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| Number | Title | Issue Date |
| 7432137 | Method of manufacturing thin film transistor A method of manufacturing a thin film transistor includes forming a gate electrode on a substrate; forming a gate insulating film on the gate electrode; forming a semiconductor layer on the gate insulating film; forming a bank including a first bank portion and a se... | 10/07/2008 |
| 7399708 | Method of treating a composite spin-on glass/anti-reflective material prior to cleaning Methods are provided for cleaning a microelectronic device, and one method includes providing a substrate having a patterned SOG/anti-reflective material; performing a process to cure the patterned SOG/anti-reflective material; and performing a cleaning process to r... | 07/15/2008 |
| 7368381 | Methods of forming materials The invention includes methods of forming films over substrates. A substrate is provided within a reaction chamber, and a mixture is also provided within the chamber. The mixture includes a precursor of a desired material within a supercritical fluid. The precursor ... | 05/06/2008 |
| 7338909 | Micro-etching method to replicate alignment marks for semiconductor wafer photolithography A method and apparatus for locally etching a substrate area the method including providing a substrate comprising a process surface; depositing a material layer over the process surface; and, applying a wet etchant to cover a targeted etching portion of the process ... | 03/04/2008 |
| 7320937 | Method of reliably electroless-plating integrated circuit die The present invention is a reliable method of electroless-plating integrated circuit die that achieves high yield. Die are attached to a holder using a polyimide adhesive to eliminate voltage differences on bond pads which would otherwise interfere with the plating.... | 01/22/2008 |
| 7273772 | Method for manufacturing thin film transistor array panel The present invention relates to a method of manufacturing a thin film transistor array panel and apparatus and more particularly to an apparatus containing an in-situ fluorine generation chamber. ... | 09/25/2007 |
| 7262141 | Methods for cleaning a semiconductor substrate having a recess channel region A method for cleaning a semiconductor substrate forming device isolation layers in a predetermined region of a semiconductor substrate to define active regions; etching predetermined areas of the active regions to form a recess channel region and such that sidewalls... | 08/28/2007 |
| 7208428 | Method and apparatus for treating article to be treated A thermal treatment apparatus 1 includes a reaction tube 2 for containing wafers 10 contaminated with organic substances having a heater 12 capable of heating the reaction tube; a first gas supply pipe 13 for carrying oxygen gas in... | 04/24/2007 |
| 7157415 | Post etch cleaning composition for dual damascene system A new cleaning chemistry based on a choline compound, such as choline hydroxide, is provided in order to address the problem of dual damascene fabrication. An etch stop inorganic layer at the bottom of a dual damascene structure protects the underlying interconnect ... | 01/02/2007 |
| 7125799 | Method and device for processing substrate, and apparatus for manufacturing semiconductor device A substrate processing method includes the step of removing carbon from a silicon substrate surface and planarizing the silicon substrate surface from which carbon has been removed. ... | 10/24/2006 |
| 6677247 | Method of increasing the etch selectivity of a contact sidewall to a preclean etchant A method of forming a contact in an integrated circuit between a first metalization layer and a silicon substrate. In one embodiment the method comprises forming a premetal dielectric layer over the silicon substrate, etching a contact hole through the pr... | 01/13/2004 |
| 6566169 | Method and apparatus for local vectorial particle cleaning Particles are removed from the surface of a substrate. Respective position coordinates of the particles on the surface are determined. A beam of electromagnetic energy is directed at the coordinates of each of the particles in turn, such that absorption o... | 05/20/2003 |
| 6562699 | Process for manufacturing semiconductor device By removing halogen atoms existing on the surface of the silicon layer and in the subsurface thereof so that the concentration of halogen atoms becomes 100 ppm or lower and forming an electrode on the resulting silicon layer, the electrode which has a low... | 05/13/2003 |
| 6432212 | Substrate washing method The substrate washing method of the present invention comprises the steps of holding the substrate substantially horizontally, supplying a cleaning liquid to a surface of the substrate through a film scrub member permeable to liquid and allowing the film ... | 08/13/2002 |
| 6258637 | Method for thin film deposition on single-crystal semiconductor substrates A method of preparing a surface for and forming a thin film on a single-crystal silicon substrate is disclosed. One embodiment of his method comprises forming an oxidized silicon layer (which may be a native oxide) on at least one region of the substrate,... | 07/10/2001 |
| 6177356 | Semiconductor cleaning apparatus A wafer transfer device or boat and semiconductor cleaning apparatus including a wafer transfer device and a heatable reaction core is provided. The wafer transfer device has a first unit with a plurality of first slots for receiving a first group of semi... | 01/23/2001 |
| 6175983 | Substrate washing apparatus and method The substrate washing apparatus of the present invention comprises a film scrub member permeable to liquid, which is moved relatively to a substrate held substantially horizontally while being in contact with the substrate, a supporting portion for supply... | 01/23/2001 |
| 6140659 | Method and apparatus for removing residual dirt adhered on dies An apparatus for removing a residual dirt including at least any one of organic and inorganic substances from inner surfaces of dies is used between the dies, wherein the apparatus has an irradiation unit for irradiating a ray mainly includes an ultraviol... | 10/31/2000 |
| 6057557 | Semiconductor substrate semiconductor device and liquid crystal display device A method of forming an Si film by a bias sputtering process comprises the steps of generating plasma between a target electrode holding a target material provided in a vacuum container and a substrate electrode holding a deposited film forming substrate, ... | 05/02/2000 |
| 6037271 | Low haze wafer treatment process A process for removing a plurality of layers of different materials from a substrate having a silicon material base, at least one of said layers being a silicon oxide material and at least one other of said layers comprising a metal and the metal layer be... | 03/14/2000 |
| 6036581 | Substrate cleaning method and apparatus A substrate cleaning method includes the steps of supplying a cleaning fluid containing fine argon particles or fine carbon dioxide gas particles to a nozzle unit which is accommodated in a vacuum container and in which spray nozzle holes are arranged to ... | 03/14/2000 |
| 5967156 | Processing a surface In one aspect, foreign material on the surface of a substrate is processed to form a reaction product by: providing a directed flow of a fluid, comprising a reactant, to the vicinity of the foreign material to be processed; and delivering an aerosol of at... | 10/19/1999 |
| 5961732 | Treating substrates by producing and controlling a cryogenic aerosol A substrate may be treated by impinging the substrate with a cryogenic aerosol spray wherein the cryogenic aerosol spray is formed by expanding a pressurized liquid or liquid/gaseous stream of one or more cryogens through a nozzle at a given distance from... | 10/05/1999 |
| 5956596 | Method of forming and cleaning a laser marking region at a round zone of a semiconductor wafer The invention relates to a wafer for use as a substrate for a semiconductor device, the wafer comprising a round zone formed along a circumference thereof; a flat zone wherein the circumference thereof is partially cut in a straight line; and a laser mark... | 09/21/1999 |
| 5902678 | Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal A pressure-sensitive adhesive or pressure-sensitive adhesive tape for removing a foreign matter present on the surface of an article from the article, the pressure-sensitive adhesive having the property of curing with an actinic energy source to have a th... | 05/11/1999 |
| 5804494 | Method of fabricating bonded wafer A method of fabricating a bonded wafer which is capable of reducing the concentrations of impurities, and more particularly the boron concentration, at the interface of bonding in the bonded wafer, wherein first and second wafers to be bonded are finish-c... | 09/08/1998 |
| 5795399 | Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product A plasma etching apparatus has a first load-lock chamber, a process chamber connected to the first load-lock chamber through a gate valve, and a second load-lock chamber connected to the process chamber through another gate valve. A first processing secti... | 08/18/1998 |
| 5796111 | Apparatus for cleaning contaminated surfaces using energetic cluster beams A method and apparatus for cleaning contaminated surfaces, especially semiconductor wafers, using energetic cluster beams is disclosed. In this system, charged beams consisting of microdroplets or clusters having a prescribed composition, velocity, energy... | 08/18/1998 |
| 5776296 | Apparatus for the treatment of semiconductor wafers in a fluid Provided is a process for removing organic materials from semiconductor wafers. The process involves the use of subambient deionized water with ozone absorbed into the water. The ozonated water flows over the wafers and the ozone oxidizes the organic mate... | 07/07/1998 |
| 5766369 | Method to reduce particulates in device manufacture An improved process for manufacturing semiconductor devices (10). The device, which could be a semiconductor wafer, an individual chip, or a device that has integrated within it semiconductor devices, such as a compact disk drive, is placed or held upside... | 06/16/1998 |
| 5753563 | Method of removing particles by adhesive The removal of particulate contaminants, such as dust particles, from the surface of a semiconductor wafer is achieved by pressing a soft adhesive layer against the wafer surface, leaving it in place for a short time and then removing it. The adhesive is ... | 05/19/1998 |
| 5747387 | Removal method of organic matter and system for the same According to the present invention, the surface of the sample is cleaned with water immediately after ashing of the resist the quality of which has been changed through ion implantation by ozone-containing gas, or ozone-containing gas and ultraviolet ray,... | 05/05/1998 |
| 5716873 | Method for cleaning waste matter from the backside of a semiconductor wafer substrate A method for manufacturing a semiconductor device on a wafer that has a substrate with a front side and a backside, and an accumulation of waste matter on the backside of the substrate. In a method of the invention, a cover layer is deposited over the fro... | 02/10/1998 |
| 5512106 | Surface cleaning with argon Argon gas and nitrogen gas are mixed together and cooled by a cooler to a liquefying temperature of argon gas specific to its pressure, to form argon fine droplets in the mixed gas. The gas is then jetted out of nozzles and blown into a vacuum chamber to ... | 04/30/1996 |
| 5496506 | Process for removing fine particles A process for detecting fine particles includes the steps of forming a sublimable thin film on an essential surface of a wafer on which fine particles are present, irradiating laser beam at the surface of the wafer, receiving a reflected beam from the sur... | 03/05/1996 |
| 5361449 | Cleaning apparatus for cleaning reverse surface of semiconductor wafer A cleaning apparatus for cleaning the reverse surface of a semiconductor wafer has a pair of holders for holding the wafer therebetween such that the wafer is kept substantially horizontal with the major surface directed upward. The holders can be moved c... | 11/08/1994 |
| 5320706 | Removing slurry residue from semiconductor wafer planarization Polish slurry particles remaining on a semiconductor wafer after mechanical planarization are removed from the semiconductor wafer by polishing the wafer with a polishing pad while a mixture of deionized water and a surfactant is applied to the wafer and ... | 06/14/1994 |
| 5273589 | Method for low pressure rinsing and drying in a process chamber An embodiment of the present invention is a system for rinsing and drying items comprising a process chamber for receiving the items; a rinse condenser; a first heater; a vaporizer for vaporizing water and including a second heater; a vacuum system for re... | 12/28/1993 |
| 5244535 | Method of manufacturing a semiconductor device including plasma treatment of contact holes Method of making a semiconductor device, wherein an etchant gas is employed to etch a contact hole through an insulation layer overlying a conduction layer as disposed on a substrate of semiconductor material such that a surface portion of the conduction ... | 09/14/1993 |
| 5238871 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device including a MOS-type field effect transistor includes cleansing a surface of a substrate; forming, next to the cleansing step, a gate oxide film on the cleansed surface of the substrate; wherein the cleansi... | 08/24/1993 |
