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| Number | Title | Issue Date |
| 7435626 | Rearrangement sheet, semiconductor device and method of manufacturing thereof There are provided a semiconductor device construction having more degrees of design freedom of the semiconductor element than prior arts, and a method of manufacturing such device easily and at low cost. For this purpose, a rearrangement sheet is employed provided ... | 10/14/2008 |
| 7410837 | Method of manufacturing mounting substrate A method for manufacturing a mounting substrate on which a semiconductor chip is mounted includes: forming a wiring section by electrolytic plating on a first face of a supporting substrate which is made of an insulating material, by supplying electric power from a ... | 08/12/2008 |
| 7405103 | Process for fabricating chip embedded package structure A process for fabricating a chip embedded package structure is provided. A stiffener is disposed on a tape. A chip is disposed on the tape inside a chip opening of the stiffener such that an active surface of the chip faces the tape. Through holes are formed passing... | 07/29/2008 |
| 7341882 | Method for forming an opto-electronic device A method for forming an opto-electronic device through low temperature processes is provided. An active layer is bonded to a substrate by a common adhesive to maintain or increase the luminous efficiency of the opto-electronic because the electric conductive element... | 03/11/2008 |
| 7329603 | Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s... | 02/12/2008 |
| 7329617 | Coating for enhancing adhesion of molding compound to semiconductor devices A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconducto... | 02/12/2008 |
| 7312108 | Method for assembling a ball grid array package with two substrates An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiff... | 12/25/2007 |
| 7306971 | Semiconductor chip packaging method with individually placed film adhesive pieces Individual pieces of film adhesive (42) are placed on a support surface (46). Diced semiconductor chips (24) are individually placed on the individual pieces of the film adhesive thereby securing the diced semiconductor chips to the support surf... | 12/11/2007 |
| 7294587 | Component built-in module and method for producing the same A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of t... | 11/13/2007 |
| 7264977 | Method of RFIC die-package configuration A method for packaging a radio frequency integrated circuit (RFIC) in multiple packages begins by determining a 1st position of the RFIC die in a 1st package wherein the positioning is such to minimize adverse affects of parasitic components of... | 09/04/2007 |
| 7238550 | Methods and apparatus for fabricating Chip-on-Board modules An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a pr... | 07/03/2007 |
| 7223635 | Oriented self-location of microstructures with alignment structures An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the microstructures to be oriented in receptacles having shapes that are com... | 05/29/2007 |
| 7189600 | Methods for fabricating stiffeners for flexible substrates Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiff... | 03/13/2007 |
| 7183140 | Injection molded metal bonding tray for integrated circuit device fabrication An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is plac... | 02/27/2007 |
| 7176063 | High density 3-D integrated circuit package A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fi... | 02/13/2007 |
| 7172926 | Method for manufacturing an adhesive substrate with a die-cavity sidewall A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed betwe... | 02/06/2007 |
| 7122396 | Semiconductor acceleration sensor and process for manufacturing the same The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is acco... | 10/17/2006 |
| 7101773 | Method of producing a contact system on the rear of a component with stacked substrates The present invention relates to a process for making a contact point (8) on the rear surface of a component including at least one first substrate (10) with at least one active region (12) and at least one second substrate (20) for prote... | 09/05/2006 |
| 6977112 | Non-contact information recording medium for ink-jet recording and image forming process Disclosed herein is a non-contact information recording medium for ink-jet recording, on and from which information can be recorded and read in a non-contact state from the outside, comprising an electronic information storing circuit part and an image recording par... | 12/20/2005 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices; a second wafer including one or more integrated circuit (IC) devices; and a metal bonding layer deposited on opposing surfaces of t... | 12/13/2005 |
| 6864579 | Carrier with a metal area and at least one chip configured on the metal area A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 μm and 10 μm, is arranged on the metal area. The chip does not have a ... | 03/08/2005 |
| 6703075 | Wafer treating method for making adhesive dies A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage pro... | 03/09/2004 |
| 6700183 | Low temperature die attaching material for BOC packages and products comprising such material An apparatus and method is provided for forming a board-on-chip (BOC) package. An adhesive material including a carrier and microcapsules distributed in the carrier is used to bond a semiconductor component to a mounting surface in a BOC package. The micr... | 03/02/2004 |
| 6699928 | Adhesive composition for use in packaging applications An adhesive composition and methods incorporating the adhesive composition in semiconductor applications are provided. The adhesive composition is an instant setting adhesive composition that does not require external energy input such as heat or radiatio... | 03/02/2004 |
| 6696669 | Circuit and method for heating an adhesive to package or rework a semiconductor die System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats... | 02/24/2004 |
| 6686015 | Transferable resilient element for packaging of a semiconductor chip and method therefor A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the ... | 02/03/2004 |
| 6685777 | Paste applicator and paste application method for die bonding A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A di... | 02/03/2004 |
| 6677185 | Method of affixing a heat sink to a substrate and package thereof A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position and electrically connecting the substrate, an appropriate... | 01/13/2004 |
| 6673441 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature... | 01/06/2004 |
| 6670222 | Texturing of a die pad surface for enhancing bonding strength in the surface attachment Laser beam or pulsed output is provided for enhancing the bonding strength between surfaces that are secured together, such as by lamination process or an adhesive, by texturing with a plurality of indentations formed in at least one of the surfaces to be... | 12/30/2003 |
| 6660614 | Method for anodically bonding glass and semiconducting material together A method is provided for anodically bonding glass and semiconducting material. A glass sample is immersed in a molten salt bath for a fixed period of time to modify the surface of the glass sample via ion exchange. The salt is a lithium salt or a proton s... | 12/09/2003 |
| 6661102 | Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress A semiconductor packaging apparatus for preventing cracking and delamination in a packaged semiconductor chip by controlling the die attach fillet height. Specifically, the present invention controls the die attach material height, thereby controlling the... | 12/09/2003 |
| 6656819 | Process for producing semiconductor device A process for producing a semiconductor device, including the steps of forming grooves of a cut depth smaller than the thickness of a wafer; sticking a surface protective sheet onto the wafer surface; grinding the back of the wafer to divide the wafer int... | 12/02/2003 |
| 6649012 | Adhesion method and electronic component The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the he... | 11/18/2003 |
| 6649448 | Method of manufacturing a semiconductor device having flexible wiring substrate Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is prov... | 11/18/2003 |
| 6645632 | Film-type adhesive for electronic components, and electronic components bonded therewith A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecu... | 11/11/2003 |
| 6645828 | In situ plasma wafer bonding method A method for chemically bonding semiconductor wafers and other materials to one another without exposing wafers to wet environments, and a bonding chamber for in situ plasma bonding are disclosed. The in situ plasma bonding chamber allows plasma activatio... | 11/11/2003 |
| 6646332 | Semiconductor package device Disclosed are semiconductor packages and methods incorporating the use of vias in layers of leaded and nonleaded multilayer packages. The vias provide fluid communication between layers such that bonding material flows among layers for the formation of a ... | 11/11/2003 |
| 6646354 | Adhesive composition and methods for use in packaging applications An adhesive composition and methods incorporating the adhesive composition in semiconductor applications are provided. The adhesive composition is an instant setting adhesive composition that does not require external energy input such as heat or radiatio... | 11/11/2003 |
| 6642137 | Method for manufacturing a package structure of integrated circuits A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of... | 11/04/2003 |
