Bizarre Patents
Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 7411219 | Uniform contact A semiconductor device can comprise a contact material in substantially continuous contact with a contact region. In an embodiment the contact region may comprise an alloy comprising a wide band-gap material and a low melting point contact material. A wide band-gap ... | 08/12/2008 |
| 7407832 | Method for manufacturing semiconductor package A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mi... | 08/05/2008 |
| 7335995 | Microelectronic assembly having array including passive elements and interconnects A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic ele... | 02/26/2008 |
| 7319042 | Method and apparatus for manufacture and inspection of semiconductor device A semiconductor device is manufactured in such a way that a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires are completely sealed and enclosed in a resin corresponding to a package while external ends of leads are ex... | 01/15/2008 |
| 7312106 | Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to k... | 12/25/2007 |
| 7294853 | Substrate for mounting a semiconductor A substrate (1) is formed from a non-electrically conducting material and is for mounting a semiconductor chip (10). The substrate has a semiconductor chip mounting portion (6). A number of first electrically conducting contact portions (5 | 11/13/2007 |
| 7294533 | Mold compound cap in a flip chip multi-matrix array package and process of making same A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is al... | 11/13/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7250687 | Systems for degating packaged semiconductor devices with tape substrates A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a ... | 07/31/2007 |
| 7241637 | Method of producing LED bodies with the aid of a cross-sectional constriction Method of producing light-conducting LED bodies of a free-flowing material by introduction into a mold. Here, the volumetric flow of a free-flowing material, at a distance of the electrode plane from the charging point that is greater than 35% of the distance betwee... | 07/10/2007 |
| 7202110 | Embedded flat film molding A flat filter layer is received between upper and lower mold portions of a mold for packaging an integrated circuit sensor device, held by the mold over and in contact with the integrated circuit's sensing surface, in light compression between the sensing surface an... | 04/10/2007 |
| 7193331 | Semiconductor device and manufacturing process thereof One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin enco... | 03/20/2007 |
| 7129568 | Chip package and electrical connection structure between chip and substrate A chip package has lead frame, chip, generic wires, at least one characterized wire, ground wires and insulation material. The lead frame includes die pad, generic leads and at least a characterized lead structure. Generic leads and the characterized lead structure ... | 10/31/2006 |
| 7091583 | Method and structure for prevention leakage of substrate strip The present invention provides a structure and a method for prevention leakage of a substrate strip. The substrate strip includes an edge portion and a plurality of units. A patterned metal layer on a surface of the substrate strip includes at least one plating bus ... | 08/15/2006 |
| 6700210 | Electronic assemblies containing bow resistant semiconductor packages A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member encapsulating the molded inner member. The inner member ri... | 03/02/2004 |
| 6699731 | Substrate of semiconductor package A fabricating method for a semiconductor package is proposed, in which a chip carrier accommodates at least one semiconductor chip, which is attached with an interface layer formed on a covering module plate consisting of at least one covering plate, whil... | 03/02/2004 |
| 6700192 | Leadframe and method of manufacturing a semiconductor device using the same A leadframe used for a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a plurality of lead portions extending from the fra... | 03/02/2004 |
| 6700186 | Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semic... | 03/02/2004 |
| 6700194 | Semiconductor device A semiconductor device which satisfies both the requirements for radiation performance and for miniaturization while having a semiconductor element for a heavy current. The semiconductor device has an IGBT element (1) and diode element (2) which are provi... | 03/02/2004 |
| 6700190 | Integrated circuit device with exposed upper and lower die surfaces An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; and 2) an integrated circuit (IC... | 03/02/2004 |
| 6696752 | Encapsulated semiconductor device with flash-proof structure An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a bottom surface of the lead frame, where the dam bar is atta... | 02/24/2004 |
| 6696006 | Mold for flashless injection molding to encapsulate an integrated circuit chip An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complement... | 02/24/2004 |
| 6692989 | Plastic molded type semiconductor device and fabrication process thereof A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pa... | 02/17/2004 |
| 6692988 | Method of fabricating a substrate-based semiconductor package without mold flash A method is proposed for fabricating a substrate-based semiconductor package without mold flash. The proposed method is characterized by the provision of one or more dummy traces between each overly-spaced pair of signal traces that might cause mold flash... | 02/17/2004 |
| 6690086 | Apparatus and method for reducing interposer compression during molding process A method for inhibiting damage caused to semiconductor die packages during a molding process, and the semiconductor die packages formed therefrom, is described. One or more openings are provided in a die carrier which are filled with a material which is m... | 02/10/2004 |
| 6686226 | Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a c... | 02/03/2004 |
| 6686227 | Method and system for exposed die molding for integrated circuit packaging A method for exposed die molding for integrated circuit packaging is provided that includes providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger. A substrate of an integrated circuit structure is clamped... | 02/03/2004 |
| 6686268 | Method of forming overmolded chip scale package and resulting product A method for forming a semiconductor device includes forming a conductive bump on one or more bond pads of a semiconductor substrate of a semiconductor wafer. A top or uppermost portion of each conductive bump is then planarized. The exposed portions of a... | 02/03/2004 |
| 6683388 | Method and apparatus for packaging a microelectronic die The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to ... | 01/27/2004 |
| 6682952 | Method of forming the resin sealed semiconductor device using the lead frame A molding equipment for a resin shielding semiconductor device includes a lower platen having a lower cavity, and an upper platen having an upper cavity, and a recess which is adjacent to the upper cavity. A lead frame has an opening serving as a passage ... | 01/27/2004 |
| 6680531 | Multi-chip semiconductor package A multi-chip semiconductor package is proposed, in which a lead frame is formed with a chip carrier that consists of at least one supporting frame and a plurality of downwardly extending portions integrally formed with the supporting frame. As the chip ca... | 01/20/2004 |
| 6677675 | Microelectronic devices and microelectronic die packages The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to ... | 01/13/2004 |
| 6676885 | Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the... | 01/13/2004 |
| 6677681 | Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant material. An organic compound layer which inherently forms o... | 01/13/2004 |
| 6674165 | Mold for a semiconductor chip A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a mold... | 01/06/2004 |
| 6670220 | Semiconductor device and manufacture method of that A non-leaded semiconductor device which does not cause a flaw and contamination with a foreign substance on mounting surfaces of external electrode terminals of another non-leaded semiconductor device, and a method of fabricating the same. In fabrication ... | 12/30/2003 |
| 6667439 | Integrated circuit package including opening exposing portion of an IC An IC package preferably includes an IC and encapsulating material surrounding the IC, with the encapsulating material having an opening therein to define an exposed portion of the IC. Vestigial portions of encapsulating material may be left on the expose... | 12/23/2003 |
| 6667193 | Semiconductor device and a method of manufacturing the same To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2... | 12/23/2003 |
| 6666997 | Method for removing cleaning compound flash from mold vents An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surfac... | 12/23/2003 |
| 6664647 | Semiconductor device and a method of manufacturing the same Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater an... | 12/16/2003 |
