Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 8445921 | Thin film light emitting diode Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a thin film layer over the LED chip that changes the color of the emitted light. For example, a blue LED chip can be used to produce white light. The thin film layer benefi... | 05/21/2013 |
| 8445922 | Light emitting package The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically conn... | 05/21/2013 |
| 8441019 | Light emitting device, light emitting device package and lighting system Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a substrate; a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semic... | 05/14/2013 |
| 8426873 | LED package structure The present invention discloses an LED package structure which has a housing, an LED chip and a transparent encapsulant. The housing has a recess and a plurality of protrusions. The LED chip is mounted in the recess of the housing, and covered in the recess by the t... | 04/23/2013 |
| 8378360 | Light emitting package The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically conn... | 02/19/2013 |
| 8378359 | Light emitting device and method of fabricating the same Provided are a light emitting device and a method of fabricating the same. The light emitting device comprises a first conductive type substrate, first to fourth metal electrodes, and a light emitting diode. The first conductive type substrate comprises P-N junction... | 02/19/2013 |
| 8373180 | Light emitting diode package A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light ... | 02/12/2013 |
| 8362495 | Rod-shaped semiconductor device A rod-shaped semiconductor device having a light-receiving or light-emitting function is equipped with a rod-shaped substrate made of p-type or n-type semiconductor crystal, a separate conductive layer which is formed on a part of the surface of the substrate exclud... | 01/29/2013 |
| 8324638 | Light emitting device package A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second ca... | 12/04/2012 |
| 8324637 | High efficiency LEDs with tunnel junctions An LED made from a wide band gap semiconductor material and having a low resistance p-type confinement layer with a tunnel junction in a wide band gap semiconductor device is disclosed. A dissimilar material is placed at the tunnel junction where the material genera... | 12/04/2012 |
| 8309974 | Light emitting diode package To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on ... | 11/13/2012 |
| 8309973 | Silicon-based sub-mount for an opto-electronic device A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 μm-700 μm. The optoelectronic device is mounted on a die attach pad on the front-side sur... | 11/13/2012 |
| 8299474 | Light emitting device package and light unit having the same Disclosed is an LED package. The LED package includes a package body, a semiconductor light emitting device on the package body and at least one of frames on the package body. At least one of the frames includes a bottom frame on the package body, and at least two s... | 10/30/2012 |
| 8299475 | Interlevel conductive light shield A CMOS image sensor pixel includes a conductive light shield, which is located between a first dielectric layer and a second dielectric layer. At least one via extends from a top surface of the second dielectric layer to a bottom surface of the first dielectric laye... | 10/30/2012 |
| 8288778 | Semiconductor device having semiconductor elements formed inside a resin film substrate A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. A semiconductor device comprising a resin film that has a through hole that pen... | 10/16/2012 |
| 8288777 | LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second co... | 10/16/2012 |
| 8283677 | Nitride semiconductor light-emitting device A nitride semiconductor light-emitting device includes a substrate (101) made of silicon, a mask film (102) made of silicon oxide, formed on a principal surface of the substrate (101), and having at least one opening (102a), a seed... | 10/09/2012 |
| 8269226 | Light emitting device, and light emitting device package A light emitting device including a light emitting structure including a second conductive type semiconductor layer, an active layer, and a first conductive type semiconductor layer, and a first protective layer disposed on a side of the light emitting structure, wh... | 09/18/2012 |
| 8258521 | Radiation-emitting semiconductor body with carrier substrate and method for the production thereof A radiation-emitting semiconductor body with a carrier substrate. A structured connection is produced between a semiconductor layer sequence (2) and a carrier substrate wafer (1). The semiconductor layer sequence is subdivided into a plurality of semic... | 09/04/2012 |
| 8253148 | Light emitting diode and method for manufacturing the same An exemplary light emitting diode includes a conductive base, an LED die, a transparent conductive layer and at least one pad. The LED die includes a p-type GaN layer connected to the base, an active layer on the p-type GaN layer, and an n-type GaN layer on the acti... | 08/28/2012 |
| 8227814 | Semiconductor device and manufacturing method thereof, and camera module including the same A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A r... | 07/24/2012 |
| 8212263 | Backlight including semiconductior light emitting devices A light source such as a semiconductor light emitting diode is positioned in a first opening in a transparent member, which may function as a waveguide in a display. The transparent member surrounds the light source. No light source is positioned in a second opening... | 07/03/2012 |
| 8212264 | FK module and method for the production thereof A module and method of its production in which areal electronic components are formed. The module includes (a) a cover electrode covering the electronic components; (b) a flexibly deformable substrate; (c) a base electrode formed on the substrate; and (d) an optical... | 07/03/2012 |
| 8198641 | Semiconductor device with backside tamper protection A tamper-resistant semiconductor device (5;20;30;40;50;60) which includes a plurality of electronic circuits formed on a circuitry side (6) of a substrate (7) having an opposite side which is a backside (8) of the semiconductor device, an... | 06/12/2012 |
| 8198640 | Semiconductor light emitting device and method of fabricating the same Provided is a semiconductor light emitting device and a method of fabricating the same. The semiconductor light emitting device comprises: a first conductive semiconductor layer; an active layer on the first conductive semiconductor layer; a second conductive semico... | 06/12/2012 |
| 8198639 | Method of manufacturing light emitting device with a pair of ridge protection electrodes A method of manufacturing a semiconductor light emitting device employs a substrate formed by successively stacking an n-type semiconductor layered portion including an AlGaN layer, a light emitting layer containing In and a p-type semiconductor layered portion on a... | 06/12/2012 |
| 8193541 | Light emitting diode structure having a conductive thin film for connecting a light emitting stack to an electrode and LED packaging structure using the same A light emitting diode (LED) structure and a LED packaging structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface... | 06/05/2012 |
| 8193540 | SMD diode holding structure and package thereof An SMD diode holding structure includes a plastic housing and a plurality of metal holders. Two ends of the plastic housing from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base po... | 06/05/2012 |
| 8188488 | Power surface mount light emitting die package A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a moun... | 05/29/2012 |
| 8158988 | Interlevel conductive light shield A CMOS image sensor pixel includes a conductive light shield, which is located between a first dielectric layer and a second dielectric layer. At least one via extends from a top surface of the second dielectric layer to a bottom surface of the first dielectric laye... | 04/17/2012 |
| 8154030 | Integrated diode in a silicon chip scale package An optical component with integrated back monitor photodiode. The optical component includes a substrate doped with a first type dopant, such as an n-type dopant. The substrate has a trench with sloped walls. An optical source is disposed in the trench. An implant o... | 04/10/2012 |
| 8148737 | Light emitting device, light emitting device package and lighting system Disclosed are a light emitting device, a light emitting device package and a lighting system. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, an active layer over the first conductive ... | 04/03/2012 |
| 8148736 | Flip chip type light-emitting element In a flip chip type light-emitting element of the present invention, an n type contact electrode 14 is formed on an n layer 11 exposed in a comb-tooth shape, a light transmission electrode 15 made of an ITO is formed over the entire surface of a... | 04/03/2012 |
| 8148735 | Optical communication module An infrared data communication module (A1) includes a substrate (1) consisting of a first layer (1A) and a second layer (1B), where the first layer is formed with a recess (11) open at its obverse surface, and includes the opening ... | 04/03/2012 |
| 8138507 | Package for light emitting device A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a s... | 03/20/2012 |
| 8134161 | Package for light emitting device A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the p... | 03/13/2012 |
| 8120043 | Surface mount device The disclosed subject matter is directed to a reliable surface mount device using a ceramic package, and includes LED devices that are simply composed and incorporate the use of the surface mount device. The surface mount device can include a ceramic package, a semi... | 02/21/2012 |
| 8110837 | Sensing module A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically conn... | 02/07/2012 |
| 8106406 | Die package including substrate with molded device A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a sec... | 01/31/2012 |
| 8106407 | Light-emitting device and display device Although an organic resin substrate is highly effective at reducing the weight and improving the shock resistance of a display device, it is required to improve the moisture resistance of the organic resin substrate for the sake of maintaining the reliability of an ... | 01/31/2012 |
