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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 7432200 | Filling narrow and high aspect ratio openings using electroless deposition Methods of fabricating an interconnect utilizing an electroless deposition technique, which fundamentally consists of providing a dielectric material layer having an opening extending into the dielectric material from a first surface thereof, and electrolessly depos... | 10/07/2008 |
| 7429530 | Method of forming a pattern, method of forming wiring, semiconductor device, TFT device, electro-optic device, and electronic instrument A method of forming a pattern of a functional layer on a surface of a substrate, where a pattern region, to which the pattern is provided, is edged with a boundary layer, and has a first region and a second region communicated with the first region and having a narr... | 09/30/2008 |
| 7417321 | Via structure and process for forming the same Via structure and process flow for interconnection in a semiconductor product. A bottom metal layer is provided to represent a connection layer in the semiconductor product. An isolation layer on the bottom metal layer comprises a via hole exposing a portion of the ... | 08/26/2008 |
| 7381633 | Method of making a patterned metal oxide film A method of making a patterned metal oxide film includes jetting a sol-gel solution on a substrate. The sol-gel solution is dried to form a gel layer on the substrate. Portions of the gel layer are irradiated to pattern the gel layer and to form exposed portions. Ir... | 06/03/2008 |
| 7358174 | Methods of forming solder bumps on exposed metal pads A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second exposed portion of the metal pad may be free of the conductive barrie... | 04/15/2008 |
| 7332432 | Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same As a semiconductor device, specifically, a pixel portion included in a semiconductor device is made to have higher precision and higher aperture ratio, it is required to form a smaller wiring in width. In the case of forming a wiring by using an ink-jet method, a do... | 02/19/2008 |
| 7320937 | Method of reliably electroless-plating integrated circuit die The present invention is a reliable method of electroless-plating integrated circuit die that achieves high yield. Die are attached to a holder using a polyimide adhesive to eliminate voltage differences on bond pads which would otherwise interfere with the plating.... | 01/22/2008 |
| 7306962 | Electroformed metallization A method is provided for electroforming metal integrated circuit structures. The method comprises: forming an opening such as a via or line through an interlevel insulator, exposing a substrate surface; forming a base layer overlying the interlevel insulator and sub... | 12/11/2007 |
| 7305761 | Method for manufacturing wiring substrate A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the gr... | 12/11/2007 |
| 7285494 | Multiple stage electroless deposition of a metal layer A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactiv... | 10/23/2007 |
| 7273813 | Wafer cleaning solution for cobalt electroless application A method and cleaning solution that removes contaminants from a dielectric material and polished surfaces of copper interconnect structures prior to an electroless deposition of a capping layer without substantially adversely affecting the interconnect formed theref... | 09/25/2007 |
| 7262504 | Multiple stage electroless deposition of a metal layer A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactiv... | 08/28/2007 |
| 7241690 | Method for conditioning a microelectronics device deposition chamber The present invention provides, in one aspect, a method of conditioning a deposition chamber 100. An undercoat is placed on the walls of a deposition chamber 100 and a pre-deposition coat is deposited over the undercoat with a plasma gas mixture conducted at a high ... | 07/10/2007 |
| 7232747 | Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation A method of bumping a wafer for facilitating bonding of bond wires to elevate the bond location above the passivation layer. The wafer is bumped by disposing the wafer in at least one electroless bath having a nickel-containing solution therein, wherein bumps having... | 06/19/2007 |
| 7220682 | Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate A method for fabricating a pattern on a substrate, includes the steps of forming banks according to formation areas of the pattern on the substrate, disposing a first function liquid between the banks, disposing a second function liquid on the first function liquid,... | 05/22/2007 |
| 7205664 | Semiconductor device and method for manufacturing the same A semiconductor device including a multilevel wiring with a small interwiring capacitance is provided by comprising a wiring, a conductive film formed on an upper surface of the wiring to prevent diffusion of a wiring material, and an insulating film which is consti... | 04/17/2007 |
| 7179716 | Method of forming a metal-containing layer over selected regions of a semiconductor substrate The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si... | 02/20/2007 |
| 7169705 | Plating method and plating apparatus A plating method is capable of depositing a plated film having excellent in-plane uniformity with respect to a thin seed layer and excellent embeddability with respect to fine damascene structures. The plating method includes: positioning an electric resistor betwee... | 01/30/2007 |
| 7141492 | Method for forming thin-film, apparatus for forming thin-film, method for manufacturing semiconductor device, electro-optical unit, and electronic apparatus The invention provides a method of forming a high-performance thin-film at low cost using a liquid material in safety, an apparatus to form a thin-film, a method of manufacturing a semiconductor device, an electro-optical unit, and an electronic apparatus. An... | 11/28/2006 |
| 6699373 | Apparatus for processing the surface of a microelectronic workpiece A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A c... | 03/02/2004 |
| 6696758 | Interconnect structures and a method of electroless introduction of interconnect structures An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a diffe... | 02/24/2004 |
| 6692588 | Method and apparatus for simultaneously cleaning and annealing a workpiece The present invention is directed to a method and apparatus for simultaneously cleaning and annealing a plated semiconductor workpiece. A chamber for simultaneously cleaning and annealing a semiconductor workpiece is provided herein. The method according ... | 02/17/2004 |
| 6693366 | Electroless deposition of doped noble metals and noble metal alloys A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal ... | 02/17/2004 |
| 6682989 | Plating a conductive material on a dielectric material A surface may be selectively coated with a polymer using an induced surface grafting or polymerization reaction. The reaction proceeds in those regions that are polymerizable and not in other regions. Thus, a semiconductor structure having organic regions... | 01/27/2004 |
| 6680540 | Semiconductor device having cobalt alloy film with boron In order to prevent a rise in resistance due to oxidation of copper wiring and diffusion of copper, a semiconductor device is provided which contains a wire protective film 1 covering the top of the copper wiring 2 formed in the insulation film and a barr... | 01/20/2004 |
| 6677233 | Material deposition from a liquefied gas solution Introduction of a liquefied gas solution for deposition of a material on a semiconductor substrate. The substrate can have a trench etched thereinto with the solution including ions of the material to be deposited in the trench. The substrate can have a b... | 01/13/2004 |
| 6677238 | System and methods for fabrication of a thin film pattern The present invention provides a method for fabricating a thin film pattern including forming a pattern made of an organic molecule film on a substrate. The method further includes supplying a solution for forming a thin film onto the organic molecule fil... | 01/13/2004 |
| 6670271 | Growing a dual damascene structure using a copper seed layer and a damascene resist structure The present invention involves a method for fabricating interconnecting lines and vias. According to the invention, copper is grown from a seed layer to substantially fill openings in a two layer structure wherein the two layers are independently either d... | 12/30/2003 |
| 6667551 | Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the... | 12/23/2003 |
| 6663915 | Method for copper plating deposition The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate (2) and an activator (1) are immersed in a copper plating bath in order to contact each other for a predetermined period.... | 12/16/2003 |
| 6664027 | Methods and apparatus for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging Electrically (and, possibly, mechanically) active patterns are applied using a colloidal suspension of nanoparticles that exhibit a desired electrical characteristic. The nanoparticles are surrounded by an insulative shells that may be removed by therefro... | 12/16/2003 |
| 6664122 | Electroless copper deposition method for preparing copper seed layers Disclosed is a procedure for deposition of a thin and relatively continuous electroless copper film on the substrate of sub-micron integrated circuit features. The electroless copper film is deposited onto a previously deposited PVD copper film, which may... | 12/16/2003 |
| 6664175 | Method of forming ruthenium interconnect for an integrated circuit A multi-layered metal bond pad for a semiconductor die having a conductive metal layer and an overlying ruthenium electrode layer. The ruthenium electrode layer protects the conductive metal from oxidation due to ambient environmental conditions. An inter... | 12/16/2003 |
| 6660625 | Method of electroless plating copper on nitride barrier A method with three embodiments of manufacturing metal lines and solder bumps using electroless deposition techniques. The first embodiment uses a PdSix seed layer 50 for electroless deposition. The PdSix layer 50 does not require activation. A metal line... | 12/09/2003 |
| 6660636 | Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating A novel method for the activation of semiconductor substrates for highly selective electroless copper plating in multilayer interconnect metallization lines and vias/contact holes has been developed. A copper-seeded polysilicon layer is provided over the ... | 12/09/2003 |
| 6660545 | Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus A device and manufacturing method for a semiconductor device includes the steps of forming a penetration hole 50 in a semiconductor chip 10 having an electrode 14, and forming a conductive layer 70 in the region including the inside of the penetration hol... | 12/09/2003 |
| 6660154 | Seed layer Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.... | 12/09/2003 |
| 6657306 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 ... | 12/02/2003 |
| 6656829 | Semiconductor integrated circuit device and manufacturing method of that A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode... | 12/02/2003 |
| 6649327 | Method of patterning electrically conductive polymers A method of patterning electrically conductive polymers is: forming a surface of a conducting polymer on a substrate, applying a mask to this surface, applying irradiation to form regions of exposed conducting polymer and regions of unexposed conducting p... | 11/18/2003 |
