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| Number | Title | Issue Date |
| 7417313 | Method for manufacturing an adhesive substrate with a die-cavity sidewall A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed betwe... | 08/26/2008 |
| 7396735 | Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of produ... | 07/08/2008 |
| 7340828 | Method for producing metal/ceramic bonding circuit board There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a c... | 03/11/2008 |
| 7335995 | Microelectronic assembly having array including passive elements and interconnects A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic ele... | 02/26/2008 |
| 7323765 | Die attach paddle for mounting integrated circuit die An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surf... | 01/29/2008 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic... | 10/02/2007 |
| 7224046 | Multilayer wiring board incorporating carbon fibers and glass fibers A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin compo... | 05/29/2007 |
| 7109569 | Dual referenced microstrip Structures and methods are provided for dual referenced microstrip structures having low reference discontinuities between a microstrip trace referenced to a primary reference plane as compared to a microstrip trace referenced to a secondary reference plane. A metho... | 09/19/2006 |
| 7071569 | Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection An electrical package and manufacturing method thereof is provided. A high stiffness, high electrical conductivity, low coefficient of thermal expansion and high thermal conductivity support substrate is used as an initial layer for building the package. A multilaye... | 07/04/2006 |
| 6671950 | Multi-layer circuit assembly and process for preparing the same A process for fabricating a multi-layer circuit assembly is provided comprising the following steps: (a) providing a perforate electrically conductive core having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b... | 01/06/2004 |
| 6649265 | Carbon-based metal composite material, method for preparation thereof and use thereof According to the present invention, there is provided a carbon-based metal composite material comprising a carbonaceous matrix and a metal component dispersed in said carbonaceous matrix, wherein at least 90 volume percent of the pores of the carbonaceous... | 11/18/2003 |
| 6646344 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 11/11/2003 |
| 6641861 | Heatsink and fabrication method thereof A method of fabricating a heatsink including a substrate of a sintered compact containing Cu and W, and a thin diamond film layer formed on the surface of the substrate with good adherence, involves immersing the substrate in acid to reduce the Cu content... | 11/04/2003 |
| 6630734 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 10/07/2003 |
| 6611056 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 08/26/2003 |
| 6579623 | Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal... | 06/17/2003 |
| 6528179 | Reduction of chip carrier flexing during thermal cycling A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least about 3×105 psi), and there is no stiffener ri... | 03/04/2003 |
| 6518502 | Ceramic multilayer circuit boards mounted on a patterned metal support substrate A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed fr... | 02/11/2003 |
| 6507105 | Member for semiconductor device and method for producing the same A member for semiconductor devices comprising a composite alloy of aluminum or an aluminum alloy and silicon carbide, wherein silicon carbide grains are dispersed in aluminum or the aluminum alloy in an amount of from 10 to 70% by weight, the amount of ni... | 01/14/2003 |
| 6497943 | Surface metal balancing to reduce chip carrier flexing A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier made of organic dielectric material, is formed and includes... | 12/24/2002 |
| 6492201 | Forming microelectronic connection components by electrophoretic deposition An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the fir... | 12/10/2002 |
| 6451448 | Surface treated metallic materials and manufacturing method thereof A surface treated metallic material according to the present invention comprises a metallic substrate and a metallic compound layer formed thereon, wherein the entire surface of the metallic compound layer is covered with minute, upright, scaly protrusion... | 09/17/2002 |
| 6424046 | Substrate for manufacturing a semiconductor device with three element alloy The substrate according to the present invention is comprised of a silver/gold/grain element alloy layer, wherein the alloy forms an outside layer of the product. The grain element is selected from a group consisting of selenium, antimony, bismuth, nickel... | 07/23/2002 |
| 6420018 | Low thermal expansion circuit board and multilayer wiring circuit board A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni--Fe--based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sid... | 07/16/2002 |
| 6391422 | Wiring substrate and stiffener therefor A wiring substrate includes a wiring substrate body and a stiffener. The latter is formed from a rolled metallic sheet and is bonded to a first main surface of the wiring substrate body. The stiffener has a boundary profile, in a plan view, which is subst... | 05/21/2002 |
| 6369332 | Metal-base multilayer circuit substrate with heat conducting adhesive A metal-base multilayer circuit substrate which includes a metal plate and a circuit substrate bonded thereon by a first insulating adhesive layer containing at least one of metal oxides and/or at least one of metal nitrides with a heat resistance of at m... | 04/09/2002 |
| 6361857 | Heatsink and fabrication method thereof A thin diamond film layer is formed on a substrate with good adherence. A heatsink includes a substrate of a sintered compact including Cu and W, and a thin diamond film layer formed on the surface of the substrate. The Cu content in the substrate is at l... | 03/26/2002 |
| 6355340 | Low expansion metal matrix composites A low to near-zero metal matrix composite material featuring high modulus carbon fibers reinforcing a lightweight metal or semimetal. The fibers have a negative coefficient of thermal expansion in the axial direction. Laminates featuring parallel arrays o... | 03/12/2002 |
| 6335863 | Package for semiconductors, and semiconductor module that employs the package A low-cost package for semiconductors that is superior in heat dissipation and capable of preventing the cracking of semiconductor elements at the time of mounting, and a semiconductor module employing the package. The package for semiconductors comprises... | 01/01/2002 |
| 6323549 | Ceramic composite wiring structures for semiconductor devices and method of manufacture A composite wiring structure (10) for use with at least one semiconductor device (16). The composite wiring structure having a first conductive member (12) upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric ... | 11/27/2001 |
| 6312535 | Silicon alloys for electronic packaging A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt. % silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed d... | 11/06/2001 |
| 6310391 | Mounted structure of circuit board and multi-layer circuit board therefor The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted... | 10/30/2001 |
| 6300673 | Edge connectable metal package There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected t... | 10/09/2001 |
| 6295199 | Electronics module and a method of manufacturing such a module The module has a metal substrate having one major face that is insulated and that carries electrical connection tracks, and at least one power component fixed to the substrate and having connection tabs (20) that are soldered to the tracks. The power comp... | 09/25/2001 |
| 6282092 | Electronic circuit device and method of fabricating the same An electronic circuit device having an improved heat dissipating effect, a small size and a high reliability is provided with a metal substrate having a first surface and a second surface and a case. Electronic parts are mounted on only the first surface ... | 08/28/2001 |
| 6262477 | Ball grid array electronic package There is provided a ball grid array package for housing semiconductor devices. The package has a metallic base with conductive vias extending through holes formed in the base. The conductive vias terminate adjacent an exterior surface of the base. A diele... | 07/17/2001 |
| 6254971 | Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device The invention provides resin-having metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range... | 07/03/2001 |
| 6233817 | Method of forming thick-film hybrid circuit on a metal circuit board A hybrid circuit structure that includes a metal substrate, an inorganic electrical insulator layer and at least one inorganic thick-film passive circuit element, such as a thick-film resistor, capacitor or conductor. An interface layer is provided betwee... | 05/22/2001 |
| 6212072 | Electronics package on a plate, and a method of making such a package An electronic package has a plate of aluminum or aluminum alloy supporting electronic microcomponents. Trenches, and possibly cavities, are formed on a major surface of the plate. An insulating oxide layer covers the major surface, including the trenches ... | 04/03/2001 |
| 6182358 | Process for producing a metal-ceramic substrate A process is provided in which an initial substrate has a ceramic layer with metal layers on either side. At least one of the metal layers projects above one edge of the ceramic layer. The projecting sub-area is deformed so that the metal layer on the edg... | 02/06/2001 |
