Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7390692 | Semiconductor device and method for manufacturing the same A semiconductor device (1) of the present invention includes a semiconductor element (103) including electrode parts (104), and a wiring substrate (108) including an insulation layer (101), electrode-part-connection electrodes (... | 06/24/2008 |
| 7387902 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/17/2008 |
| 7344915 | Method for manufacturing a semiconductor package with a laminated chip cavity A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated with the board to make the adhesive resin be attached to the board. Next... | 03/18/2008 |
| 7320940 | Method for manufacturing electronic device including package In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating pr... | 01/22/2008 |
| 7294529 | Method for embedding a component in a base This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it... | 11/13/2007 |
| 7294915 | Underfill and mold compounds including siloxane-based aromatic diamines An apparatus including a first substrate comprising a first set of contact points; a second substrate including a second set of contact points coupled to the first substrate through interconnections between a portion of the first set of contact points a portion of t... | 11/13/2007 |
| 7285439 | Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method A shielding case bank has shielding cases that arranged at a pitch twice as large as a pitch of molded articles in a molded article bank. Two shielding case banks are stacked one on the other with displacement from each other by half the pitch so that the shielding ... | 10/23/2007 |
| 7256067 | LGA fixture for indium assembly process An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate... | 08/14/2007 |
| 7229852 | Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device An adhesive layer containing a photo-curing adhesive and a thermosetting adhesive is formed on a semiconductor wafer in which a plurality of semiconductor elements are formed. The adhesive layer and the semiconductor wafer are adhered together by selectively exposin... | 06/12/2007 |
| 7172926 | Method for manufacturing an adhesive substrate with a die-cavity sidewall A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed betwe... | 02/06/2007 |
| 7172910 | Web fabrication of devices Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate. ... | 02/06/2007 |
| 7173331 | Hermetic sealing cap and method of manufacturing the same A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a... | 02/06/2007 |
| 7148080 | Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation p... | 12/12/2006 |
| 6621161 | Semiconductor device having a package structure A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first plate-like base substrate has a base electrode on the rear sur... | 09/16/2003 |
| 6511866 | Use of diverse materials in air-cavity packaging of electronic devices Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts--base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followe... | 01/28/2003 |
| 6309912 | Method of interconnecting an embedded integrated circuit A method of interconnecting electrical terminations (12) of an integrated circuit die (30) to corresponding circuit traces (22) of a circuit carrying substrate (20). The die is placed in a cavity (24) in the substrate such that the electrical terminations... | 10/30/2001 |
| 6268236 | Method of manufacturing a semiconductor device having a package structure, and semiconductor device manufactured thereby Semiconductor chips are housed in respective cavities formed in a plate-like base substrate, and plate-like cap members are bonded onto the base substrate. The base substrate is diced to thereby form a plurality of semiconductor packages. Penetrating hole... | 07/31/2001 |
| 6251219 | Method and apparatus for use in assembling electronic devices A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an elec... | 06/26/2001 |
| 6029730 | Hot shear apparatus and method for removing a semiconductor chip from an existing package The present invention provides a hot shear fixture for effectively and efficiently separating components of a device package for low yield analysis. More specifically, the hot shear fixture provides a cavity for receiving the desired device package and a ... | 02/29/2000 |
| 5885853 | Hollow chip package and method of manufacture Semiconductor package and method in which a chip is mounted in an opening in a frame with the back side of the chip facing outside the package, and a heatsink is positioned in direct thermal contact with the back side of the chip. In one preferred method ... | 03/23/1999 |
| 5669546 | Apparatus for manufacturing semiconductor device and method of manufacturing the semiconductor device using the same A semiconductor device is manufactured by a jig. The jig includes a pair of flat heat spreading devices with flat heaters, and an enclosing device for surrounding an assembly of the semiconductor device situated between the heat spreading devices. An asse... | 09/23/1997 |
| 5637919 | Perimeter independent precision locating member A perimeter independent precision locating member (22) for a semiconductor chip (10) so that contact sites upon the chip will be reliably positioned relative to connection members (18), such as contacts or leads, so that the chip may be electrically engag... | 06/10/1997 |
| 5315155 | Electronic package with stress relief channel There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the... | 05/24/1994 |
| 5311402 | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or b... | 05/10/1994 |
| 5234530 | Apparatus for controlling assembly force A system of assembling devices to substrates is disclosed. A pattern of lines and/or dots of bonding medium is formed on a substrate to provide a uniform support for the device. Apparatus and a method for applying the bonding medium to the substrates is a... | 08/10/1993 |
| 5231036 | Method of using a contamination shield during the manufacture of EPROM semiconductor package windows A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.... | 07/27/1993 |
| 5216806 | Method of forming a chip package and package interconnects A method of packaging an integrated circuit chip having an active surface with a pattern of input/output pads. A package member is positioned to frame the integrated circuit chip, leaving a gap between the active chip surface and an interconnect support s... | 06/08/1993 |
| 5196919 | Use of a contamination shield during the manufacture of semiconductor packages A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.... | 03/23/1993 |
| 5139972 | Batch assembly of high density hermetic packages for power semiconductor chips Batch assembly methods for high density packaging of power semiconductor chips in hermetic thin packagings includes providing silicon chip arrays with thermocompressively bonded foil contacts, preparing ceramic lid arrays which contain upper surface and l... | 08/18/1992 |
| 4924297 | Semiconductor device package structure A semiconductor device package comprising a package wall through which the position of the semiconductor device is to be determined. The package wall has apertures for exposing edges of the semiconductor device, thereby allowing the position of the semico... | 05/08/1990 |
| 4870476 | Integrated circuit packaging process and structure The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in th... | 09/26/1989 |
| 4689875 | Integrated circuit packaging process The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in th... | 09/01/1987 |
| 4417386 | Method for mounting a semiconductor device in a housing Method and apparatus for mounting a semiconductor device in a housing, which includes first providing a metallization on a part of the surface of the semiconductor body of the semiconductor device to be connected to the housing, subsequently permanently c... | 11/29/1983 |
| 4305897 | Packaging process for semiconductors A process for packaging semiconductors or integrated circuits including semiconductors involves positioning a lead frame on which semiconductors or an integrated circuit are mounted between two thermoplastic resin moldings, at least one of which moldings ... | 12/15/1981 |
| 4262165 | Packaging structure for semiconductor IC chip A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the bin... | 04/14/1981 |
| 4204721 | Manufacture of gas filled envelopes A method of manufacturing a hermetically sealed envelope comprising assembling envelope-forming components of which at least one is a vitreous wall forming component wherein the or each vitreous component is metallized along a zone where it is to be bonde... | 05/27/1980 |
| 4181249 | Eutectic die attachment method for integrated circuits A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is, silicon is either evaporated or deposited onto the backside of... | 01/01/1980 |
| 4159221 | Method for hermetically sealing an electronic circuit package A hermetically sealed electronic circuit package is formed by placing a preformed, uncured sealant between a circuitized ceramic substrate and a ceramic cover. The resultant assembly is placed in an oven which has been preheated to a temperature at least ... | 06/26/1979 |
| 4157611 | Packaging structure for semiconductor IC chip and method of packaging the same A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the bin... | 06/12/1979 |
