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| Number | Title | Issue Date |
| 7166919 | Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package A leadless type resin-sealed semiconductor package includes a resin enveloper having a mounting face to be applied to a wiring board, and at least one side face associated with the mounting face to produce an angled side edge. A semiconductor chip is encapsulated an... | 01/23/2007 |
| 7166926 | Method for producing semiconductor device and semiconductor device The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing meta... | 01/23/2007 |
| 7166906 | Package with barrier wall and method for manufacturing the same A ball grid array (BGA) package that may suppress flash contamination may include a flash contamination barrier wall. The barrier wall may be a portion of a copper pattern provided on a substrate. During a molding process, the flash contamination barrier may prevent... | 01/23/2007 |
| 7166909 | Method and apparatus for molding module electronic devices and a module electronic device molded thereby In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mol... | 01/23/2007 |
| 7164210 | Semiconductor package with heat sink and method for fabricating same A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip car... | 01/16/2007 |
| 7161252 | Module component A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected o... | 01/09/2007 |
| 7161092 | Apparatus and method for protecting an electronic circuit The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle struc... | 01/09/2007 |
| 7161239 | Ball grid array package enhanced with a thermal and electrical connector Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. A substrate has a surface, wherein the surface has an opening therein. A stiffener has a surface coupled to the surface of the substrate. An area of the surface of the s... | 01/09/2007 |
| 7157791 | Semiconductor chip assembly with press-fit ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electri... | 01/02/2007 |
| 7157794 | Semiconductor device that suppresses variations in high frequency characteristics of circuit elements A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first area formed with a high-frequency circuit element and a second area located around the first area and formed with a low-frequency circuit element. The... | 01/02/2007 |
| 7157131 | Prevention of counterfeit markings on semiconductor devices A lidded semiconductor device has a first layer applied to the lid, which first layer is chosen of a material which fluoresces upon application of non-visible electromagnetic waves thereto, for example, ultraviolet light. A second layer is provided over the first la... | 01/02/2007 |
| 7157310 | Methods for packaging microfeature devices and microfeature devices formed by such methods Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate hav... | 01/02/2007 |
| 7157796 | Semiconductor device and the method of producing the same A SiP type semiconductor device and a method of producing the same is provided wherein curvature of a wafer is suppressed in the production steps, workability does not decline, and high throughput can be attained. An insulation layer is formed by stacking a pluralit... | 01/02/2007 |
| 7154168 | Flip chip in leaded molded package and method of manufacture thereof A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to... | 12/26/2006 |
| 7154155 | Wing-shaped surface mount package for light emitting diodes A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboa... | 12/26/2006 |
| 7154189 | Semiconductor device and method for fabricating the same A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the cir... | 12/26/2006 |
| 7154185 | Encapsulation method for SBGA A method for encapsulating an integrated circuit chip is described. An intergrated circuit chip is attached to a substrate; a stress buffering material only covers corners of the integrated circuit chip; and an encapsulation material coats the integated circuit chip... | 12/26/2006 |
| 7151013 | Semiconductor package having exposed heat dissipating surface and method of fabrication A high density semiconductor package with thermally enhanced properties is described. The semiconductor package includes a pair of lead frames, each being attached to a respective semiconductor die. The dies are attached to respective lead frames via an adhering mat... | 12/19/2006 |
| 7151320 | Semiconductor device with improved design freedom of external terminal A semiconductor device comprises: a semiconductor chip having a first main surface, a second main surface, and a plurality of side surfaces; an extension portion which contacts and surrounds the side surfaces of the semiconductor chip; a base, which is capable of co... | 12/19/2006 |
| 7148082 | Method of making a semiconductor chip assembly with a press-fit ground plane A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an o... | 12/12/2006 |
| 7148083 | Transfer mold semiconductor packaging processes In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of open... | 12/12/2006 |
| 7148560 | IC chip package structure and underfill process A novel integrated circuit (IC) chip package structure and underfill process which reduces stress applied to corners of a flip chip in an IC package structure during the application of an adhesive material between the flip chip and a carrier substrate is disclosed. ... | 12/12/2006 |
| 7148578 | Semiconductor multi-chip package A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is ele... | 12/12/2006 |
| 7148126 | Semiconductor device manufacturing method and ring-shaped reinforcing member A ring-shaped reinforcing ring (13) formed of, for example, silicon, is adhered to one surface of a thinly processed semiconductor substrate (11). The reinforcing ring (13) is adhered thereto with an organic adhering material layer (14) f... | 12/12/2006 |
| 7144756 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate Provided are a semiconductor low-K Si die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the low-K Si die and packaging substrate. In general, the modulus of the thermal inte... | 12/05/2006 |
| 7145229 | Silicone metalization A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal... | 12/05/2006 |
| 7145253 | Encapsulated sensor device Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers th... | 12/05/2006 |
| 7145416 | Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device A resonator device includes a resonator supported by a substrate as a base. The resonator is connected to a wire extending from the substrate by wire bonding so as to be suspended in midair and supported over the supporting substrate. ... | 12/05/2006 |
| 7144517 | Manufacturing method for leadframe and for semiconductor package using the leadframe In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads ... | 12/05/2006 |
| 7141454 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating po... | 11/28/2006 |
| 7141879 | Semiconductor device There is described an improved semiconductor device of chip-scale package (CSP) comprising posts provided on respective electrode pads of a semiconductor chip, and solder balls which are provided on the respective posts as external terminals after the semiconductor ... | 11/28/2006 |
| 7142822 | Package device for accommodating a radio frequency circuit A compact package whose inner walls can be located near a radio frequency circuit without changing the characteristics of the radio frequency circuit has a planar circuit on the bottom of the package, which is enclosed with metal walls. A high impedance plate is for... | 11/28/2006 |
| 7138724 | Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured with corresponding contact ar... | 11/21/2006 |
| 7138300 | Structural design for flip-chip assembly An integrated circuit package comprises a semiconductor die located on a substrate in a flip-chip configuration, an encapsulant layer overlying the non-active surface of the semiconductor die and at least a portion of the surface of the substrate adjacent the die, a... | 11/21/2006 |
| 7138583 | Method and apparatus for maintaining a separation between contacts Methods and apparatus for controlling the distance between contact pads or leads which are to be interfaced are disclosed. According to one aspect of the present invention, an electrical package includes a body and a contact. The body includes electrical circuitry s... | 11/21/2006 |
| 7138673 | Semiconductor package having encapsulated chip attached to a mounting plate In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that a bottom surface of the semiconductor chip is in contact with the pl... | 11/21/2006 |
| 7138706 | Semiconductor device and method for manufacturing the same A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includ... | 11/21/2006 |
| 7135770 | Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 11/14/2006 |
| 7135768 | Hermetic seal Ultrasonically formed seals, their use in semiconductor packages, and methods of fabricating semiconductor packages. A brittle center member (such as glass) has a molded edge member. That edge member is ultrasonically welded to a body. The molded edge member and bod... | 11/14/2006 |
| 7135356 | Semiconductor device and method of producing a high contrast identification mark A seconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with... | 11/14/2006 |
