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| Number | Title | Issue Date |
| 7442642 | Method of forming electrode for semiconductor device The semiconductor device of the present invention and the method of the present invention, for forming the semiconductor device, form: a penetrating hole in a semiconductor wafer which has a first insulating film and an electrode pad formed on a first face of the se... | 10/28/2008 |
| 7439095 | CMOS image sensor and method for fabricating the same A CMOS image sensor includes a substrate including a sensing part and a peripheral driving part; a first insulating interlayer formed over an entire surface of the substrate; a first metal line formed on the first insulating interlayer in each of the sensing and per... | 10/21/2008 |
| 7439160 | Methods for producing a semiconductor entity A method for producing a semiconductor entity is described. The method includes providing a donor substrate having a zone of weakness at a predetermined depth to define a thin layer, and the donor substrate includes a bonding interface. A receiver substrate is also ... | 10/21/2008 |
| 7435627 | Techniques for providing decoupling capacitance Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at ... | 10/14/2008 |
| 7429522 | Dicing die-bonding film A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is po... | 09/30/2008 |
| 7419853 | Method of fabrication for chip scale package for a micro component A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor ca... | 09/02/2008 |
| 7410893 | System and method for depositing a seed layer A method for depositing a seed layer for a controllable electric pathway on a substrate includes selectively dispensing a seed material from an inkjet material dispenser onto said substrate. ... | 08/12/2008 |
| 7387911 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductiv... | 06/17/2008 |
| 7375374 | Method for repairing thin film transistor array substrate A thin film transistor array substrate and method for repairing the same are provided. Repairing lines are formed when the data lines on the thin film transistor array substrate are defined. Furthermore, the protruding portions and branches of common lines overlap w... | 05/20/2008 |
| 7364983 | Method and apparatus for creating RFID devices A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable s... | 04/29/2008 |
| 7364986 | Laser beam processing method and laser beam machine A laser beam processing method comprising the step of processing-feeding a wafer having devices which are formed in a large number of areas sectioned by streets arranged in a lattice pattern on the front surface while a laser beam capable of passing through the wafe... | 04/29/2008 |
| 7348191 | Semiconductor device with terminals, and method of manufacturing the same A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on... | 03/25/2008 |
| 7344960 | Separation method for cutting semiconductor package assemblage for separation into semiconductor packages A separation method by which a semiconductor package assemblage is cut in a predetermined width W1 along streets arranged in a lattice pattern to separate the semiconductor package assemblage into a plurality of semiconductor packages, the semiconductor packa... | 03/18/2008 |
| 7341926 | Wafer dividing method A method of dividing a wafer having a plurality of first dividing lines and a plurality of second dividing lines perpendicular to the plurality of first dividing lines formed on the front surface, into individual chips along the plurality of first dividing lines and... | 03/11/2008 |
| 7338843 | Method for producing an electronic component, especially a memory chip A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of ... | 03/04/2008 |
| 7323397 | Method and apparatus of fabricating a semiconductor device by back grinding and dicing A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semic... | 01/29/2008 |
| 7309925 | Dicing die-bonding film A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is po... | 12/18/2007 |
| 7285428 | Production method of electron source and image display In a production method of an electron source wherein a plurality of electron-emitting devices are connected by and driven by matrix wirings, the upper wiring of the matrix wiring is partially removed at a short circuit region at a cross portion between the matrix wi... | 10/23/2007 |
| 7276385 | Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods Methods for repairing an electrical circuit; compositions, inks and equipment for making such repairs; and repair structures formed by the methods. The method generally includes the steps of: (a) depositing a composition comprising nanoparticles of an electrically f... | 10/02/2007 |
| 7265386 | Thin film transistor array substrate and method for repairing the same A thin film transistor array substrate and method for repairing the same are provided. Repairing lines are formed when the data lines on the thin film transistor array substrate are defined. Furthermore, the protruding portions and branches of common lines overlap w... | 09/04/2007 |
| 7256108 | Method for reducing semiconductor die warpage An anti-warpage backgrinding tape (11) is secured to the circuit side (12) of a semiconductor wafer (14). The backside (16) of the wafer is background. The backside of the wafer is secured to dicing tape (18) so that the anti-warpa... | 08/14/2007 |
| 7256106 | Method of dividing a substrate into a plurality of individual chip parts The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing... | 08/14/2007 |
| 7253027 | Method of manufacturing hybrid integrated circuit device A method of manufacturing a hybrid integrated circuit device includes the steps of forming a plurality of units each including a conductive pattern on a surface of a board made of metal, forming grooves along boundaries of the respective units of the board, electric... | 08/07/2007 |
| 7192846 | Methods and systems for processing a device, methods and systems for modeling same and the device A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includ... | 03/20/2007 |
| 7192847 | Ultra-thin wafer level stack packaging method A method of forming an ultra-thin wafer level stack package and structure thereof are provided. The method includes providing a first wafer having a plurality of base chips thereon, selectively binding the first wafer to a second substrate, lapping the first wafer t... | 03/20/2007 |
| 7189665 | Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device A manufacturing method for a crystalline semiconductor material including a plurality of semiconductor crystal grains is provided. The manufacturing method includes forming an amorphous or polycrystalline semiconductor layer on a substrate having a flat surface; for... | 03/13/2007 |
| 7176554 | Methods for producing a semiconductor entity A method for producing a semiconductor entity is described. The method includes providing a donor substrate having a zone of weakness at a predetermined depth to define a thin layer, and the donor substrate includes a bonding interface. A receiver substrate is also ... | 02/13/2007 |
| 7172912 | Pattern forming method and wiring pattern forming method, and electro-optic device and electronic equipment To provide a pattern forming method enabling a thin film to be patterned with high precision by easy and low cost techniques. A thin film 2 is provided on a base material 1 containing a sublimable dyestuff, light is irradiated to the base material 1... | 02/06/2007 |
| 7169686 | Cutting thin layer(s) from semiconductor material(s) An apparatus for cutting at least one thin layer from a substrate or ingot forming element for an electronic or optoelectronic or optical component or sensor. This apparatus includes a device for directing a pulse of energy into the substrate or forming element wher... | 01/30/2007 |
| 7163833 | Display panel and manufacturing method of display panel An array test is performed during the process of panel formation, such as at a stage where a driving TFT which supplies a drive current for an organic EL element is completed and an anode of the organic EL element has been formed on the TFT. Then, with regard to a d... | 01/16/2007 |
| 7138303 | Method for manufacturing a thin film transistor having high mobility and high on-current In a thin film transistor (TFT) including an insulating substrate and a polycrystalline silicon island formed on the insulating layer, a grain size of the polycrystalline silicon island is elongated along one direction. A source region, a channel region and a drain ... | 11/21/2006 |
| 7126232 | Defect repair apparatus for an electronic device A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD of other electronic device has defects. Described is a method of transferring a single or multi-l... | 10/24/2006 |
| 7122489 | Manufacturing method of composite sheet material using ultrafast laser pulses A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and abso... | 10/17/2006 |
| 7091624 | Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same A semiconductor chip is formed by dividing a semiconductor wafer by use of the laser dicing technique. The semiconductor chip has a laser dicing region on the side surface thereof. A dummy wiring layer is formed along the laser dicing region on the surface layer of ... | 08/15/2006 |
| 7091108 | Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices Embodiments of the invention use silicon on porous silicon wafers to produce a reduced-thickness IC device wafers. After device manufacturing, a temporary support is bonded to the device layer. The uppermost silicon layer is then separated from the silicon substrate... | 08/15/2006 |
| 6703582 | Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided.... | 03/09/2004 |
| 6670693 | Laser synthesized wide-bandgap semiconductor electronic devices and circuits A laser apparatus and methods are disclosed for synthesizing areas of wide-bandgap semi-conductor substrates or thin films, including wide-bandgap semiconductors such as silicon carbide, aluminum nitride, gallium nitride and diamond to produce electronic ... | 12/30/2003 |
| 6662063 | Method and subsystem for determining a sequence in which microstructures are to be processed at a laser-processing site Method and subsystem are provided for determining a sequence in which microstructures are to be processed at a laser-processing site by taking into account microstructures located near travel limits of a motor-driven stage. The method includes receiving r... | 12/09/2003 |
| 6660632 | Method for depositing metal and metal oxide films and patterned films The invention is directed to a photoresist-free method for depositing films composed of metals, such as copper, or its oxides from metal complexes. More specifically, the method involves applying an amorphous film of a metal complex to a substrate. The me... | 12/09/2003 |
| 6639177 | Method and system for processing one or more microstructures of a multi-material device A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method ... | 10/28/2003 |
