Class 257/E21.077 - Heat treating (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E21.076. This subclass
No. of patents: 4
Last issue date: 09/23/2008

Number	Title	Issue Date
7427571	Reactor design for reduced particulate generation Particle formation in semiconductor fabrication process chambers is reduced by preventing condensation on the door plates that seal off the process chambers. Particles can be formed in a process chamber when reactant gases condense on the relatively cool surfaces of...	09/23/2008
7316969	Method and apparatus for thermally treating substrates The object of the disclosure is to measure temperature using pyrometers, in a simple and economic way, enabling precise temperature measurement, even for low temperatures. The disclosure presents an apparatus and method for thermally treating substrates, wherein the...	01/08/2008
7316972	Contact hole formation method A contact hole formation method includes a process of depositing a BPSG film 4 on a semiconductor substrate 1 on which transistors are formed, a process of planarizing the BPSG film 4, a process of depositing a dielectric film 5 on the BP...	01/08/2008
7276457	Selective heating using flash anneal A copper film is treated by applying light at short wavelengths, e.g., at less than 0.6 μm, to heat the copper film and generate a large temperature gradient from the surface of the copper to the interface between the copper and underlying silicon. As a result, gra...	10/02/2007

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