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| Number | Title | Issue Date |
| 7432133 | Plastic packaged device with die interface layer Structure and method are provided for plastic encapsulated semiconductor devices having a buffer layer of low dielectric constant and/or low loss tangent material separating the die surface from the plastic encapsulation. Semiconductor wafers with substantially comp... | 10/07/2008 |
| 7427811 | Semiconductor substrate A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over a back side of the wafer while in a rough state from backgrinding without prior, conventional polishing or ... | 09/23/2008 |
| 7420129 | Semiconductor package including a semiconductor device, and method of manufacturing the same A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be f... | 09/02/2008 |
| 7407894 | Compound semiconductor particles and production process therefor There are provided: compound semiconductor particles that can display more excellent performance in functions peculiar to the compound semiconductor (e.g. luminosity and luminescence efficiency); and a production process for obtaining such compound semiconductor par... | 08/05/2008 |
| 7402459 | Quad flat no-lead (QFN) chip package assembly apparatus and method In one embodiment the present invention includes a method of fabricating a quad flat no-lead (QFN) chip package. The method includes forming a stamped lead frame; forming a die pad and a lead shrink on one side of the stamped lead frame; mounting a die on the die pa... | 07/22/2008 |
| 7393711 | Method of producing a digital fingerprint sensor and the corresponding sensor An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electri... | 07/01/2008 |
| 7393712 | Fluidic MEMS device A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective in... | 07/01/2008 |
| 7393716 | Encapsulated organic semiconductor device and method A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically le... | 07/01/2008 |
| 7387914 | Semiconductor device and process for fabrication thereof A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not m... | 06/17/2008 |
| 7384822 | Package for semiconductor components and method for producing the same The invention relates to a packaging for semiconductor components such as FBGA packages in BOC technology or the like, wherein at least the back and the lateral edges of a chip (2) mounted on a substrate are enclosed by a mold coating (6), the casting ... | 06/10/2008 |
| 7371610 | Process for fabricating an integrated circuit package with reduced mold warping A process for fabricating an integrated circuit package includes mounting a semiconductor die on a first surface of a metal carrier and forming electrical connections between the semiconductor die and ones of a plurality of contacts on the metal carrier. Next, using... | 05/13/2008 |
| 7352071 | Method of fabricating anti-warp package An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location undern... | 04/01/2008 |
| 7348220 | Resin-encapsulated type semiconductor packages, and production method and apparatus therefor The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is tak... | 03/25/2008 |
| 7332375 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad... | 02/19/2008 |
| 7329563 | Method for fabrication of wafer level package incorporating dual compliant layers A method is provided for forming wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads. The wafer level package includes a plurality of metal cap layers formed on top of a plurality of I/O pads to function as stress buf... | 02/12/2008 |
| 7314778 | Wafer-level processing of chip-packaging compositions including bis-maleimides A process of packaging a microelectronic chip includes wafer-level application of a chip-packaging composition that includes a polymer of a bis-maleimide. A process includes wafer-level addition of the chip-packaging compositions that include adding particulate fill... | 01/01/2008 |
| 7300823 | Apparatus for housing a micromechanical structure and method for producing the same Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure ... | 11/27/2007 |
| 7297624 | Semiconductor device and method for fabricating the same A method for fabricating a semiconductor device including forming a depression in a front surface of a semiconductor substrate, forming an electrode pad within the depression, forming structures including circuit devices and metal wires on the front surface of the s... | 11/20/2007 |
| 7288441 | Method for two-stage transfer molding device to encapsulate MMC module A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparat... | 10/30/2007 |
| 7285444 | Method of manufacturing semiconductor device A semiconductor device which includes: a semiconductor chip with plural pads; a tab connected with the semiconductor chip; bus bars which are located outside of the semiconductor chip and connected with the tab; a sealing body which resin-seals the semiconductor chi... | 10/23/2007 |
| 7279343 | De-packaging process for small outline transistor packages A method to de-packaging a semiconductor device to access and test the die within the package. The method involves initially removing molding compound from a first surface of the package to expose the underlying die attach pad of the package. A mask is then formed o... | 10/09/2007 |
| 7279781 | Two-stage transfer molding device to encapsulate MMC module A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion... | 10/09/2007 |
| 7271037 | Leadframe alteration to direct compound flow into package A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at... | 09/18/2007 |
| 7271039 | Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method A method for manufacturing a radiofrequency identification device which includes a manufacturing process for an antenna which includes screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting the support to hea... | 09/18/2007 |
| 7262507 | Semiconductor-mounted device and method for producing same Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin sealing, with a same height, a region disposed at and around first se... | 08/28/2007 |
| 7259449 | Method and system for sealing a substrate A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprise... | 08/21/2007 |
| 7253026 | Ultra-thin semiconductor package device and method for manufacturing the same An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the ... | 08/07/2007 |
| 7247521 | Semiconductor assembly encapsulation mold and method for forming same An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contai... | 07/24/2007 |
| 7226812 | Wafer support and release in wafer processing Methods and apparatuses for wafer support and release using sacrificial materials in wafer processing. In one embodiment, a solution of a sacrificial polymer is spray-coated on the wafer bump side to form a thin layer of the sacrificial polymer after solvent vaporiz... | 06/05/2007 |
| 7214562 | Method for encapsulating lead frame packages A method of encapsulating a plurality of IC chips attached to a lead frame strip that includes an outer frame and a plurality of vertical and horizontal connecting bars attached to the outer frame in a manner that defines a plurality of inner frames arranged in a ma... | 05/08/2007 |
| 7208345 | Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device A first reconstituted wafer is formed, followed by a first redistribution layer. In parallel, a second reconstituted wafer is formed. The second reconstituted wafer is diced along a gap such that individualized embedded chips are formed having tilted sidewalls defin... | 04/24/2007 |
| 7205170 | Method for the production of LED bodies The invention relates to a method for producing light-conducting LED bodies by injection molding into a mold of a material that is fusible prior to final solidification. Each LED body comprises at least one light-emitting chip and at least two wire-shaped electrodes... | 04/17/2007 |
| 7202107 | Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces an... | 04/10/2007 |
| 7193331 | Semiconductor device and manufacturing process thereof One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin enco... | 03/20/2007 |
| 7179689 | Package stress management Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in w... | 02/20/2007 |
| 7179688 | Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-... | 02/20/2007 |
| 7172927 | Warpage control of array packaging During the curing process of the package strips, especially during post encapsulant cure (PEC), undesirable warpage of package strips occurs. A carrier having angled lands and side-insertion clamp structures with angled clamp fins may be used to control this cure-in... | 02/06/2007 |
| 7163846 | Method for manufacturing circuit devices In order to prevent, in a resin sealing step, a conductive foil 10 from locally rising because of concentration of air intervening between the conductive foil 10 and lower mold 28A due to the charged pressure, a method for manufacturing circuit ... | 01/16/2007 |
| 7160756 | Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices A process for packaging semiconductor devices for flip chip and wire bond applications, wherein specific materials of the semiconductor devices are protected during device processing sequences and dicing procedures, has been developed. After definition of copper int... | 01/09/2007 |
| 7157310 | Methods for packaging microfeature devices and microfeature devices formed by such methods Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate hav... | 01/02/2007 |
