Did You Know...
...that after Walter Hunt patented the safety pin in 1849, he sold the rights to it for $400?
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting re... | 05/15/2007 |
| 7215025 | Wafer scale semiconductor structure A chip scale package structure formed by adhering a glass sheet having a pattern of holes matching a pattern of bond pads on a semiconductor wafer so that the pattern of holes on the glass sheet are over the pattern of bond pads on the semiconductor wafer. Metallize... | 05/08/2007 |
| 7214326 | Increased capacity leadframe and semiconductor package using the same In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers to respective ones of opposed first and second surfaces of a metal p... | 05/08/2007 |
| 7215010 | Device for packing electronic components using injection molding technology A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3... | 05/08/2007 |
| 7214887 | Electronic circuit connecting structure, and its connecting method A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible b... | 05/08/2007 |
| 7215022 | Multi-die module A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die... | 05/08/2007 |
| 7214962 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer The present invention is directed toward apparatus and methods of testing and assembling bumped die and bumped devices using an anisotropically conductive layer. In one embodiment, a semiconductor device comprises a bumped device having a plurality of conductive bum... | 05/08/2007 |
| 7215019 | Semiconductor chip assembly with pillar press-fit into ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electri... | 05/08/2007 |
| 7211900 | Thin semiconductor package including stacked dies A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The cir... | 05/01/2007 |
| 7211451 | Process for producing a component module A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: arranging separated components on a surface-adhesive fil... | 05/01/2007 |
| 7211883 | Semiconductor chip package A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state in which reverse surfaces thereof oppose one another. Therefore, two s... | 05/01/2007 |
| 7211873 | Sensor device having thin membrane and method of manufacturing the same A sensor device for use in an automobile as an airflow sensor is composed of a silicon substrate in which a cavity is formed and a base plate bonded to the silicon substrate. An upper end of the cavity is closed with a thin membrane including a sensor element such a... | 05/01/2007 |
| 7208844 | Semiconductor device A semiconductor device including a substrate having a main surface including a first area, a second area surrounding the first area, and a third area surrounding the second area; a first insulating protective film that is provided in the first area and formed in a s... | 04/24/2007 |
| 7208826 | Semiconductor device and method of manufacturing the same Die pads 50, 51, an external connecting electrode 52 and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporti... | 04/24/2007 |
| 7208828 | Semiconductor package with wire bonded stacked dice and multi-layer metal bumps A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer... | 04/24/2007 |
| 7209360 | Leak-tight system for boxes containing electrical and electronic components The system consists of fixing the printed circuit board (3) to the bottom (1) of the body of the box with the cooperation of a perimetral and spacing flap (6) which creates a chamber (7) under the board (3), in which the components... | 04/24/2007 |
| 7208816 | Electronic circuit device and manufacturing method thereof The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding ... | 04/24/2007 |
| 7208817 | Semiconductor device A semiconductor device has an, improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and... | 04/24/2007 |
| 7205181 | Method of forming hermetic wafer scale integrated circuit structure A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor d... | 04/17/2007 |
| 7205484 | Bonding structure for a hard disk drive suspension using anisotropic conductive film A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in ... | 04/17/2007 |
| 7205635 | Hermetic wafer scale integrated circuit structure A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor d... | 04/17/2007 |
| 7205644 | Memory card structure and manufacturing method thereof A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a... | 04/17/2007 |
| 7205674 | Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package A semiconductor package with build-up layers formed on a chip and a fabrication method of the semiconductor package are provided. A chip with a plurality of conductive bumps formed on bond pads thereof is received within a cavity of a carrier, and a dielectric layer... | 04/17/2007 |
| 7202311 | Phosphine oxide hydroxyarl mixtures with novolac resins for co-curing epoxy resins There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition incl... | 04/10/2007 |
| 7202563 | Semiconductor device package having a semiconductor element with resin A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed ... | 04/10/2007 |
| 7202556 | Semiconductor package having substrate with multi-layer metal bumps A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer... | 04/10/2007 |
| 7201957 | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition incl... | 04/10/2007 |
| 7202561 | Semiconductor package with heat dissipating structure and method of manufacturing the same A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chi... | 04/10/2007 |
| 7202113 | Wafer level bumpless method of making a flip chip mounted semiconductor device package A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact a... | 04/10/2007 |
| 7202571 | Electronic module with form in-place pedestal An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the compon... | 04/10/2007 |
| 7199479 | Chip package structure and process for fabricating the same A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps are formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to... | 04/03/2007 |
| 7198986 | Electronic parts built-in substrate and method of manufacturing the same An electronic parts built-in substrate of the present invention includes a wiring substrate having connecting pads, a first electronic parts a bump of which is flip-chip connected to the connecting pad, a second electronic parts having a larger area than an area of ... | 04/03/2007 |
| 7199453 | Semiconductor package and fabrication method thereof A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bo... | 04/03/2007 |
| 7198969 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 04/03/2007 |
| 7199718 | RFID tag with thermal conductive cover The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and p... | 04/03/2007 |
| 7199470 | Surface-mountable semiconductor component and method for producing it Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip ... | 04/03/2007 |
| 7195940 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 03/27/2007 |
| 7196426 | Multilayered substrate for semiconductor device A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connect... | 03/27/2007 |
| 7193330 | Semiconductor device with improved design freedom of external terminal A semiconductor device comprises: a semiconductor chip; an extension portion which contacts the side surfaces of the semiconductor chip to thereby surround the semiconductor chip; an insulating film which is formed such that a part of each of the plurality of electr... | 03/20/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
