Did You Know...
...that the Band-Aid Bandage was invented by a Johnson & Johnson employee whose wife had cut herself? Earl Dickson's wife was rather accident prone, so he set out to develop a bandage that she could apply without help. He placed a small piece of gauze in the center of a small piece of surgical tape, and what we know today as the Band Aid bandage was born!
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| Number | Title | Issue Date |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor devic... | 09/09/2008 |
| 7414309 | Encapsulated electronic part packaging structure An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a body to direct the connection terminal upward. An insulating layer i... | 08/19/2008 |
| 7388293 | Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On bot... | 06/17/2008 |
| 7352061 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 04/01/2008 |
| 7262497 | Bumpless assembly package A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second contacts formed on the upper surface of the substrate, wherein one of the ... | 08/28/2007 |
| 7170183 | Wafer level stacked package Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically con... | 01/30/2007 |
| 7164199 | Device packages with low stress assembly process A microelectromechanical device package and a low-stress inducing method for packaging a microelectromechanical device are disclosed in this invention. The microelectromechanical device is accommodated within a cavity comprised by a first package substrate and a sec... | 01/16/2007 |
| 6683384 | Air isolated crossovers The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnecti... | 01/27/2004 |
| 6620647 | Method for producing a semiconductor component with a silicon carrier substrate Semiconductor chips are mounted on a multilayer wiring of a silicon carrier substrate, while the bottom side of the carrier substrate is provided with soldering contacts in the form of solder balls and is structured in such a way that for each soldering c... | 09/16/2003 |
| 6617677 | Electric or electronic component and method of manufacturing such a component To provide an electric or electronic component (100) comprising a carrier substrate (10) of a semiconducting or insulating material, at least a recess (12), particularly a cavity or indentation provided in the carrier substrate (10), at least a component ... | 09/09/2003 |
| 6614110 | Module with bumps for connection and support An electronic packaging module for inverted bonding of electronic devicss including semiconductor devices, integrated circuits, application specific integrated circuits, electomechanical devices and MEMS is produced with protuberances on the conductive pa... | 09/02/2003 |
| 6610934 | Semiconductor module and method of making the device A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of th... | 08/26/2003 |
| 6581279 | Method of collectively packaging electronic components Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated with a plurality of conducting tracks formed on a second subs... | 06/24/2003 |
| 6432724 | Buried ground plane for high performance system modules A method and apparatus for producing buried ground planes in a silicon substrate for use in system modules is disclosed. Conductor patterns are printed on the surface of the silicon substrate. Pores are created in the printed conductor patterns by a chemi... | 08/13/2002 |
| 6423573 | Integrated electronic circuit comprising at least an electronic power component A method of producing an integrated circuit having a plurality of electronic components by the steps of: a) forming plurality of components with connection points in a substrate plate; b) forming a connection support of conducting tracks; c) transferring the s... | 07/23/2002 |
| 6355542 | Semiconductor device and manufacturing method A semiconductor device with advanced functions and an improved factor of effective mounting area comprises a semiconductor chip on which an IC or the like is formed; a plurality of external connector electrodes having a block form which are connected with... | 03/12/2002 |
| 6346434 | Semiconductor device and manufacturing method A semiconductor device with advanced functions and an improved factor of effective mounting area comprises a semiconductor chip on which an IC or the like is formed; a plurality of external connector electrodes having a block form which are connected with... | 02/12/2002 |
| 6235554 | Method for fabricating stackable chip scale semiconductor package A stackable chip scale semiconductor package and a method for fabricating the package are provided. The package includes a substrate having a die mounting site wherein a semiconductor die is mounted. The package also includes first contacts formed on a fi... | 05/22/2001 |
| 6160715 | Translator for recessed flip-chip package The specification describes a recessed chip IC package in which the IC chip is bonded to a translator, and power and ground planes for IC power and ground interconnections are formed on separate interconnect levels of the translator. The multilevel interc... | 12/12/2000 |
| 6156621 | Method for fabricating direct wafer bond Si/SiO2 /Si substrates A method for fabricating direct wafer bond Si/SiO2 /Si substrates in which trenches are etched into a rear side of a device wafer. Subsequently, the rear side of the device wafer is ground. The device wafer is then placed by its front side onto... | 12/05/2000 |
| 6022757 | Semiconductor device and manufacturing method A semiconductor device with advanced functions and an improved factor of effective mounting area comprises a semiconductor chip on which an IC or the like is formed; a plurality of external connector electrodes having a block form which are connected with... | 02/08/2000 |
| 5954978 | Substrate, a module and a method for fastening components of the module to the substrate Module-forming component secured to a substrate using heat activated bonding arrangements are made by resistance heating the bonding medium, for example solder, thermal activated adhesive or thermoplastic material, using electrically energized resistance ... | 09/21/1999 |
| 5933707 | Crystal substrate processing This disclosure relates to the fabrication of components on a single crystal substrate. A method is disclosed of overcoming the problems encountered in defining etched features on a silicon substrate. In particular, there is disclosed a method of producin... | 08/03/1999 |
| 5904545 | Apparatus for fabricating self-assembling microstructures Apparatus for assembling microstructures onto a substrate through fluid transport. The apparatus includes a vessel that contains the substrate, a fluid, and microstructures. The substrate has at least one recessed region thereon. The microstructures being... | 05/18/1999 |
| 5904499 | Package for power semiconductor chips An electronic packaging module for bonding of power semiconductor devices is produced. The semiconductor device is mounted on a base, and enclosed by a frame and lid. The lid is an insulating substrate having a conductive pattern with protuberances on the... | 05/18/1999 |
| 5895978 | High density signal multiplexing interposer A high density and high I/O count packaging methodology and associated fabrication technique is presented. A semiconductor die having logic circuits for multiplexing specified sets of I/O logic is electrically connected to an interposer having semiconduct... | 04/20/1999 |
| 5877516 | Bonding of silicon carbide directly to a semiconductor substrate by using silicon to silicon bonding A module and a method of making the module is disclosed. The module is formed from a semiconductor substrate and a silicon carbide chip for high temperature applications. The module is designed to be compatible with current silicon IC processes.... | 03/02/1999 |
| 5866441 | Inverted chip bonded module with high packaging efficiency An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ... | 02/02/1999 |
| 5824186 | Method and apparatus for fabricating self-assembling microstructures A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrat... | 10/20/1998 |
| 5793105 | Inverted chip bonded with high packaging efficiency An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ... | 08/11/1998 |
| 5786230 | Method of fabricating multi-chip packages A method of fabricating a multi-chip package including an aluminum silicon substrate with an aluminum nitride layer thereon forming an electrically insulated surface and aluminum heat conductive areas positioned on the insulated surface. Conductors on the... | 07/28/1998 |
| 5783856 | Method for fabricating self-assembling microstructures A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, ... | 07/21/1998 |
| 5739585 | Single piece package for semiconductor die A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Elec... | 04/14/1998 |
| 5674785 | Method of producing a single piece package for semiconductor die A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Elec... | 10/07/1997 |
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management A novel packaging of semiconductor elements, such as MCM tiles, with a variety of printed circuit or wired boards (PWB), the packages occupying a small size, at least in the vertical direction, relative to prior art OMPAC devices. The MCM tile includes an... | 07/08/1997 |
| 5627406 | Inverted chip bonded module with high packaging efficiency An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ... | 05/06/1997 |
| 5622305 | Bonding scheme using group VB metallic layer A method for bonding one body to another, such as a laser device to a submount, uses a metallic layer composed of a Group VB metal, such as niobium, sandwiched between a non-metallic layer and solder layer formed by an approximate Au-Sn eutectic layer. Ad... | 04/22/1997 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least o... | 03/04/1997 |
| 5552637 | Semiconductor device There is provided a composite semiconductor device having a structure for bonding a wiring board to a package so as to satisfy both of the high thermal conductivity and low elasticity at the same time. The wiring board is fixed on the inner bottom surface... | 09/03/1996 |
| 5545291 | Method for fabricating self-assembling microstructures A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, ... | 08/13/1996 |
