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Class 257/E21.379 - With single crystalline emitter, collector or base including extrinsic, link or graft base formed on th e silicon substrate, e.g., by epitaxy, recrystallization, after insulating device isolation (EPO)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E21.375. This
No. of patents: 160
Last issue date: 05/27/2008


1        
NumberTitleIssue Date
7378324Selective links in silicon hetero-junction bipolar transistors using carbon doping and method of forming same
Bipolar transistors and methods of forming the bipolar transistors. The method including forming a P-type collector in a silicon substrate; forming an intrinsic base on the collector, the intrinsic base including a first N-type dopant species, germanium and carbon; ...
05/27/2008
7368361Bipolar junction transistors and method of manufacturing the same
A substrate has a collector region of a first conductivity type, and a base layer of a single crystalline structure and including impurities of a second conductivity type is located over the collector region. An emitter region is defined at least in part by impuriti...
05/06/2008
7364990Epitaxial crystal growth process in the manufacturing of a semiconductor device
First and second preliminary epitaxial layers are grown from single-crystalline seeds in openings in an insulation layer until the first and second epitaxial layers are connected to each other. While the first and second preliminary epitaxial layers are being grown,...
04/29/2008
7348246Methods of fabricating non-volatile memory devices including divided charge storage structures
A semiconductor memory device includes a substrate having first and second source/drain regions therein and a channel region therebetween. The device also includes first and second charge storage layers on the channel region, a first insulating layer on the channel ...
03/25/2008
7341878Wavelength-converted semiconductor light emitting device
A material such as a phosphor is optically coupled to a semiconductor structure including a light emitting region disposed between an n-type region and a p-type region, in order to efficiently extract light from the light emitting region into the phosphor. The phosp...
03/11/2008
7323390Semiconductor device and method for production thereof
The semiconductor device according to the invention includes a substrate, a field insulating region which delimits an active region of the semiconductor substrate, a collector, at least one collector contact region associated with the collector, and a base with an a...
01/29/2008
7282418Method for fabricating a self-aligned bipolar transistor without spacers
According to one exemplary embodiment, a bipolar transistor comprises a base having a top surface. The bipolar transistor further comprises a sacrificial post situated on the top surface of the base. The bipolar transistor also comprises a conformal layer situated o...
10/16/2007
7265409Non-volatile semiconductor memory
A non-volatile semiconductor memory having a memory transistor including a stacked-layer film formed between a semiconductor substrate and a gate electrode and having a charge storage ability, a first conductivity type region of the semiconductor substrate in which ...
09/04/2007
6696342Small emitter and base-collector bi-polar transistor
In a high speed BJT device, the method for producing the device includes forming a self-aligned BJT through the use of a single mask by making use of a single layer of polysilicon. The method includes forming a window in the polysilicon to define a base p...
02/24/2004
6686250Method of forming self-aligned bipolar transistor
A self-aligned bipolar transistor and a method of formation thereof are provided. The bipolar transistor has an emitter region characterized by a y-shaped structure formed from bilayer polysilicon. The bilayer polysilicon includes a first polysilicon emit...
02/03/2004
6680522Semiconductor device with reduced electrical variation
An object of the invention is to minimize variation in characteristics of a vertical bipolar transistor. An insulating side wall spacer composed of a silicon nitride film 10 and a silicon oxide film 9 is formed on the side surface of an opening 101 formed...
01/20/2004
6667521Bipolar transistor with raised extrinsic base fabricated in an integrated BiCMOS circuit
A process for forming a bipolar transistor with a raised extrinsic base, an emitter, and a collector integrated with a CMOS circuit with a gate. An intermediate semiconductor structure is provided having CMOS and bipolar areas. An intrinsic base layer is ...
12/23/2003
6642553Bipolar transistor and method for producing same
The invention relates to a bipolar transistor and a method for producing same. The aim of the invention is to provide a bipolar transistor and a method for producing same, which during the use of a single-process poly-silicon technology with differential ...
11/04/2003
6635545Method for fabricating a bipolar transistor and method for fabricating an integrated circuit configuration having such a bipolar transistor
The bipolar transistor is produced such that a connection region of its base is provided with a silicide layer, so that a base resistance of the bipolar transistor is small. No silicide layer is produced between an emitter and an emitter contact and betwe...
10/21/2003
6617220Method for fabricating an epitaxial base bipolar transistor with raised extrinsic base
An epitaxial base bipolar transistor including an epitaxial single crystal layer on a single crystal single substrate; a raised emitter on a portion of the single crystal layer; a raised extrinsic base on a surface of the semiconductor substrate; an insul...
09/09/2003
6600199Deep trench-buried layer array and integrated device structures for noise isolation and latch up immunity
The preferred embodiment of the present invention provides a buried layer that improves the latch up immunity of digital devices while providing isolation structures that provide noise isolation for both the digital and analog devices. The buried layer of...
07/29/2003
6589849Method for fabricating epitaxy base bipolar transistor
A method for fabricating bipolar transistor having insitu-formed epitaxial base is disclosed herein, the method including the following steps. The first step of the key feature according to one preferred embodiment of the present invention is to use a fir...
07/08/2003
6579771Self aligned compact bipolar junction transistor layout, and method of making same
The invention relates to a process of forming a bipolar junction transistor (BJT) that includes forming a topology over a substrate. Thereafter, a spacer is formed at the topology. A base layer is formed from epitaxial silicon above the spacer and at the ...
06/17/2003
6579774Semiconductor device fabrication method
A semiconductor device fabrication method includes the steps of forming a first insulation layer and a first semiconductor layer sequentially on a semiconductor substrate having a buried diffusion region therein. A second insulation layer is formed on the...
06/17/2003
6562688Method of manufacturing a bipolar device
Disclosed are a method for manufacturing a homojunction or heterojunction bipolar device and a structure of the bipolar device manufactured by the method. The method comprises steps of forming a collector on a substrate including a buried collector to be ...
05/13/2003
6552374Method of manufacturing bipolar device and structure thereof
Disclosed are a method for forming a base layer by epitaxial growth technology of a heterojunction bipolar device and a structure of the bipolar device manufactured by the method. The method comprises steps of depositing an insulation film containing sili...
04/22/2003
6521504Semiconductor device and method of fabricating the same
There is provided a method of fabricating a semiconductor device, including the steps of (a) forming a first conductivity type base region in a second conductivity type collector region by molecular beam epitaxy (MBE), (b) forming an emitter region in the...
02/18/2003
6521974Bipolar transistor and manufacturing method thereof
A bipolar transistor according to the invention is provided with structure that an intrinsic base made of single crystal Si--Ge and a base leading-out electrode are connected via a link base made of polycrystal Si--Ge by doping at high concentration, furt...
02/18/2003
6506656Stepped collector implant and method for fabrication
The present invention provides a unique device structure and method that provides increased transistor performance in integrated bipolar circuit devices. The preferred embodiment of the present invention provides improved high speed performance with a ste...
01/14/2003
6492237Method of forming an NPN device
A method of forming an NPN semiconductor device includes the steps of forming a collector region within a substrate, forming a base region over the collector region, and forming an oxide-nitride-oxide stack over the base region. Once these three structure...
12/10/2002
6492238Bipolar transistor with raised extrinsic base fabricated in an integrated BiCMOS circuit
A process for forming a bipolar transistor with a raised extrinsic base, an emitter, and a collector integrated with a CMOS circuit with a gate. An intermediate semiconductor structure is provided having CMOS and bipolar areas. An intrinsic base layer is ...
12/10/2002
6489212Semiconductor device and method for fabricating the same
A semiconductor device includes a semiconductor substrate, an insulating film having one portion below a surface of the semiconductor substrate and the other portion on the semiconductor substrate in a second region to the same thickness as the insulating...
12/03/2002
6489211Method of manufacturing a semiconductor component
A method of manufacturing a semiconductor component includes providing a composite substrate (300) with a dielectric portion and a semiconductor portion and growing an epitaxial layer (400) over the composite substrate. The epitaxial layer has a polycryst...
12/03/2002
6482710Bipolar transistor and manufacting method thereof
A bipolar transistor according to the invention is provided with structure that an intrinsic base made of single crystal Si--Ge and a base leading-out electrode are connected via a link base made of polycrystal Si--Ge by doping at high concentration, furt...
11/19/2002
6475848Polysilicon-edge, low-power, high-frequency bipolar transistor and method of forming the transistor
A low-power high-frequency bipolar transistor is formed to have a small self-aligned base region that reduces the base-to-collector capacitance, and small self-aligned base and emitter contacts that reduce the base-to-emitter capacitance and the base resi...
11/05/2002
6472287Manufacturing method of semiconductor with a cleansing agent
The present invention aims to suppress certainly the single-crystallizing in polycrystalline silicon that is to compose an emitter electrode, as well as to prevent the interface oxide film from remaining, when a heat treatment is conducted to diffuse dopa...
10/29/2002
6465318Bipolar transistor and method for producing same
This invention relates to a bi-polar transistor and a procedure for its manufacture. The task of the invention is to propose a bi-polar transistor and a procedure for its manufacture that eliminates the disadvantages of conventional arrangements for a sim...
10/15/2002
6462397Bipolar junction device
The present invention is related to a bipolar transistor in which the in-situ doped epitaxial Si or SiGe base layer is used instead of using an ion-implanted Si base, in order to achieve higher cutoff frequency. The SiGe base having the narrower energy ba...
10/08/2002
6459140Indium-enhanced bipolar transistor
A method to improve the characteristics of bipolar silicon high-frequency transistor by adding indium into the base of the transistor is described. Instead of replacing boron in the base with indium to improve the beta-Early voltage product, at the price ...
10/01/2002
6444536Method for fabricating bipolar transistors
In accordance with the invention, a bipolar transistor is fabricated by disposing a sacrificial layer over the conventional semiconductor workpiece. The sacrificial layer is patterned into a stripe corresponding to the emitter stripe, and the base contact...
09/03/2002
6440810Method in the fabrication of a silicon bipolar transistor
In the fabrication of a silicon bipolar transistor, a method for forming base regions and for opening an emitter window is provided. A silicon substrate is provided with suitable device isolation. A first base region is formed in or on top of the substrat...
08/27/2002
6436781High speed and low parasitic capacitance semiconductor device and method for fabricating the same
A semiconductor device including a bipolar transistor formed by epitaxial growth or ion implantation is provided has an epitaxial silicon collector layer, a base region directly under an emitter defined as an intrinsic base and a peripheral region thereof...
08/20/2002
6414372Bipolar transistor having lightly doped epitaxial collector region constant in dopant impurity and process of fabrication thereof
A bipolar transistor has a lightly doped n-type single crystal silicon layer epitaxially grown in a recess formed in a heavily doped n-type impurity region after a selective growth of a thick field oxide layer, a base region, an emitter region and a colle...
07/02/2002
6384469Vertical bipolar transistor, in particular with an SiGe heterojunction base, and fabrication process
The semiconductor region of an intrinsic collector is surrounded with a lateral insulating region. A semi-conducting layer comprising a SiGe heterojunction is partially located between the transmitter and the intrinsic collector and extends on either side...
05/07/2002
6380017Polysilicon-edge, base-emitter super self-aligned, low-power, high-frequency bipolar transistor and method of forming the transistor
A low-power high-frequency bipolar transistor is formed to have a small self-aligned intrinsic base region, and small self-aligned extrinsic base and emitter regions that contact the intrinsic base region. The small regions reduce the base resistance, the...
04/30/2002
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