevated bond-pad structures with sidewall spacers is achieved. The elevated bond-pad structures increase the space between the chip and a substrate during flip-chip bonding. The increased spacing results in better under-filling and reduces... | 01/29/2008 |
| 7323771 | Electronic circuit device An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a... | 01/29/2008 |
| 7321165 | Semiconductor device and its manufacturing method In a semiconductor device in which a plurality of substrates each mounting a semiconductor chip are stacked, one ends of the leads formed on the substrates are connected to the semiconductor chip and the other ends thereof are connected to connection terminals of th... | 01/22/2008 |
| RE39932 | Semiconductor interconnect formed over an insulation and having moisture resistant material A plurality of metal wires are formed on an underlying interlayer insulating film. Areas among the metal wires are filled with a buried insulating film of a silicon oxide film with a small dielectric constant (i.e., a first dielectric film), and thus, a parasitic ca... | 12/04/2007 |
| 7291915 | Circuit board and method of manufacturing the same A circuit board includes an insulating substrate, a first conductive layer on the insulating substrate, a second conductive layer on the first conductive layer, and a third conductive layer covering the first conductive layer and the second conductive layer. The fir... | 11/06/2007 |
| 7279797 | Module assembly and method for stacked BGA packages Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the s... | 10/09/2007 |
| 7262440 | Light emitting diode package and fabrication method thereof The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a packag... | 08/28/2007 |
| 7253513 | High-frequency switch device and electronic device using the same A switch device includes a semiconductor chip, and at least two switches formed on the semiconductor chip. Ground parts of the at least two switches are arranged between said at least two switches. ... | 08/07/2007 |
| 7224073 | Substrate for solder joint A substrate for solder joint is provided, including: a core layer; at least one conductive trace formed on the core layer and having a circular terminal as a pad through which a plurality of hollow portions are formed and expose predetermined portions of the core la... | 05/29/2007 |
| 7215026 | Semiconductor module and method of forming a semiconductor module In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the boar... | 05/08/2007 |
| 7211880 | Photoelectric conversion apparatus and manufacturing method of same An image reading apparatus (10) includes a photoelectric conversion element formation substrate (4) having a plurality of photoelectric conversion elements (2) on a reverse surface of an information reading surface, and a supporting substrate ( | 05/01/2007 |
| 7211902 | Method of forming a bonding pad structure A semiconductor device having a semiconductor substrate and a bonding pad portion formed on the semiconductor substrate, the bonding pad portion having: an insulating film formed on the semiconductor substrate and a first-level conductive pad layer of a large island... | 05/01/2007 |
| 7205486 | Thermally isolated via structure This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A c... | 04/17/2007 |
| 7196409 | Semiconductor device, semiconductor body and method of manufacturing thereof The invention relates to a semiconductor device (10) comprising a semiconductor body (11) in which an IC is formed and which has a number of connection regions (1) for the IC on its surface, including at least two connection regions (1A) ... | 03/27/2007 |
| 7186648 | Barrier first method for single damascene trench applications Methods for forming a diffusion barrier on low aspect features of an integrated circuit include at least three operations. The first operation deposits a barrier material and simultaneously etches a portion of an underlying metal at the bottoms of recessed features ... | 03/06/2007 |
| 7180168 | Stacked semiconductor chips A groove is formed on a semiconductor substrate having integrated circuits and electrodes from a first surface. An insulating layer is formed on an inner surface of the groove. A conductive layer is formed on the insulating layer above the inner surface of the groov... | 02/20/2007 |
| 7176129 | Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications are used to fabricate two structures: (1) a first structure includes porous Si (silicon) regions extending throughout the thickness of an Si substrate that ... | 02/13/2007 |
| 7176487 | Semiconductor integrated circuit To provide a test technology capable of reducing a package size by reducing a number of terminals (pins) in a semiconductor integrated circuit of SIP or the like constituted by mounting a plurality of semiconductor chips to a single package, in SIP 102 consti... | 02/13/2007 |
| 7172958 | High-frequency wiring structure and method for producing the same A high-frequency wiring structure includes a microstrip line having a ground conductor, a dielectric disposed on the ground conductor, and a transmission conductor that is at least partially disposed in the dielectric. The transmission conductor is defined by a flat... | 02/06/2007 |
| 7170094 | Light emitting device, driving method of light emitting device and electronic device By controlling the luminance of light emitting element not by means of a voltage to be impressed to the TFT but by means of controlling a current that flows to the TFT in a signal line drive circuit, the current that flows to the light emitting element is held to a ... | 01/30/2007 |
| 7157368 | Method of accelerating test of semiconductor device Semiconductor elements composing a semiconductor device are formed on a semiconductor substrate. Wirings composed of copper or an alloy mainly composed of copper are formed in wiring layers through interlayer insulation films to connect the semiconductor elements to... | 01/02/2007 |
| 7138721 | Memory module A memory module includes a substrate having a common substrate body, a plurality of first memory chips located over a surface of the common substrate body, a conductive pattern which electrically connects at least some of the plurality of first memory chips, and an ... | 11/21/2006 |
| 7132737 | Package for electronic component and method of manufacturing piezoelectric device Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pa... | 11/07/2006 |
| 7126227 | Wiring substrate, semiconductor device, semiconductor module, electronic equipment, method for designing wiring substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor module The invention can provide an improvement in the connection reliability in mounting semiconductor chips. The invention can include solder balls that are disposed on a back surface of an interposer substrate, in a manner to avoid diagonal lines of the interposer subst... | 10/24/2006 |
| 7109059 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are pr... | 09/19/2006 |
| 7091599 | Solid-state imaging device A solid-state imaging device comprises a solid-state imaging element including a photo-reception portion and electrode pads, and optical glass bonded onto the solid-state imaging element through a bonding layer, wherein penetrating electrodes which reach the rear fa... | 08/15/2006 |
| 7091598 | Electronic circuit device An electronic circuit device has a high-density mount board, on which are disposed a microcomputer, a random access memory, a programmable device which is a variable logic circuit represented by FPGA, and an electrically-rewritable nonvolatile memory which can store... | 08/15/2006 |
| 7087990 | Power semiconductor device A power semiconductor device to which a large current can be applied and which can be fabricated compactly in a shorter time, including an electrode structure for taking out electrodes from a power semiconductor element mounted on one of a plurality of circuit patte... | 08/08/2006 |
| 6981090 | Multiple use of microcontroller pad A circuit arrangement permits a microcontroller wirebond pad to be configured to be an analog or digital input or output. The circuit arrangement uses any of a plurality of switching configurations to selectively determine the use of the wirebond pad under control o... | 12/27/2005 |
| 6784409 | Electronic device with encapsulant of photo-set resin and production process of same An electronic device is described which comprises a functional element chip having a photofunctional element formed thereon, a wiring member electrically connected to a terminal of the functional element chip, and an encapsulant for fixing the functional element chi... | 08/31/2004 |
| 6690845 | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making Three-dimensional opto-electronic modules having a plurality of opto-electronic (O/E) layers, with optical signals being routed between O/E layers within one or more three-dimensional volumes, are disclosed. In preferred embodiments, the O/E layers are di... | 02/10/2004 |
| 6684007 | Optical coupling structures and the fabrication processes An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device t... | 01/27/2004 |
