Bizarre Patents
An electrified table cloth for preventing crawling insects from gaining access to the consumer's food or drink.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7427571 | Reactor design for reduced particulate generation Particle formation in semiconductor fabrication process chambers is reduced by preventing condensation on the door plates that seal off the process chambers. Particles can be formed in a process chamber when reactant gases condense on the relatively cool surfaces of... | 09/23/2008 |
| 7405103 | Process for fabricating chip embedded package structure A process for fabricating a chip embedded package structure is provided. A stiffener is disposed on a tape. A chip is disposed on the tape inside a chip opening of the stiffener such that an active surface of the chip faces the tape. Through holes are formed passing... | 07/29/2008 |
| 7382042 | COF flexible printed wiring board and method of producing the wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding carried out after mounting of semiconductor chips, whereby reliabilit... | 06/03/2008 |
| 7282395 | Method of making exposed pad ball grid array package A method of making an exposed-pad ball-grid array package (11) includes applying a conductive sheet (16) to an adhesive tape (18). Stamping the conductive sheet (16) to form a die pad (24) and separating the remainder (26) o... | 10/16/2007 |
| 7262083 | Method of manufacturing a semiconductor device Salient electrodes on a semiconductor chip and leads on a film substrate are to be connected together with a high accuracy. A change in lead pitch which occurs at the time of connecting salient electrodes on a semiconductor chip and inner leads on a film substrate w... | 08/28/2007 |
| 7198989 | Method of producing a COF flexible printed wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF fl... | 04/03/2007 |
| 7189600 | Methods for fabricating stiffeners for flexible substrates Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiff... | 03/13/2007 |
| 6670220 | Semiconductor device and manufacture method of that A non-leaded semiconductor device which does not cause a flaw and contamination with a foreign substance on mounting surfaces of external electrode terminals of another non-leaded semiconductor device, and a method of fabricating the same. In fabrication ... | 12/30/2003 |
| 6653169 | Packaged semiconductor and process for manufacturing the same A method of manufacturing a packaged semiconductor device includes mounting a semiconductor device having multiple leads. The leads are formed by mounting the semiconductor device in a lead frame and punching and sealing the leads in the semiconductor dev... | 11/25/2003 |
| 6627994 | Semiconductor device and film carrier tape The present invention is a semiconductor device with improved adhesion properties of a resin with a wiring pattern, comprising a film fragment 14 having a patterned wiring pattern 16 including a projection 17, a semiconductor chip 12 having electrodes 13 ... | 09/30/2003 |
| 6624007 | Method of making leadframe by mechanical processing A semiconductor device is fabricated in the following manner. First, semiconductor chips are mounted on a leadframe prepared from an electroconductive strip of a uniform thickness. Then, wire-bonding is performed on the respective chips, and a resin layer... | 09/23/2003 |
| 6607940 | Method of manufacturing semiconductor devices and semiconductor devices made according to the method A method of manufacturing semiconductor devices. The method includes the steps of: providing a lead frame assembly having oppositely facing first and second sides; mounting a first semiconductor chip on the first side of the lead frame assembly; mounting ... | 08/19/2003 |
| 6605523 | Manufacturing method for semiconductor device A semiconductor device and a manufacturing method thereof are provided, wherein both bumps of a semiconductor chip and leads on a tape substrate can be accurately connected at the time of performing thermocompression bonding of the two using a heating too... | 08/12/2003 |
| 6565706 | Support-frame bonding apparatus A support-frame bonding apparatus has an upper pressing member to which a semiconductor device is supplied and a lower pressing member to which a support frame is supplied. An elastic member is provided to the lower surface of a pressing tool in the upper... | 05/20/2003 |
| 6566739 | Dual chip package The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes ... | 05/20/2003 |
| 6544817 | Method for sawing a moulded leadframe package The present invention relates to a new method for sawing a moulded leadframe package (1) into individual integrated circuits (11). In the present invention sawing of the moulded leadframe package (1) is done on the leads (13) instead of on the connecting ... | 04/08/2003 |
| 6516515 | Semiconductor integrated circuit A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGA.multidot.IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and ea... | 02/11/2003 |
| 6509205 | Apparatus and method for providing mechanically pre-formed conductive leads The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a... | 01/21/2003 |
| 6506980 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device A method of manufacturing a tape carrier comprises: a step of providing a tape carrier having bonding portions formed in rows in the width direction, repeating in the longitudinal direction, and having identification marks delimiting regularly repeating m... | 01/14/2003 |
| 6505400 | Method of making chip scale package with heat spreader A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach me... | 01/14/2003 |
| 6504257 | Apparatus and method for providing mechanically pre-formed conductive leads The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a... | 01/07/2003 |
| 6474532 | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The... | 11/05/2002 |
| 6460245 | Method of fabricating semiconductor chip assemblies A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first s... | 10/08/2002 |
| 6454153 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The... | 09/24/2002 |
| 6452257 | Film carrier tape This is a semiconductor device made by using a film carrier tape and method of making the same, wherein the package size is close to the chip size and connection portions for electrodes of a semiconductor chip are not exposed. Electroplating is performed ... | 09/17/2002 |
| 6444494 | Process of packaging a semiconductor device with reinforced film substrate Semiconductor devices are manufactured, using film substrates, as follows. Individual film substrates are separated from a film substrate tape having a plurality of film substrates continuously and integrally connected to each other, each the film substra... | 09/03/2002 |
| 6436731 | Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing material A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that c... | 08/20/2002 |
| 6425179 | Method for assembling tape ball grid arrays According to the present invention, a method for creating a package for a semiconductor die, the package comprising a flexible tape, comprises the following steps. A support with an opening has a plurality of arms extending through at a portion of the ope... | 07/30/2002 |
| 6423580 | Method for manufacturing a dual chip package The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes ... | 07/23/2002 |
| 6399958 | Apparatus for visual inspection during device analysis Aspects for electrical trace inspection during device analysis for devices with solder ball attachments are described. In a method aspect, the method includes forming a desired integrated circuit device including bond wire attachments. The bond wire attac... | 06/04/2002 |
| 6400020 | Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arr... | 06/04/2002 |
| 6365436 | Connecting multiple microelectronic elements with lead deformation A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with ... | 04/02/2002 |
| 6357275 | Apparatus and method for providing mechanically pre-formed conductive leads The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a... | 03/19/2002 |
| 6344681 | Semiconductor package produced by solder plating without solder residue The present invention relates to a packaged semiconductor that includes a semiconductor having a plurality of leads extending therefrom. The leads are formed by mounting the semiconductor device in a lead frame and punching and sealing the leads in the se... | 02/05/2002 |
| 6338982 | Enhancements in framed sheet processing A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be f... | 01/15/2002 |
| 6329222 | Interconnect for packaging semiconductor dice and fabricating BGA packages An interconnect for BGA packages, a BGA package fabricated using the interconnect, and a method for fabricating BGA packages using the interconnect, are provided. The interconnect includes multiple polymer substrates on which patterns of conductors are fo... | 12/11/2001 |
| 6316288 | Semiconductor device and methods of manufacturing film camera tape The present invention is a semiconductor device with improved adhesion properties of a resin with a wiring pattern, comprising a film fragment 14 having a patterned wiring pattern 16 including a projection 17, a semiconductor chip 12 having electrodes 13 ... | 11/13/2001 |
| 6314639 | Chip scale package with heat spreader and method of manufacture A dense semiconductor flip-chip device is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach methods, en... | 11/13/2001 |
| 6312976 | Method for manufacturing leadless semiconductor chip package A method of manufacturing a leadless semiconductor chip package comprises the steps of: attaching a semiconductor die onto a die pad of a lead frame, wherein the lead frame comprises a plurality of leads arranged about the periphery of the die pad and eac... | 11/06/2001 |
| 6309910 | Microelectronic components with frangible lead sections Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The lead is formed by de... | 10/30/2001 |
