Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 7416922 | Heat sink with preattached thermal interface material and method of making same A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The the... | 08/26/2008 |
| 7387914 | Semiconductor device and process for fabrication thereof A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not m... | 06/17/2008 |
| 7371661 | Wafer bonding method A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one o... | 05/13/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7355280 | Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is form... | 04/08/2008 |
| 7307005 | Wafer bonding with highly compliant plate having filler material enclosed hollow core The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The pr... | 12/11/2007 |
| 7304394 | Semiconductor device and method for manufacturing same A wiring pattern is provided on an insulating tape. Part of the wiring pattern is a connection section. An insulating resin is provided so that the connection section is coated with the insulating resin. A protrusion electrode of a semiconductor element is so positi... | 12/04/2007 |
| 7224066 | Bonding material and circuit device using the same A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, a... | 05/29/2007 |
| 7179687 | Semiconductor device and its manufacturing method, and semiconductor device manufacturing system A method of manufacturing a semiconductor device is provided including depressing a bonding tool having a concave portion toward a wiring board with a semiconductor chip disposed within the concave portion, pressing the semiconductor chip with a bottom face of the c... | 02/20/2007 |
| 7164208 | Semiconductor device and method for manufacturing the same There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. A... | 01/16/2007 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices; a second wafer including one or more integrated circuit (IC) devices; and a metal bonding layer deposited on opposing surfaces of t... | 12/13/2005 |
| 6685817 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 02/03/2004 |
| 6683383 | Wirebond structure and method to connect to a microelectronic die A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to... | 01/27/2004 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an... | 12/30/2003 |
| 6662993 | Bondhead lead clamp apparatus An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wi... | 12/16/2003 |
| 6660563 | Method and system for assembling a printed circuit board using a land grid array A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number ... | 12/09/2003 |
| 6655023 | Method and apparatus for burning-in semiconductor devices in wafer form Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect... | 12/02/2003 |
| 6651321 | Microelectronic joining processes A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the conne... | 11/25/2003 |
| 6642082 | Method for manufacturing a resin-sealed semiconductor device A heat plate includes projections for supporting half-etched portions of first signal connection leads, respectively. A lead frame having a resin film mounted thereon is mounted on the heat plate, and thin metal wires are respectively connected to the hal... | 11/04/2003 |
| 6637636 | Apparatus of clamping semiconductor devices using sliding finger supports An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a porti... | 10/28/2003 |
| 6624648 | Probe card assembly A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of t... | 09/23/2003 |
| 6615485 | Probe card assembly and kit, and methods of making same A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereo... | 09/09/2003 |
| 6604670 | Lead penetrating clamping system An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp... | 08/12/2003 |
| 6604671 | Bondhead lead clamp apparatus and method A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to prov... | 08/12/2003 |
| 6595406 | Concave face wire bond capillary and method An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding... | 07/22/2003 |
| 6555401 | Method of controlling bond process quality by measuring wire bond features A computerized system and method for inspecting and measuring a ball-shaped wire bond formed by an automated bonder pre-programmed to attach a connecting bond onto a bond pad of an integrated circuit by first obtaining a first image of said bond pad befor... | 04/29/2003 |
| 6543131 | Microelectronic joining processes with temporary securement A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and a... | 04/08/2003 |
| 6494357 | Lead penetrating clamping system An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp ... | 12/17/2002 |
| 6492251 | Microelectronic joining processes with bonding material application A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part b... | 12/10/2002 |
| 6484922 | Apparatus and method of clamping semiconductor devices using sliding finger supports An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that... | 11/26/2002 |
| 6479757 | Method of mounting a plurality of electronic parts on a circuit board An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decrease... | 11/12/2002 |
| 6477768 | Method and contact point for establishing an electrical connection A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact su... | 11/12/2002 |
| 6474532 | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The... | 11/05/2002 |
| 6472304 | Wire bonding to copper The specification describes techniques for wire bonding gold wires to copper metallization in semiconductor integrated circuits. A barrier layer is formed on the copper, and an aluminum bonding pad is formed on the barrier layer. Gold wire is then thermoc... | 10/29/2002 |
| 6464123 | Bondhead lead clamp apparatus and method An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wi... | 10/15/2002 |
| 6454153 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The... | 09/24/2002 |
| 6439450 | Concave face wire bond capillary An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding... | 08/27/2002 |
| 6435399 | Method of checking wirebond condition A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking metho... | 08/20/2002 |
| 6430809 | Method for bonding conductors, in particular beam leads A method for bonding conductors onto semiconductor components is disclosed, where an opening is provided in an insulation layer on a semiconductor component. At least one conductor extends across the opening, where the conductor is bonded onto the semicon... | 08/13/2002 |
| 6429094 | Treatment process for molecular bonding and unbonding of two structures Process for providing separable structures comprising providing at least two structures wherein at least one structure contains a diffusable element contacting said structures under conditions providing molecular bonding of said structures along a bonding... | 08/06/2002 |
