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| Number | Title | Issue Date |
| 4328512 | Two-element semiconductor diode rectifier assembly structure To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two plate-like, series-connected semiconductor diodes are soldered to a common tap electrode between them. An external lead wire is soldered to each o... | 05/04/1982 |
| 4314271 | Two semiconductor diode rectifier structure To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two semiconductor diodes in the shape of small plates or discs are disposed to hold between them a center electrode. A wire-like lead electrode is hel... | 02/02/1982 |
| 4305088 | Semiconductor device including means for alleviating stress caused by different coefficients of thermal expansion of the device components A semiconductor device comprises a heat-radiating electrode plate, a semiconductor element soldered to the depressed portion formed in the heat-radiating electrode plate, a header lead soldered onto the semiconductor element, a terminal board of insulatin... | 12/08/1981 |
| 4293768 | Infrared radiation detecting apparatus and method of manufacturing An infrared radiation sensing device such as a pyroelectric effect device is mounted on one surface of an insulating substrate of alumina ceramic or the like. External connection leads are provided on the insulating substrate. A field effect transistor is... | 10/06/1981 |
| 4282544 | Encapsulated hybrid circuit assembly A hybrid circuit including IC chips and discrete components wherein a substrate is connected to a lead frame and the lead frame is utilized for securing and positioning the substrate during the mounting and electrical connecting of IC chips and discrete c... | 08/04/1981 |
| 4271588 | Process of manufacturing a encapsulated hybrid circuit assembly A hybrid circuit including IC chips and discrete components wherein a substrate is connected to a lead frame and the lead frame is utilized for securing and positioning the substrate during the mounting and electrical connecting of IC chips and discrete c... | 06/09/1981 |
| 4264917 | Flat package for integrated circuit devices According to the present invention, a flat package for at least one integed circuit device having output pads comprises a supporting member for the IC device, a plurality of output terminals external to the package, an array of conductors connecting the ... | 04/28/1981 |
| 4259679 | Display devices A display device comprises a light emitting diode chip mounted on a substrate. To reduce or eliminate reflections from metallic connections to the chip, the metallic parts are electroplated with a light absorbing material.... | 03/31/1981 |
| 4250347 | Method of encapsulating microelectronic elements Method for encapsulating microelectronic elements, starting from strip-like material including a number of interconnected conductor patterns each having a number of leads for the microelectronic element to be encapsulated, which comprises applying a micro... | 02/10/1981 |
| 4218701 | Package for an integrated circuit having a container with support bars An integrated circuit package for an electronic timepiece comprising an integrated circuit holder, a circuit board having an aperture therein and an integrated circuit chip is disclosed. The integrated circuit plastic holder comprises a container, a frame... | 08/19/1980 |
| 4200227 | Key assembly for electronic system A key assembly is provided which includes a support and retainer for a coded electrical circuit which is responsive to short wave radiation for use in security systems which employ the key to open a lock or close a switch for controlling a machine or gain... | 04/29/1980 |
| 4177480 | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads An integrated circuit arrangement comprises a semiconductor body carrying an integrated circuit which is embedded in an insulating material casing together with a plurality of flat strip lines for making electrical connection with the semiconductor body, ... | 12/04/1979 |
| 4157486 | Electroluminescent display and circuit protective device and method of making An electroluminescent display device includes at least two conductive leads spaced from each other with a light-emitting element electrically coupled between such leads. A transparent, insulating base is formed about and between the leads. The base encaps... | 06/05/1979 |
| 4153910 | Molded semiconductor device with header leads Header leads in a molded semiconductor device according to this invention are composed of electrode portions for securing a semiconductor pellet, and lead portions for connection. Each of the electrode portions is constructed of two tabular header portion... | 05/08/1979 |
| 4152624 | Molded LED indicator An LED device of the discrete type having a rectangular light emitting area suited for being arrayed with similar devices in contiguous relationship without optical cross-talk therebetween. An opaque but diffusely reflective housing of the device is molde... | 05/01/1979 |
| 4147889 | Chip carrier An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to... | 04/03/1979 |
| 4143456 | Semiconductor device insulation method A method for applying a protective covering for a semi-conductor device which comprises a circuit board having formed thereon a conductive pattern on which a chip of the semi-conductor device is mounted and electrically connected to said conductive patter... | 03/13/1979 |
| 4093958 | Semiconductor device assembly with improved fatigue resistance A semiconductor diode package which permits improved thermal and mechanical connection in soldered assemblies. Structural features which result in this improvement comprise double contacting studs having tapered end portions and an area somewhat larger th... | 06/06/1978 |
| 4047075 | Encapsulated light-emitting diode structure and array thereof A light-emitting diode including a casing with two flat outer light-emitting opposite parallel sides connected by a curved outer surface.... | 09/06/1977 |
| 4012766 | Semiconductor package and method of manufacture thereof An improved plastic package and method of manufacture thereof for use in packaging integrated circuit semiconductor devices and the like. A transfer molded package having the lead frame disposed therein is formed having an opening therethrough. The device... | 03/15/1977 |
| 4012723 | Magnetic bubble memory packaging arrangement and its method of fabrication Magnetic bubble chips are packaged along with X, Y and Z magnetic field generating means. The package is comprised of a metal lead frame upon which a magnetic bubble chip such as a memory chip device is mounted. Connectors are utilized to connect terminal... | 03/15/1977 |
| 4012769 | Heat sink with parallel flat faces Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device ... | 03/15/1977 |
| 3959874 | Method of forming an integrated circuit assembly A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an in... | 06/01/1976 |
| 3956676 | Electrical device having anode riser assembly with polymeric film means An anode riser assembly for an anode means comprising an anode riser means and polymeric means substantially adhered to the anode riser to minimize the ingression of electrolyte means to the anode riser. The anode riser means is made of a film-forming met... | 05/11/1976 |
| 3956672 | In line rectifier assembly A self-mountable, self-contained and encapsulated rectifier assembly operative to provide a high D.C. voltage at low current while minimizing arcing, corona and other disruptive electrical phenomena.... | 05/11/1976 |
| 3940868 | Fish lure A Light Emitting Diode (L.E.D.) that gives off a monochromatic red light of a frequency that is attractive to fish is attached to a conventional fish hook or lure, along with its power supply battery. A water activated switch can be installed to complete ... | 03/02/1976 |
