Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 7358158 | Wafer machining adhesive tape, and its manufacturing method and using method An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut int... | 04/15/2008 |
| 7332809 | Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate A press mold for fabricating a glass substrate, the glass substrate comprising a substrate; and a terrace-shaped flat portion formed on the substrate and having a grooved portion formed therein, is characterized in that the press mold comprises a top mold and a bott... | 02/19/2008 |
| 7304378 | Aluminum/ceramic bonding substrate There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600... | 12/04/2007 |
| 7294559 | Wafer dicing process for optical electronic packing A wafer dicing process for optical electronic packing is provided. The process includes: providing a first wafer (glass wafer) and a second wafer (interposer wafer); etching the second wafer to form a reference flat coordinate; laminating the first wafer on the seco... | 11/13/2007 |
| 7221048 | Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage s... | 05/22/2007 |
| 7205181 | Method of forming hermetic wafer scale integrated circuit structure A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor d... | 04/17/2007 |
| 7164199 | Device packages with low stress assembly process A microelectromechanical device package and a low-stress inducing method for packaging a microelectromechanical device are disclosed in this invention. The microelectromechanical device is accommodated within a cavity comprised by a first package substrate and a sec... | 01/16/2007 |
| 7148136 | Method of producing ceramic multi-layer substrate A composite laminate, including shrink-prevention ceramic green sheets arranged on the main surfaces of an unfired ceramic laminate and having a sintering temperature greater than the firing temperature of the unfired ceramic laminate, is fired at a temperature whic... | 12/12/2006 |
| 6806552 | Integrated inductive circuits An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the ... | 10/19/2004 |
| 6696103 | Aluminium nitride ceramics and method for preparing the same Aluminium nitride ceramics improved in heat radiation property used as a substrate for integrated circuits and package material, comprising a sintered article consisting mainly of aluminium nitride and having a thermal conductivity higher than 100.W/m.K a... | 02/24/2004 |
| 6690188 | Method of testing a semiconductor device A method testing a semiconductor device mounted upon an interposer. The interposer electrically couples the semiconductive device to an electrical apparatus and includes (i) a substrate comprised of an electrically insulating, thermally conductive ceramic... | 02/10/2004 |
| 6667256 | Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an ... | 12/23/2003 |
| 6614110 | Module with bumps for connection and support An electronic packaging module for inverted bonding of electronic devicss including semiconductor devices, integrated circuits, application specific integrated circuits, electomechanical devices and MEMS is produced with protuberances on the conductive pa... | 09/02/2003 |
| 6613443 | Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrate The present invention provides a silicon nitride ceramic substrate composed of a silicon nitride sintered body in which maximum size of pore existing in grain boundary phase of the sintered body is 0.3 μm or less, and having a thermal conductivity of 50 ... | 09/02/2003 |
| 6610621 | Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an ... | 08/26/2003 |
| 6602623 | Low-temperature firing ceramic composition, process for producing same and wiring substrate prepared by using same A low-temperature firing ceramic composition contains Sr2 MgSi2 O7 crystals forming a major crystal phase of the composition. This composition can be produced, for example, by a process including the steps of (a) mixing to... | 08/05/2003 |
| 6596964 | Method of attaching a component to a connection support by welding without the addition of material The present invention concerns a method of attaching at least one component (12) provided with a plurality of electrical connection terminals (18), to a connection support (10), in which: a) a connection support is provided, made of a material transparent... | 07/22/2003 |
| 6588097 | Method of manufacturing multilayered ceramic substrate and green ceramic laminate The present invention provides a multilayered ceramic substrate having high precision and high reliability in which firing shrinkage in the planar direction thereof is suppressed and densification is achieved. The multilayered ceramic substrate is manufac... | 07/08/2003 |
| 6572955 | Ceramics having excellent high-frequency characteristics and method of producing the same High-frequency ceramics containing SiO2, Al2 O3, MgO, ZnO and B2 O3 as constituent components, said ceramics comprising: 30 to 50% by weight of a crystal phase containing ZnO and Al2 O3 | 06/03/2003 |
| 6569514 | Ceramic circuit board and method of manufacturing the same The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit portion bonded to at least one main surface of the ceramic substrate; wherein each of ratios of Ra1/Ra2 and Ra2/Ra1 is 1.5 or less in which a surfac... | 05/27/2003 |
| 6558821 | Ceramic sinter, and wear resistant member and electronic component member using thereof In ceramic sinter consisting of at least one kind selected from a group consisting of silicon nitride, zirconia, silicon carbide, cermet, SIALON, aluminum nitride and alumina, wear resistant member and electronic component member using thereof, skewness a... | 05/06/2003 |
| 6558976 | Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture A novel array of optically and electrically interacting optical MEMS dies physically and electrically integrally attached upon an optically transmissive preferably (transparent) printed circuit substrate that is monolithically formed with one or more opti... | 05/06/2003 |
| 6539626 | Process of making curved ceramic moulded part containing internal electrically conductive paths A curved multilayer ceramic moulded part, particularly curved in directions perpendicular to one another, is limited by two virtually parallel surfaces and an edge. Electrically conductive path(s) parallel to the surface are provided internally. The molde... | 04/01/2003 |
| 6534190 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10-6 /° C. or lower and is lightweight and compositionally ... | 03/18/2003 |
| 6531767 | Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture A novel array of optically and electrically interacting optical MEMS dies physically and electrically integrally attached upon an optically transmissive preferably (transparent) printed circuit substrate that is monolithically formed with one or more opti... | 03/11/2003 |
| 6511866 | Use of diverse materials in air-cavity packaging of electronic devices Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts--base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followe... | 01/28/2003 |
| 6507105 | Member for semiconductor device and method for producing the same A member for semiconductor devices comprising a composite alloy of aluminum or an aluminum alloy and silicon carbide, wherein silicon carbide grains are dispersed in aluminum or the aluminum alloy in an amount of from 10 to 70% by weight, the amount of ni... | 01/14/2003 |
| 6503645 | Dielectric ceramic composition and ceramic electronic component A dielectric ceramic composition is comprised of a dielectric ceramic component represented by the formula: Ba(Zrx Zny Taz) Ow, wherein, on a molar basis, 0.01ࣘxࣘ0.06, 0.29ࣘyࣘ0.34, ... | 01/07/2003 |
| 6486085 | Aluminum nitride sintered bodies and semiconductor-producing members including same An aluminum nitride sintered body is provided. The aluminum nitride has a polycrystalline structure of aluminum nitride crystals having an average particle diameter in a range of 5 μm to 20 μm and cerium in a range of 0.01 wt % 1.0 wt %, when calculated... | 11/26/2002 |
| 6486542 | Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same A semiconductor-supporting device comprising a substrate made of an insulating material, a conductive member buried in the substrate, and a terminal connected to the conductive member and made of an electrically conductive metallic matrix-ceramic composit... | 11/26/2002 |
| 6475924 | Substrate and process for producing the same The present invention produces the following substrate and the following process for producing the substrate. A substrate obtained by filling through holes in a sintered product of aluminum nitride with an electrically conducting layer, wherein said sinte... | 11/05/2002 |
| 6469378 | Power semiconductor module of high isolation strength A power semiconductor module achieves high isolation strength from a base through selectively positioning a plurality of metal coatings on first and second surfaces and positioning edges of the plurality to beneficially reduce the field strength tangentia... | 10/22/2002 |
| 6455453 | Low-temperature sinterable ceramic composition and multilayer ceramic substrate A low-temperature sinterable ceramic composition which can be simultaneously sintered with a low melting point metal, such as silver or copper, and which has a preferable combination of high strength and superior electrical characteristics. The low-temper... | 09/24/2002 |
| 6448195 | Composition for ceramic substrate and ceramic circuit component There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B2 O3, about 28% to 44% by weight of SiO2, 0% to about 20% by we... | 09/10/2002 |
| 6440574 | Substrate for high-voltage modules The substrate for high-voltage modules has a ceramic later with a first main side and a second main side opposite to the first main side. The ceramic layer has a first dielectric constant. A top metal layer is disposed on the first main side and a bottom ... | 08/27/2002 |
| 6428741 | Aluminum nitride sintered body and method of preparing the same Provided is an aluminum nitride sintered body excellent in thermal shock resistance and strength and applicable to a radiating substrate for a power module or a jig for semiconductor equipment employed under a strict heat cycle. An aluminum nitride sinter... | 08/06/2002 |
| 6426551 | Composite monolithic electronic component A composite monolithic electronic component has a laminate including a base layer having a relative dielectric coefficient of about 10 or less and a functional layer which is at least one of a high-dielectric-coefficient layer having a relative dielectric... | 07/30/2002 |
| 6403199 | Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts An insulating ceramic includes a fired mixture of a MgO--MgAl2 O4 ceramic and a borosilicate glass, in which MgAl2 O4 crystal phase and at least one of Mg3 B2 O6 crystal phase and ... | 06/11/2002 |
| 6403200 | Insulator ceramic composition An insulator ceramic composition making it possible to obtain a sintered material which can be fired at low temperature of 1000° C., can be co-sintered with Ag and Cu, exhibits superior mechanical strength, exhibits high Q value and is appropriate for us... | 06/11/2002 |
| 6399187 | Metal-ceramics composite, heat dissipation device employing it, and processes for producing them A metal-ceramics composite comprising a porous inorganic structure and a metal containing aluminum as the main component, infiltrated into the porous inorganic structure, wherein a part of the porous inorganic structure is made of an inorganic fiber and a... | 06/04/2002 |
