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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 7416919 | Method for wafer level stack die placement A method for wafer level stack die placement is disclosed. At first, a wafer including a plurality of dice is provided. The wafer is adhered to a photosensitive adhesive tape. The wafer is attached on a die carrier to fix at least one die from the wafer on the die c... | 08/26/2008 |
| 7405144 | Method for manufacturing probe card A method for manufacturing a probe card is provided. A first inactive layer, a first patterned photoresist layer and a first metal layer are sequentially formed on a substrate. The first metal layer has first through holes exposing a portion of the first patterned p... | 07/29/2008 |
| 7348222 | Method for manufacturing a thin film transistor and method for manufacturing a semiconductor device It is an object of the present invention to provide a method for removing the metal element from the semiconductor film which is different from the conventional gettering step for removing the metal element from the semiconductor film. In the present inventio... | 03/25/2008 |
| 7294914 | Interconnect structure An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate. ... | 11/13/2007 |
| 7232774 | Polycrystalline silicon layer with nano-grain structure and method of manufacture A method of forming polycrystalline silicon with ultra-small grain sizes employs a differential heating of the upper and lower sides of the substrate of a CVD apparatus, in which the lower side of the substrate receives considerably more power than the upper side, p... | 06/19/2007 |
| 6596964 | Method of attaching a component to a connection support by welding without the addition of material The present invention concerns a method of attaching at least one component (12) provided with a plurality of electrical connection terminals (18), to a connection support (10), in which: a) a connection support is provided, made of a material transparent... | 07/22/2003 |
| 6501043 | Apparatus and method for laser welding of ribbons A method and apparatus for laser welding a section of a ribbon to a substrate or substrate pad uses a laser beam that passes through an aperture in a bond head. The laser beam may be supplied to the bond head using an optic fiber. This method is useful fo... | 12/31/2002 |
| 6478906 | Method for bonding a flexible substrate to a chip Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy be... | 11/12/2002 |
| 6476346 | Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot t... | 11/05/2002 |
| 6397465 | Connection of electrical contacts utilizing a combination laser and fiber optic push connect system A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally ... | 06/04/2002 |
| 6390853 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam are herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuse... | 05/21/2002 |
| 6353202 | Apparatus and method for producing a chip-substrate connection An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the ch... | 03/05/2002 |
| 6284564 | HDI chip attachment method for reduced processing A method according to an aspect of the invention, for interconnecting electrical contacts or electrodes (230be) of semiconductor chips (230a, 230b, 230c) in an HDI context, includes the step of applying laser energy to make a pattern of apertures through ... | 09/04/2001 |
| 6236015 | Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot t... | 05/22/2001 |
| 6211053 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 04/03/2001 |
| 6072148 | Device for producing connections between two respective contact elements by means of laser energy A device for producing by means of laser energy a plurality of connections etween contact elements of respective contact element pairs has a holding arrangement for holding a plurality of optical fibers having respective optical fiber ends. A positioner is... | 06/06/2000 |
| 6056188 | Method of attaching a component to a plate-shaped support A method of attaching an electronic component to a surface of a plate-shaped support member has as a first step the step of applying the electronic component to the surface of the support member, a solder being arranged between the electronic component an... | 05/02/2000 |
| 6001725 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 12/14/1999 |
| 5956607 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 09/21/1999 |
| 5946597 | Semiconductor chip mounting method A semiconductor chip mounting method consisting of steps is performed to mount a semiconductor chip on a substrate. Herein, an electrode is formed on a main surface of the semiconductor chip and is covered with an insulating film. A contact hole is formed... | 08/31/1999 |
| 5938951 | Method and apparatus for the bonding of a contact element Method and apparatus for bonding a contact element (17) on a substrate (20), in which the contact element is held by a connecting device designed, in particular, as a bonding head (11) and the contact element or the substrate or both are loaded with therm... | 08/17/1999 |
| 5872405 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 02/16/1999 |
| 5829125 | Method of manufacturing circuit module The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit mod... | 11/03/1998 |
| 5731244 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 03/24/1998 |
| 5528072 | Integrated circuit having a laser connection of a conductor to a doped region of the integrated circuit The conductor 15 to be connected to the doped region 12 of the substrate 11 has an edge 15a at which the laser beam 20 is aimed, regulated such as to definitively create a zone of low electrical resistance 19 in the dielectric layer 13 that separates the ... | 06/18/1996 |
| 5517059 | Electron and laser beam welding apparatus A method and apparatus for electron or laser beam welding of semiconductor subassemblies to larger terminal members, without exposing semiconductor chips in such subassemblies to detrimental welding "flash".... | 05/14/1996 |
| 5500502 | Bonding method and apparatus An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state o... | 03/19/1996 |
| 5438165 | Integrated circuit interconnect leads releasably mounted on film A method and film/interconnect lead combination for attaching a plurality of sets of interconnect leads on a strip of film using an adhesive which loses bonding strength upon being exposed to energy such as heat or ultra violet light. The film holds the i... | 08/01/1995 |
| 5400218 | Device for the 3D encapsulation of semiconductor chips Disclosed is a 3D encapsulation of semiconductor chips, each chip containing for example an integrated circuit, this encapsulation being aimed at optimising heat dissipation by conduction. Connection means are associated with each chip, making it possible... | 03/21/1995 |
| 5272307 | Method and apparatus for laser soldering of microelectronic lead-pad assemblies on ceramic substrates This invention relates to an method and apparatus for soldering microelectronic lead connections to pads on a ceramic substrate with the aid of a fiber based Neodymium:yttrium-aluminum-garnet (Nd:YAG) laser. Such structures of this type, generally, provid... | 12/21/1993 |
| 5272310 | Soldering method The present invention relates to a method of soldering electronic components to each other. When a member to be bonded is soldered to a base material by irradiating the member to be bonded with laser lights, the laser lights are incident upon a laser ligh... | 12/21/1993 |
| 5231050 | Method of laser connection of a conductor to a doped region of the substrate of an integrated circuit The conductor 15 to be connected to the doped region 12 of the substrate 11 has an edge 15a at which the laser beam 20 is aimed, regulated such as to definitively create a zone of low electrical resistance 19 in the dielectric layer 13 that separates the ... | 07/27/1993 |
| 5206712 | Building block approach to microwave modules Microwave components are prepackaged and pretested to provide standard microwave components or subsystems. A dielectric overlay interconnection structure enables accurate testing and rework of out of specification packages. Microwave systems are formed of... | 04/27/1993 |
| 5196268 | Integrated circuit interconnect leads releasably mounted on film A method and film/interconnect lead combination for attaching a plurality of sets of interconnect leads on a strip of film using an adhesive which loses bonding strength upon being exposed to energy such as heat or ultra violet light. The film holds the i... | 03/23/1993 |
| 5194710 | Method and apparatus for laser masking of lead bonding An apparatus and method of making a beam of directed energy used to bond leads to bonding areas is disclosed. The masking tool preferably includes a groove adapted to allow the beam to strike the lead while masking the surrounding substrate to prevent dam... | 03/16/1993 |
| 5164566 | Method and apparatus for fluxless solder reflow A method for reflowing solder without flux includes the steps of placing a first metallic element in contact with a second, solder-plated element, thereby defining a bond site; and causing a laser beam to impinge on the bond site. An apparatus for perform... | 11/17/1992 |
| 5057461 | Method of mounting integrated circuit interconnect leads releasably on film A method and film/interconnect lead combination for attaching a plurality of sets of interconnect leads on a strip of film using an adhesive which loses bonding strength upon being exposed to energy such as heat or ultra violet light. The film holds the i... | 10/15/1991 |
| 5052102 | Laser induced electrical connection of integrated circuits Process for electrically connecting non-planar electronic elements to a motherboard. A radiation sensitive metallic conversion compound is applied as a coating which extends at least between electrical connection sites on the electronic element and mother... | 10/01/1991 |
| 5049718 | Method of laser bonding for gold, gold coated and gold alloy coated electrical members A method is disclosed for laser bonding two highly reflective electrical members. The first electrical member is coated with a coating alloy containing the metal of the second electrical member and a coupling material that is well absorbent of laser energ... | 09/17/1991 |
| 5010036 | Low temperature semiconductor bonding process with chemical vapor reaction A semiconductor chip (14) is bonded to a substrate (16) by a metallic molecular bond interface (28, 38, 30). The chip and the substrate are separated by a gap (18), and a metal-bearing gas is introduced in the gap. A thermal energy source (22) directs a f... | 04/23/1991 |
