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| Number | Title | Issue Date |
| 7427517 | Stacking apparatus and method for stacking integrated circuit elements A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit th... | 09/23/2008 |
| 7393772 | Wirebond structure and method to connect to a microelectronic die A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a ... | 07/01/2008 |
| 7384818 | Electronic package for image sensor, and the packaging method thereof A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defin... | 06/10/2008 |
| 7368824 | Diffusion solder position, and process for producing it A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for... | 05/06/2008 |
| 7355280 | Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is form... | 04/08/2008 |
| 7348215 | Methods for assembly and packaging of flip chip configured dice with interposer A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconduc... | 03/25/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7331737 | Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a first semiconductor chip having a first bonding pad; a second semiconduct... | 02/19/2008 |
| 7300819 | Semiconductor device, method for mounting the same, and method for repairing the same A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A ... | 11/27/2007 |
| 7298049 | Submount for mounting semiconductor device A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4 | 11/20/2007 |
| 7294906 | Wiring technique An apparatus for supplying electrical power to a movable member. The apparatus includes a fixed member, the movable member moving relative to the fixed member, a flexible wiring member having an end connected to the movable member and another end connected to the fi... | 11/13/2007 |
| 7291900 | Lead frame-based semiconductor device packages incorporating at least one land grid array package A lead frame-based semiconductor device package including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads on the same side of the interpose... | 11/06/2007 |
| 7276437 | Semiconductor device and manufacturing method thereof In a manufacturing method of a semiconductor device, a substrate and a plurality of semiconductor chips stacked on the substrate are connected to each other by a ball bonding method adopting a reverse method. Specifically, after first bonding on a bonding pad on the... | 10/02/2007 |
| 7259449 | Method and system for sealing a substrate A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprise... | 08/21/2007 |
| 7253026 | Ultra-thin semiconductor package device and method for manufacturing the same An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the ... | 08/07/2007 |
| 7232740 | Method for bumping a thin wafer Method of making a bumped thinned circuit wafer includes providing a silicon circuit wafer, and providing a conductive layer on it. Then, a first temporary support, such as a handle wafer, may be attached by an acrylic bond. The circuit wafer may then be thinned to ... | 06/19/2007 |
| 7224066 | Bonding material and circuit device using the same A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, a... | 05/29/2007 |
| 7221055 | System and method for die attach using a backside heat spreader According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at l... | 05/22/2007 |
| 7220663 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby A conductive connection forming method includes forming a first layer comprising a first metal on a substrate and forming a second layer comprising a second metal different from the first metal on the first layer. At least a part of the first layer may be transforme... | 05/22/2007 |
| 7214604 | Method of fabricating ultra thin flip-chip package Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the s... | 05/08/2007 |
| 7164208 | Semiconductor device and method for manufacturing the same There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. A... | 01/16/2007 |
| 7145251 | Colored conductive wires for a semiconductor package The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed ... | 12/05/2006 |
| 7141453 | Method of mounting wafer on printed wiring substrate To make it possible to utilize both surfaces of a wafer, a wafer (1) is provided with a through hole (2) between upper and lower surfaces, an insulating layer (14) is formed in an inner surface of the through hole (2), rewiring circuits (... | 11/28/2006 |
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a con... | 10/10/2006 |
| 7087513 | Method to produce low strength temporary solder joints The present invention provides a method for producing a temporary chip carrier for semiconductor chip burn-in test and speed sorting. A multi-layered substrate or card, usually comprised of one of various materials is made by offsetting the conductor-filled vias or ... | 08/08/2006 |
| 6685817 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 02/03/2004 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an... | 12/30/2003 |
| 6660563 | Method and system for assembling a printed circuit board using a land grid array A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number ... | 12/09/2003 |
| 6655023 | Method and apparatus for burning-in semiconductor devices in wafer form Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect... | 12/02/2003 |
| 6653170 | Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The chip includes a conductive pad and the support circuit includes a conductive trace. An elongated wire that electrically connects the pad to the trace is attache... | 11/25/2003 |
| 6630643 | Method and structure for forming metallic interconnections using directed thermal diffusion Energy is applied to a portion of a conducting body. In preferred embodiments, relative motion between the conducting body and the energy source is created such that the energy source moves along a thermal diffusion front, thereby enhancing the thermal di... | 10/07/2003 |
| 6624648 | Probe card assembly A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of t... | 09/23/2003 |
| 6615485 | Probe card assembly and kit, and methods of making same A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereo... | 09/09/2003 |
| 6581820 | Lead bonding method for SMD package Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package ... | 06/24/2003 |
| 6562709 | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base and a conductive trace. The conductive trace includes a pillar and a routing line. An electroplated contact terminal... | 05/13/2003 |
| 6563225 | Product using Zn-Al alloy solder There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase o... | 05/13/2003 |
| 6483328 | Probe card for probing wafers with raised contact elements A probe card is provided for contacting an electric componet with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to ha... | 11/19/2002 |
| 6476333 | Raised contact structures (solder columns) An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate membe... | 11/05/2002 |
| 6471110 | Method and apparatus for mounting semiconductor chips With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, th... | 10/29/2002 |
| 6392305 | Chip scale package of semiconductor A chip scale package, which can be fabricated on a print circuit board, comprises a chip having multiple electrodes, a plurality of conductive blocks, and an insulating material. The electrodes of the chip are electrically connected to the conductive bloc... | 05/21/2002 |
