Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 8081366 | Oscillating device, light deflector, and image forming apparatus using the same An oscillating device includes a supporting portion, a movable portion, a torsion spring that supports the movable portion with respect to the supporting portion so that the movable portion is capable of torsionally vibrating around a torsion axis, and a driving uni... | 12/20/2011 |
| 7439160 | Methods for producing a semiconductor entity A method for producing a semiconductor entity is described. The method includes providing a donor substrate having a zone of weakness at a predetermined depth to define a thin layer, and the donor substrate includes a bonding interface. A receiver substrate is also ... | 10/21/2008 |
| 7429522 | Dicing die-bonding film A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is po... | 09/30/2008 |
| 7422962 | Method of singulating electronic devices A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid stre... | 09/09/2008 |
| 7416919 | Method for wafer level stack die placement A method for wafer level stack die placement is disclosed. At first, a wafer including a plurality of dice is provided. The wafer is adhered to a photosensitive adhesive tape. The wafer is attached on a die carrier to fix at least one die from the wafer on the die c... | 08/26/2008 |
| 7407861 | Method and system for high-speed, precise micromachining an array of devices A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measuremen... | 08/05/2008 |
| 7402453 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individua... | 07/22/2008 |
| 7399683 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device of this invention includes forming metal pads on a Si substrate through a first oxide film, bonding the Si substrate and a holding substrate which bolsters the Si substrate through a bonding film, forming an opening b... | 07/15/2008 |
| 7396742 | Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line o... | 07/08/2008 |
| 7396780 | Method for laser processing of wafer A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for ... | 07/08/2008 |
| 7393760 | Method for dicing glass substrate A method for dicing a sheet workpiece includes the following steps. A base (10) is provided. A water-soluble adhesive (20) is coated onto the base, and the workpiece is placed on the water-soluble adhesive. The water-soluble adhesive is hardened so as ... | 07/01/2008 |
| 7387948 | Structure and method of forming a semiconductor material wafer A structure and method of forming a semiconductor material wafer comprising forming an ingot of semiconductor material. A first dielectric layer is formed on the surface of the ingot, and the surface of the first dielectric layer is larger than the surface of the in... | 06/17/2008 |
| 7387911 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductiv... | 06/17/2008 |
| 7384858 | Wafer dividing method A wafer dividing method for dividing a wafer along a first set of plural streets extending parallel to each other, and a second set of plural streets extending parallel to each other and extending perpendicularly to the first set of the streets, the wafer having a p... | 06/10/2008 |
| 7384859 | Cutting method for substrate and cutting apparatus therefor A cutting method for substrates includes: preparing a substrate which has a predetermined circular cut line set thereon; chucking the substrate on a surface of a chuck table which is rotatably supported around a rotation axis of the chuck table such that the predete... | 06/10/2008 |
| 7378333 | Semiconductor device and manufacturing method thereof The present invention is a semiconductor device having the semiconductor element obtained by cutting a semiconductor wafer with the electrode pad formed on one side along a scribe line, a semiconductor element protective layer on the semiconductor element which has ... | 05/27/2008 |
| 7371618 | Method of manufacturing wafer-level chip-size package and molding apparatus used in the method Provided are a method of manufacturing wafer-level chip-size packages and a molding apparatus suitable for practicing the method whereby a semiconductor wafer having a plurality of semiconductor chips formed thereon may be encapsulated. The semiconductor wafer, typi... | 05/13/2008 |
| 7368321 | Semiconductor package and method for manufacturing the same A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically... | 05/06/2008 |
| 7364983 | Method and apparatus for creating RFID devices A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable s... | 04/29/2008 |
| 7361575 | Semiconductor device and method for manufacturing the same Embodiments relate to a semiconductor device and a method for manufacturing a semiconductor device that may be capable of improving a step coverage of main chip and scribe lane regions during a formation of an interlayer dielectric are provided. In embodiments, the ... | 04/22/2008 |
| 7358155 | Scribe-line structures and methods of forming the same Scribe-line structures and methods of forming such scribe-line structures on a face of a semiconductor substrate are provided. By means of the scribe-line structures and the methods of this invention, physical shock and cracking tendencies along a semiconductor subs... | 04/15/2008 |
| 7358153 | Method for cutting junction board, and chip A junction board cutting method includes, upon cutting a junction board formed by bonding a second main surface of a first substrate having a first main surface provided with chip areas and scribe areas demarcating the chip areas from one another and the second main... | 04/15/2008 |
| 7344960 | Separation method for cutting semiconductor package assemblage for separation into semiconductor packages A separation method by which a semiconductor package assemblage is cut in a predetermined width W1 along streets arranged in a lattice pattern to separate the semiconductor package assemblage into a plurality of semiconductor packages, the semiconductor packa... | 03/18/2008 |
| 7335578 | Method for manufacturing semiconductor chip A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and... | 02/26/2008 |
| 7335576 | Method for precision integrated circuit die singulation using differential etch rates A preprocessed semiconductor substrate such as a wafer is provided with a metal etch mask which defines singulation channels on the substrate surface. An isotropic etch process is used to define a singulation channel with a first depth extending into the semiconduct... | 02/26/2008 |
| 7332415 | Silicon wafer dividing method and apparatus A method of dividing a silicon wafer along predetermined dividing lines, comprising a deteriorated layer forming step for forming deteriorated layers exposed to at least a surface to which a laser beam is applied, from the inside of the silicon wafer by applying a p... | 02/19/2008 |
| 7332430 | Method for improving the mechanical properties of BOC module arrangements The invention relates to a method for improving the mechanical properties of BOC module arrangements in which chips have 3D structures, solder balls, μ springs or soft bumps which are mechanically and electrically connected by means of solder connections to termina... | 02/19/2008 |
| 7329564 | Wafer dividing method A method of dividing a wafer having a plurality of dividing lines formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of dividing lines into individual chips, along the dividing lines, the ... | 02/12/2008 |
| 7323397 | Method and apparatus of fabricating a semiconductor device by back grinding and dicing A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semic... | 01/29/2008 |
| 7316940 | Chip dicing A semiconductor structure and method for chip dicing. The method includes (a) providing a semiconductor substrate and (b) forming first and second device regions in and at top of the substrate. The first and second device regions are separated by a semiconductor bor... | 01/08/2008 |
| 7309925 | Dicing die-bonding film A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is po... | 12/18/2007 |
| 7307312 | Method of manufacturing a semiconductor device A semiconductor device manufacturing method comprises forming a pn column so that the pn column is designed to have a strip form in the section of the substrate and have a repetitive pattern of a p-conduction type and an n-conduction type on the substrate surface ov... | 12/11/2007 |
| 7303932 | Support body for semiconductor element, method for manufacturing the same and semiconductor device A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess ... | 12/04/2007 |
| 7279362 | Semiconductor wafer coat layers and methods therefor Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer... | 10/09/2007 |
| 7276429 | Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device A method for producing an ultra-thin semiconductor chip and an ultra-thin back-illuminated solid-state image pickup device utilizing a semiconductor layer formed on a support substrate via an insulating layer to improve separation performance of a semiconductor laye... | 10/02/2007 |
| 7276397 | Integrated circuit package separator methods An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits. The method includes providing a base having a plurality of pins, providing a support over the base and having a pluralit... | 10/02/2007 |
| 7273765 | Solid-state imaging device and method for producing the same A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting e... | 09/25/2007 |
| 7256108 | Method for reducing semiconductor die warpage An anti-warpage backgrinding tape (11) is secured to the circuit side (12) of a semiconductor wafer (14). The backside (16) of the wafer is background. The backside of the wafer is secured to dicing tape (18) so that the anti-warpa... | 08/14/2007 |
| 7256106 | Method of dividing a substrate into a plurality of individual chip parts The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing... | 08/14/2007 |
| 7253027 | Method of manufacturing hybrid integrated circuit device A method of manufacturing a hybrid integrated circuit device includes the steps of forming a plurality of units each including a conductive pattern on a surface of a board made of metal, forming grooves along boundaries of the respective units of the board, electric... | 08/07/2007 |
