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| Number | Title | Issue Date |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7387902 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/17/2008 |
| 7173331 | Hermetic sealing cap and method of manufacturing the same A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a... | 02/06/2007 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an ... | 05/27/2003 |
| 6445062 | Semiconductor device having a flip chip cavity with lower stress and method for forming same There is provided a semiconductor device including (a) a substrate, (b) a semiconductor chip mounted on the substrate, (c) a wall having a closed cross-section and mounted on the substrate such that the semiconductor chip is surrounded by the wall, and (d... | 09/03/2002 |
| 6369449 | Method and apparatus for injection molded flip chip encapsulation The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an ... | 04/09/2002 |
| 6016006 | Thermal grease insertion and retention An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The cover plate is separated from the integrated circuit by a ... | 01/18/2000 |
| 5981312 | Method for injection molded flip chip encapsulation The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an ... | 11/09/1999 |
| 5976916 | Method of producing semiconductor device and encapsulating pellet employed therein A method of production of a semiconductor device such as a plastic pin grid array (PPGA) and a plastic ball grid array (PBGA) having a cavity-fill form. In this method, first, a semiconductor element (3) is placed in a cavity (6) formed in a multiple step... | 11/02/1999 |
| 5834835 | Semiconductor device having an improved structure for storing a semiconductor chip In the semiconductor of the present invention, the first pair of pad lines consisting of a plurality of pads are arranged on the bottom portion of the recess portion of the enclosure, the recess portion being made at the center portion of the enclosure by... | 11/10/1998 |
| 5477611 | Method of forming interface between die and chip carrier A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is ha... | 12/26/1995 |
| 5477084 | Microelectronic device packaging containing a liquid and method A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid ... | 12/19/1995 |
| 5413965 | Method of making microelectronic device package containing a liquid A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid ... | 05/09/1995 |
| 5318926 | Method for packaging an integrated circuit using a reconstructed plastic package A method of re-configuring any pre-fabricated plastic package (with or without a silicon chip and wires inside) so that an integrated circuit chip can be installed and interconnected for normal use. A pre-molded plastic package is abraded over (or molded ... | 06/07/1994 |
| 5173766 | Semiconductor device package and method of making such a package A semiconductor device package and a method of making such a package is described. The package comprises a flexible packaging substrate having a patterned metal layer onto which a semiconductor die is attached and a patterned insulative layer attached to ... | 12/22/1992 |
| 5067008 | IC package and IC card incorporating the same thereinto An IC package comprising an integrated substrate which includes a cavity, in which an IC chip is mounted, formed by a wall surrounding the IC chip, and a groove formed in the surrounding wall extending to surround and communicate with the cavity and metho... | 11/19/1991 |
| 4250347 | Method of encapsulating microelectronic elements Method for encapsulating microelectronic elements, starting from strip-like material including a number of interconnected conductor patterns each having a number of leads for the microelectronic element to be encapsulated, which comprises applying a micro... | 02/10/1981 |
