Class 257/E21.238 - Making grooves, e.g., cutting (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E21.237. This
No. of patents: 112
Last issue date: 07/29/2008

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Number	Title	Issue Date
7405144	Method for manufacturing probe card A method for manufacturing a probe card is provided. A first inactive layer, a first patterned photoresist layer and a first metal layer are sequentially formed on a substrate. The first metal layer has first through holes exposing a portion of the first patterned p...	07/29/2008
7391087	MOS transistor structure and method of fabrication An MOS device comprising a gate dielectric formed on a first conductivity type region. A gate electrode formed on the gate dielectric. A pair of sidewall spacers are formed along laterally opposite sidewalls of the gate electrode. A pair of deposited silicon or sili...	06/24/2008
7387971	Fabricating method for flat panel display device A fabricating method for a flat panel display device having a thin film pattern over a substrate is disclosed. The fabricating method includes depositing a hydrophilic resin over a substrate and patterning the hydrophilic resin to form hydrophilic resin patterns ove...	06/17/2008
7358156	Compound semiconductor device and method of manufacturing the same A method of manufacturing a compound semiconductor device comprises forming a scribed groove extending from an edge of a major surface of a laminated body to an internal region on the first major surface. The laminated body has the first major surface and a second m...	04/15/2008
7316965	Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level A MEMS device (100) is provided that includes a handle layer (108) having a sidewall (138), a cap (132) overlying said handle layer (108), said cap (132) having a sidewall (138), and a conductive material (136)...	01/08/2008
7250354	Semiconductor device and method for fabricating the same A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on ...	07/31/2007
7250371	Reduction of feature critical dimensions A feature in a layer is provided. A photoresist layer is formed over the layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls, where the photoresist features have a first critical dimension. A conformal layer is deposited...	07/31/2007
7211500	Pre-process before cutting a wafer and method of cutting a wafer A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scrib...	05/01/2007
7198982	Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS ...	04/03/2007
7091624	Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same A semiconductor chip is formed by dividing a semiconductor wafer by use of the laser dicing technique. The semiconductor chip has a laser dicing region on the side surface thereof. A dummy wiring layer is formed along the laser dicing region on the surface layer of ...	08/15/2006
6699552	Silicon wafer break pattern, silicon substrate In order to provide a silicon wafer break pattern that stabilizes the location and shape of the breaks at weak spots of the break pattern and that reduces waste, the through-holes of the break pattern is disposed along a scribe line, a first group of the ...	03/02/2004
6692633	Sacrificial anode for corrosion protection of semiconductor metallization during sawing Resistance to corrosion of aluminum metallization on semiconductor devices during wafer sawing process is provided by a sacrificial anode containing magnesium in contact with the integrated circuit wafer and the dicing saw. A relatively thin film or disc ...	02/17/2004
6676491	Semiconductor wafer dividing method A semiconductor wafer dividing method for dividing a semiconductor wafer, in which a plurality of rectangular regions are demarcated by streets arranged in a lattice pattern on the face of the semiconductor wafer, and a semiconductor circuit is disposed i...	01/13/2004
6656819	Process for producing semiconductor device A process for producing a semiconductor device, including the steps of forming grooves of a cut depth smaller than the thickness of a wafer; sticking a surface protective sheet onto the wafer surface; grinding the back of the wafer to divide the wafer int...	12/02/2003
6653210	Method and apparatus for cutting a non-metallic substrate using a laser beam A method and an apparatus for cutting a non-metallic substrate by a laser are disclosed. In the disclosed method and apparatus, a first laser beam for breaking molecular bonds of the non-metallic substrate material is scanned on a cutting path formed on t...	11/25/2003
6649445	Wafer coating and singulation method A method for providing an underfill material on an integrated circuit chip at the wafer level. The wafer (10) typically contains one or more integrated circuit chips (12), and each integrated circuit chip typically has a plurality of solder bumps (34) on ...	11/18/2003
6621149	Semiconductor chip production method and semiconductor wafer A semiconductor chip production method in which, when a semiconductor chip is formed by severing from a semiconductor wafer, a short side of a semiconductor device is arranged and disposed along a direction which is parallel to a crystal orientation direc...	09/16/2003
6412971	Light source including an array of light emitting semiconductor devices and control method A light source includes a substrate; an array of un-packaged light emitting semiconductor devices (LESDs), each of the LESDs having at least one surface for emitting light and a substrate surface being attached to the substrate; and a plurality of electri...	07/02/2002
6399464	Packaging die preparation The present invention relates to a process for preparing a wafer for chip packaging that minimizes stress and torque on wafer components during back grinding. The wafer has fabricated thereon a plurality of dies in a die side thereof opposite a back side ...	06/04/2002
6303472	Process for cutting trenches in a single crystal substrate A process for cutting a trench in a silicon monocrystal in areas defined by a mask comprises forming a mask that defines an etched area on the surface of a monocrystalline silicon wafer which is eventually covered by a thin layer of oxide. Next, ions are ...	10/16/2001
6294439	Method of dividing a wafer and method of manufacturing a semiconductor device Grooves are formed in a surface of a wafer, on which semiconductor elements are formed, along dicing lines or chip parting lines on the wafer. The grooves are deeper than the thickness of a finished chip, and each of them has a curved bottom surface. A ho...	09/25/2001
6286499	Method of cutting and separating a bent board into individual small divisions Disclosed is an improved method of cutting and separating a bent board into individual small divisions. Prior to the cutting and separating of the board into the individual chips the board is cut and separated into two or more pieces each large enough to ...	09/11/2001
6214639	Method of producing a semiconductor device A method of producing a semiconductor device including a step of forming separation grooves in scribing regions defined at boundary portions between a plurality of semiconductor-device forming portions formed on a top surface of a semiconductor substrate;...	04/10/2001
6162703	Packaging die preparation The present invention relates to a process for preparing a wafer for chip packaging that minimizes stress and torque on wafer components during back grinding. The wafer has fabricated thereon a plurality of dies in a die side thereof opposite a back side ...	12/19/2000
6140603	Micro-cleavage method for specimen preparation A micro-cleavage method for preparing a semiconductor specimen for examination by an optical or electron microscopic is disclosed. The method can be carried out by hand and thus no expensive equipment such as a polishing machine is necessary. In the metho...	10/31/2000
6136668	Method of dicing semiconductor wafer A semiconductor wafer is prepared which includes a semiconductor layer having on its surface a plurality of functional devices, and a separation line region surrounding and separating the plurality of functional devices from one another. A metal layer is ...	10/24/2000
6126518	Chemical mechanical polishing process for layers of semiconductor or isolating materials Chemical mechanical polishing process for a layer of semiconductor material such as polycrystalline silicon, epitaxial single-crystal silicon, amorphous silicon or an isolating material such as phosphosilicate glass or borophosphosilicate glass used in th...	10/03/2000
6117347	Method of separating wafers into individual die A method of separating a wafer into individual die is disclosed. The wafer includes a substrate with organic thin-film multiple layers. A portion of the organic multiple layers is etched along a scribe line with excimer laser to form a groove to expose a ...	09/12/2000
6107163	Method of manufacturing a semiconductor chip In a method of manufacturing a semiconductor chip, a wire is traveled in one way to cut a wafer into a plurality of chips while a wire train where wires are arranged by pitches of scribe lines is brought into contact with the scribe lines of the wafer lin...	08/22/2000
6107161	Semiconductor chip and a method for manufacturing thereof It is an object of the present invention to provide a semiconductor chip which is hard to be damaged when the semiconductor chip is cut out from a sheet of wafer for semiconductor and a method for manufacturing thereof. Cutting grooves 26 having a wider w...	08/22/2000
6063695	Simplified process for the fabrication of deep clear laser marks using a photoresist mask A process for the formation of deep clear laser marks on silicon wafers is described. Tall ridges of material which is erupted from the wafer surface during the deep laser penetration form adjacent to the marks. These ridges are of the order of 3 to 15 mi...	05/16/2000
5972154	Methods of dicing flat workpieces The present invention pertains to methods for dicing wafers which are capable of easily removing chips of an adhesive of a dicing tape adhering on the wafer during dicing by cleaning using cleaning water. One method of dicing a wafer includes sticking an ...	10/26/1999
5888884	Electronic device pad relocation, precision placement, and packaging in arrays Top die pads are electrically relocated by forming holes through a semiconductor wafer between device active regions. An electrically insulating layer is formed over all exposed surfaces of the wafer, including within the holes, and openings are made in t...	03/30/1999
5888882	Process for separating electronic devices A process for separating electronic devices connected with one another in a body, the process including thinning the side of the body remote from the electronic devices, separating the electronic devices, and testing electrical parameters of the electroni...	03/30/1999
5888883	Method of dividing a wafer and method of manufacturing a semiconductor device Grooves are formed in a surface of a wafer, on which surface semiconductor elements are formed, along dicing lines. The grooves are deeper than a thickness of a finished chip. A holding member is attached on the surface of the wafer on which the semicondu...	03/30/1999
5882986	Semiconductor chips having a mesa structure provided by sawing Starting with a semiconductor wafer of known type including an internal, planar p-n junction parallel to major surfaces of the wafer, one of the wafer surfaces is covered with a masking layer of silicon nitride. A plurality of intersecting grooves are the...	03/16/1999
5840614	Method of producing a semiconductor wafer using ultraviolet sensitive tape A process for producing semiconductor devices using ultraviolet sensitive tape including the steps of forming a plurality of chips on a first surface of a semiconductor wafer, adhering an ultraviolet sensitive tape to the first surface of the semiconducto...	11/24/1998
5829658	Method and device for carrying out the cleavage in ultra-high vacuum environment of portions of a processed semiconductor wafer A method and a device are provided for obtaining semiconductor bars for laser devices starting from portions of a processed wafer and carrying out the cleavage in ultra-high-vacuum. The cleavage mechanical stresses are impulsive forces and are all applied...	11/03/1998
5786266	Multi cut wafer saw process A method of cutting a plate-like wafer, particularly a semiconductor wafer, while removing a deposited material from along a scribe line. The deposited material having a width generally greater than the width of the saw blade. The method includes making o...	07/28/1998
5780320	Method of manufacturing a semiconductor laser including two sets of dicing grooves A linear active layer, a current block layer and a clad layer are formed on the first major surface of a wafer, while a first electrode is formed on the second major surface of the wafer. A linear first opening is formed in the first electrode. The wafer ...	07/14/1998

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Class 257/E21.238 - Making grooves, e.g., cutting (EPO)