Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 8030782 | Metal-metal bonding of compliant interconnect Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substr... | 10/04/2011 |
| 7884489 | Press-fit integrated circuit package involving compressed spring contact beams An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a spring contact beam portion. The leadframe is attached to the substra... | 02/08/2011 |
| 7755206 | Pad structure to provide improved stress relief A semiconductor interconnection comprises a semiconductor device, a substrate adjacent the semiconductor device, and a plurality of spring contacts on the semiconductor device or the substrate. A plurality of solder connections are on the opposite semiconductor devi... | 07/13/2010 |
| 7750487 | Metal-metal bonding of compliant interconnect Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substr... | 07/06/2010 |
| 7683494 | Press-fit integrated circuit package involving compressed spring contact beams An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a spring contact beam portion. The leadframe is attached to the substra... | 03/23/2010 |
| 7582975 | Nanowire device and method of making the same A nanowire device includes a nanowire formed between two surfaces, and a gap formed at a predetermined location in the nanowire. ... | 09/01/2009 |
| 7518251 | Stacked electronics for sensors A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a first electronic device disposed on the front side of the first substrate... | 04/14/2009 |
| 7459795 | Method to build a wirebond probe card in a many at a time fashion Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a spa... | 12/02/2008 |
| 7453157 | Microelectronic packages and methods therefor A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the... | 11/18/2008 |
| 7408119 | Electrical interconnection for high-frequency devices Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corre... | 08/05/2008 |
| 7405419 | Unidirectionally conductive materials for interconnection A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as b... | 07/29/2008 |
| 7400041 | Compliant multi-composition interconnects A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein. ... | 07/15/2008 |
| 7394163 | Method of mounting semiconductor chip A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC ch... | 07/01/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7362641 | Method and system for low power refresh of dynamic random access memories A method and system for operating a DRAM device in either a high power, full density mode or a low power, half density mode. In the full density mode, each data bit is stored in a single memory cell, and, in the half density mode, each data bit is stored in two memo... | 04/22/2008 |
| 7358118 | Mounting method of flexible printed circuit and manufacturing method of electric optical device Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor elements and first terminal portions for electrically connecting the sem... | 04/15/2008 |
| 7348669 | Bump structure of semiconductor device and method of manufacturing the same In connection with a bump of a semiconductor device and a manufacturing method thereof, a groove is formed in a bump pad region of a semiconductor substrate. An under bump metal layer is then formed in the groove, and a lower end portion of the bump fills the groove... | 03/25/2008 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a ... | 03/04/2008 |
| 7339273 | Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A semiconductor substrate is etched to form a via hole from a back surfac... | 03/04/2008 |
| 7335979 | Device and method for tilted land grid array interconnects on a coreless substrate package An article of manufacture and system, as well as fabrication methods therefore, may include a plurality of lands disposed on a surface of a substrate wherein the lands are oriented at an angle to the surface of the substrate and further wherein the substrate is form... | 02/26/2008 |
| 7327030 | Apparatus and method incorporating discrete passive components in an electronic package An apparatus and method for incorporating discrete passive components into an integrated circuit package. A metal layer is formed over a surface of a substrate. A layer of photosensitive material is then formed over the metal layer. Using standard photolithographic ... | 02/05/2008 |
| 7323363 | Contact load profile modification for a compression socketed CPU A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware conta... | 01/29/2008 |
| 7304381 | Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached t... | 12/04/2007 |
| 7301773 | Semi-compliant joining mechanism for semiconductor cooling applications A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a v... | 11/27/2007 |
| 7298031 | Multiple substrate microelectronic devices and methods of manufacture A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate adhesive material. For example, each microelectronic substrate can include a first surface, a second surf... | 11/20/2007 |
| 7294919 | Device having a complaint element pressed between substrates A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a s... | 11/13/2007 |
| 7288729 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/30/2007 |
| 7288833 | Stress-free lead frame The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (... | 10/30/2007 |
| 7285734 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/23/2007 |
| 7282800 | Semiconductor device and method of manufacturing the same The present invention provides a semiconductor device capable of improving productivity while maintaining electrical characteristics, and a manufacturing method thereof. One characteristic point of the present invention is that a plating processing condition (A) for... | 10/16/2007 |
| 7279358 | Mounting method and mounting device A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclo... | 10/09/2007 |
| 7275130 | Method and system for dynamically operating memory in a power-saving error correcting mode A scrubbing controller used with a DRAM stores data in an error correcting code format. The system then uses a memory control state machine and associated timer to periodically cause the DRAM to read the error correcting codes. An ECC generator/checker in the scrubb... | 09/25/2007 |
| 7271491 | Carrier for wafer-scale package and wafer-scale package including the carrier A carrier for use in a chip-scale package, including a semiconductor substrate, such as a semiconductor wafer, with a plurality of apertures formed therethrough. The present invention also includes a chip-scale package including the carrier. When the carrier is empl... | 09/18/2007 |
| 7267861 | Solder joints for copper metallization having reduced interfacial voids A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, w... | 09/11/2007 |
| 7264485 | Power connectors and contacts The present invention relates to electrical connectors, and, in particular, to power connectors and to improved contact structures and methods related thereto. ... | 09/04/2007 |
| 7256069 | Wafer-level package and methods of fabricating A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantial... | 08/14/2007 |
| 7253527 | Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device A semiconductor chip production method including the steps of: forming a front side recess in a semiconductor substrate; depositing a metal material in the front side recess to form a front side electrode electrically connected to a functional device formed on the f... | 08/07/2007 |
| 7239027 | Bonding structure of device packaging A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second substrate whose surfaces have a second bonding layer and electrodes. The ... | 07/03/2007 |
| 7235873 | Protective device for subassemblies and method for producing a protective device A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space betwe... | 06/26/2007 |
| 7230821 | Housing for an electronic control device in vehicles A housing for a control device in vehicles is provided. The housing satisfies the requirements of acceleration transmission and reliable ground connection with a simple and inexpensive construction. The housing comprises a metallic shell that has parallel top and bo... | 06/12/2007 |
