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| Number | Title | Issue Date |
| 7425477 | Manufacturing method of thin film transistor including implanting ions through polysilicon island and into underlying buffer layer A manufacturing method of a thin film transistor is provided. A buffer layer is formed on a substrate, and then a first and a second poly-silicon island are formed thereon. A gate-insulating layer is formed on the substrate, and a first and a second gate are formed ... | 09/16/2008 |
| 7381586 | Methods for manufacturing thin film transistors that include selectively forming an active channel layer from a solution A method for manufacturing TFTs is provided. It can be applied to both inverted staggered and co-planar TFT structures. The manufacturing method for the staggered TFT includes the formation of a gate electrode, a gate insulator, an active channel layer, a drain elec... | 06/03/2008 |
| 7341882 | Method for forming an opto-electronic device A method for forming an opto-electronic device through low temperature processes is provided. An active layer is bonded to a substrate by a common adhesive to maintain or increase the luminous efficiency of the opto-electronic because the electric conductive element... | 03/11/2008 |
| 7338882 | Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same A method of fabricating a nano silicon on insulator (SOI) wafer having an excellent thickness evenness without performing a chemical mechanical polishing (CMP) and a wafer fabricated by the same are provided. The provided method includes preparing a bond wafer and a... | 03/04/2008 |
| RE40137 | Methods for forming integrated circuits within substrates The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing ... | 03/04/2008 |
| 7307006 | Method of manufacturing semiconductor device It is an object of the present invention to provide a technology to manufacture a semiconductor sheet or a semiconductor chip with a high yield using a circuit having a thin film transistor. A manufacturing method for a semiconductor device comprises: attaching a fl... | 12/11/2007 |
| 7294587 | Component built-in module and method for producing the same A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of t... | 11/13/2007 |
| 7256455 | Double gate semiconductor device having a metal gate A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a s... | 08/14/2007 |
| 7235423 | Molded memory card production using carrier strip Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the ... | 06/26/2007 |
| 7192805 | Semiconductor device and method of manufacturing the same A semiconductor device includes at least one semiconductor structure having a plurality of external connection portions on an upper surface, and an insulating member which is made of a resin containing reinforcing materials and arranged on a side of the semiconducto... | 03/20/2007 |
